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STB140NF55T4

STMicroelectronics

STB140NF55T4 by STMicroelectronics

STB140NF55T4 by STMicroelectronics is a N-CHANNEL FET with 55V DS breakdown voltage and 320A IDM. Ideal for switching applications, it features 0.008 ohm max RDS(on) and 175°C max operating temp. Suitable for surface mount, this MOSFET has a built-in diode and can handle up to 80A drain current.

Median Price

$2.200

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Chip1Stop

Japan . 887 parts In-Stock

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$2.200

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887

$2.200

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Mouser Electronics

USA . 1,948 parts In-Stock

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$3.490

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$1.600

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$1.170

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1,948

$3.490

$1.600

$1.170

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DigiKey

USA . 1,494 parts In-Stock

1+ parts

$3.630

100+ parts

$1.648

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$1.340

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1,494

$3.630

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$1.340

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Avnet

USA . 16,000 parts In-Stock

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Arrow

USA . 2,000 parts In-Stock

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$0.886

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$0.836

2,000

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$0.886

$0.836

Verical

USA . 2,000 parts In-Stock

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$0.881

10k+ parts

$0.831

2,000

-

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$0.881

$0.831

Distributors (In-Stock)

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Digiode

USA . 1,991 parts In-Stock

1+ parts

$2.090

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$2.090

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Nova Conductors

Japan . 870 parts In-Stock

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$2.277

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870

$2.277

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Sensible Micro Corp

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 1,943 parts In-Stock

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Vyrian

USA . 1,357 parts In-Stock

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1,357

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Schukat

Germany . 965 parts In-Stock

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$1.009

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$0.965

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965

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$1.009

$0.965

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ComSIT Distribution GmbH

Germany . 705 parts In-Stock

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R&J Components

USA . 100 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 831 parts In-Stock

1+ parts

$0.310

100+ parts

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$0.279

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831

$0.310

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$0.279

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MKK Technologies

India . 23 parts In-Stock

1+ parts

$0.583

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23

$0.583

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DigiPath Technology Company

USA . 23 parts In-Stock

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$0.583

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23

$0.583

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Ampacity Inc.

Singapore . 1,106 parts In-Stock

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$0.950

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$0.950

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Semicontronic

India . 2,042 parts In-Stock

1+ parts

$1.120

100+ parts

$1.092

1k+ parts

$1.086

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2,042

$1.120

$1.092

$1.086

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$1.593

100+ parts

$1.450

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$1.306

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20

$1.593

$1.450

$1.306

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Corphita

USA . 3,409 parts In-Stock

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$1.980

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$1.980

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Aranea Global

USA . 100 parts In-Stock

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$2.231

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$2.142

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Argo Parts USA

USA . 3,253 parts In-Stock

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$2.277

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Continental Prestige Electronics

USA . 144 parts In-Stock

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$2.277

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$2.231

144

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Microchip USA

USA . 8,688 parts In-Stock

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$12.701

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Perfect Parts

USA . 37,527 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,632 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,786 parts In-Stock

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Lixinc

USA . 5,378 parts In-Stock

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Parana Technologies

USA . 1,243 parts In-Stock

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$0.371

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$0.371

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Kepictronics

USA . 926 parts In-Stock

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926

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Overview

Experience unmatched power and reliability with the STB140NF55T4 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors for various applications, including switching. With a maximum Drain Current of 80A and an On Resistance of 0.008 ohm, this N-Channel transistor offers exceptional performance and efficiency. Trust STMicroelectronics to provide cutting-edge technology that meets your power needs while ensuring durability and value. Elevate your projects with the STB140NF55T4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a popular choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can provide protection against reverse current flow, enhancing the overall functionality of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient and fast operation for various electronic circuits.

Surface Mount: YES

Being surface mountable allows for easy and compact installation on PCBs, saving space and potentially reducing manufacturing costs.

Minimum DS Breakdown Voltage: 55 V

With a minimum breakdown voltage of 55 V, the FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current rating allows for handling short-term high current loads, making the FET suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 80 A

With a high maximum drain current rating of 80 A, the FET can handle significant current loads without overheating or malfunctioning.

Maximum Power Dissipation (Abs): 300 W

The high power dissipation capability of 300 W ensures the FET can handle high-power applications without getting damaged.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows the FET to operate reliably in a wide range of temperature environments.

Maximum Drain-Source On Resistance: 0.008 ohm

The low drain-source on resistance of 0.008 ohms ensures minimal power loss and efficient operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) STB140NF55T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1.3 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB140NF55T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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