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STB11NM80T4

STMicroelectronics

STB11NM80T4 by STMicroelectronics

STB11NM80T4 by STMicroelectronics is a N-CHANNEL FET with 800V DS Breakdown Voltage, ideal for SWITCHING applications. It features 44A Max Pulsed Drain Current and 0.4 ohm Max Drain-Source On Resistance. The transistor operates in ENHANCEMENT MODE and has a max power dissipation of 205W, making it suitable for high-power applications.

Median Price

$3.935

Lifecycle Status

Suppliers In-Stock

26

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,402 parts In-Stock

1+ parts

$8.700

100+ parts

$4.350

1k+ parts

$4.060

10k+ parts

-

1,402

$8.700

$4.350

$4.060

-

DigiKey

USA . 786 parts In-Stock

1+ parts

$8.700

100+ parts

$4.347

1k+ parts

$4.286

10k+ parts

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786

$8.700

$4.347

$4.286

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Avnet

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

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EBV Elektronik

Germany . 8,000 parts In-Stock

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8,000

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Arrow

USA . 3,000 parts In-Stock

1+ parts

-

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$2.912

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3,000

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-

$2.912

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Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

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$2.922

10k+ parts

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3,000

-

-

$2.922

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Future Electronics

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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$4.670

10k+ parts

-

2,000

-

-

$4.670

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Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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$3.200

10k+ parts

-

2,000

-

-

$3.200

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 9,961 parts In-Stock

1+ parts

$2.731

100+ parts

$2.601

1k+ parts

$2.477

10k+ parts

$2.236

9,961

$2.731

$2.601

$2.477

$2.236

Nova Conductors

Japan . 48 parts In-Stock

1+ parts

$4.717

100+ parts

-

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-

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48

$4.717

-

-

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Digiode

USA . 4,265 parts In-Stock

1+ parts

$6.526

100+ parts

-

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-

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4,265

$6.526

-

-

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Kruse Electronics AG

Switzerland . 25,000 parts In-Stock

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Kruse

Germany . 25,000 parts In-Stock

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Chip Stock

USA . 22,827 parts In-Stock

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22,827

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SIE Connect GmbH - GreenChips

Germany . 12,353 parts In-Stock

1+ parts

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12,353

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ComSIT Distribution GmbH

Germany . 10,500 parts In-Stock

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10,500

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ComSIT USA

USA . 10,500 parts In-Stock

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10,500

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Vyrian

USA . 4,025 parts In-Stock

1+ parts

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4,025

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-

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

-

-

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IBS Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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$6.550

10k+ parts

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1,000

-

-

$6.550

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Anansix

USA . 165 parts In-Stock

1+ parts

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165

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LIBRA Elektronik GmbH

Germany . 60 parts In-Stock

1+ parts

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60

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North Shore Components

USA . 32 parts In-Stock

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32

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Prism Electronics

USA . 26 parts In-Stock

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26

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

1+ parts

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5

-

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Holdelec - ElecDif-Pro

France . 5 parts In-Stock

1+ parts

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 211 parts In-Stock

1+ parts

$0.340

100+ parts

-

1k+ parts

-

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211

$0.340

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IDEA Electronic Components Group

UK . 615 parts In-Stock

1+ parts

$0.557

100+ parts

-

1k+ parts

$0.501

10k+ parts

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615

$0.557

-

$0.501

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MKK Technologies

India . 2,182 parts In-Stock

1+ parts

$1.047

100+ parts

-

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2,182

$1.047

-

-

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DigiPath Technology Company

USA . 2,182 parts In-Stock

1+ parts

$1.047

100+ parts

-

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2,182

$1.047

-

-

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Corohmni

South Africa . 493 parts In-Stock

1+ parts

$1.684

100+ parts

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493

$1.684

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Semicontronic

India . 5,859 parts In-Stock

1+ parts

$2.720

100+ parts

$2.652

1k+ parts

$2.638

10k+ parts

-

5,859

$2.720

$2.652

$2.638

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Ampacity Inc.

Singapore . 2,422 parts In-Stock

1+ parts

$2.720

100+ parts

-

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-

10k+ parts

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2,422

$2.720

-

-

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Continental Prestige Electronics

USA . 5,630 parts In-Stock

1+ parts

$4.717

100+ parts

-

1k+ parts

-

10k+ parts

$4.622

5,630

$4.717

-

-

$4.622

Bastille Electronics

Australia . 259 parts In-Stock

1+ parts

$4.717

100+ parts

$4.481

1k+ parts

$4.257

10k+ parts

$4.198

259

$4.717

$4.481

$4.257

$4.198

Corphita

USA . 3,167 parts In-Stock

1+ parts

$6.183

100+ parts

-

1k+ parts

-

10k+ parts

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3,167

$6.183

-

-

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Microchip USA

USA . 4,583 parts In-Stock

1+ parts

$29.266

100+ parts

-

1k+ parts

-

10k+ parts

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4,583

$29.266

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Metaverse IC Inc.

Canada . 63,259 parts In-Stock

1+ parts

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63,259

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Perfect Parts

USA . 32,418 parts In-Stock

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32,418

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QUARKTWIN TECHNOLOGY LTD

USA . 18,833 parts In-Stock

1+ parts

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18,833

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Lixinc

USA . 6,044 parts In-Stock

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6,044

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Alle Elektronik GmbH

Germany . 3,735 parts In-Stock

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3,735

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-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

-

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A-Z Elektronik GmbH

Germany . 1,749 parts In-Stock

1+ parts

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1,749

-

-

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Argo Parts USA

USA . 1,184 parts In-Stock

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1,184

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-

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Epart123

USA . 1,000 parts In-Stock

1+ parts

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1,000

-

-

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

1+ parts

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1,000

-

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GreenTree Electronics

Israel . 1,000 parts In-Stock

1+ parts

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1,000

-

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Parana Technologies

USA . 954 parts In-Stock

1+ parts

-

100+ parts

$0.666

1k+ parts

-

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954

-

$0.666

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Overview

Experience unmatched performance and reliability with the STB11NM80T4 Power Field Effect Transistor by STMicroelectronics. Crafted with precision using cutting-edge technology, this N-CHANNEL transistor is ideal for a wide range of switching applications. With a maximum drain current of 11A and a breakdown voltage of 800V, this transistor ensures efficient operation and superior durability. Whether you're looking to enhance your power management system or streamline your electronic devices, the STB11NM80T4 delivers value, benefits, and advantages that exceed expectations. Choose quality, choose STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring longevity and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL type provides efficient conduction and allows for higher power handling capabilities, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects the transistor from reverse current flow, enhancing the overall performance and reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic circuits.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage allows the transistor to handle high voltage levels safely, making it suitable for power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

Rectangular shape provides compactness and easy mounting on PCBs, optimizing space utilization in electronic designs.

Terminal Form: GULL WING

Gull wing terminals offer strong mechanical connection with PCB pads, ensuring reliability and stability in operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides better control over the switching characteristics, allowing for precise modulation of power flow in the circuit.

Maximum Pulsed Drain Current (IDM): 44 A

High pulsed drain current rating enables the transistor to handle short-term peak loads without compromising performance or reliability.

Maximum Drain Current (Abs) (ID): 11 A

Sufficient continuous drain current capability ensures stable operation under normal load conditions, making it suitable for a wide range of applications.

No. of Terminals: 2

Two terminals simplify the connection process and reduce complexity in circuit designs, enhancing ease of use and reliability.

Maximum Power Dissipation (Abs): 205 W

High power dissipation capability allows the transistor to handle high power levels effectively, ensuring stable performance in demanding applications.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic designs where size constraints are a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and fast switching speeds, making the transistor ideal for power applications that require quick response times.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon material provides high conductivity and stability, ensuring consistent performance and durability of the transistor in various operating conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and ensures strong solder joints, improving the overall reliability and longevity of the product.

Maximum Drain-Source On Resistance: 0.4 ohm

Low drain-source on resistance minimizes power losses and increases efficiency, making the transistor suitable for high-power applications where energy efficiency is crucial.

Terminal Position: SINGLE

Single terminal position simplifies wiring and connections, reducing the chances of errors and enhancing the overall reliability of the product.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures the product can withstand the soldering process without damage, making it suitable for automated assembly processes.

Technical Specifications

Power Field Effect Transistors (FET) STB11NM80T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB11NM80T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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