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STB12NM50T4

STMicroelectronics

STB12NM50T4 by STMicroelectronics

STB12NM50T4 by STMicroelectronics is a N-CHANNEL FET with 500V DS breakdown voltage, 48A IDM, and 0.35 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with 160W max power dissipation. Suitable for surface mount assembly, it has a max operating temperature of 150°C.

Median Price

$4.310

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 181 parts In-Stock

1+ parts

$4.310

100+ parts

$2.560

1k+ parts

$1.900

10k+ parts

-

181

$4.310

$2.560

$1.900

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Newark

USA . 25 parts In-Stock

1+ parts

$5.580

100+ parts

$2.670

1k+ parts

$2.170

10k+ parts

-

25

$5.580

$2.670

$2.170

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DigiKey

USA . 832 parts In-Stock

1+ parts

$5.880

100+ parts

$2.812

1k+ parts

$2.546

10k+ parts

-

832

$5.880

$2.812

$2.546

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Mouser Electronics

USA . 1,427 parts In-Stock

1+ parts

$6.140

100+ parts

$2.960

1k+ parts

$2.330

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1,427

$6.140

$2.960

$2.330

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Avnet

USA . 5,000 parts In-Stock

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5,000

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Arrow

USA . 2,000 parts In-Stock

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-

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$4.006

10k+ parts

$3.835

2,000

-

-

$4.006

$3.835

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.918

10k+ parts

$1.840

2,000

-

-

$1.918

$1.840

EBV Elektronik

Germany . 1,000 parts In-Stock

1+ parts

-

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1,000

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-

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Element14

Singapore . 181 parts In-Stock

1+ parts

-

100+ parts

$4.300

1k+ parts

$3.210

10k+ parts

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181

-

$4.300

$3.210

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,544 parts In-Stock

1+ parts

$1.976

100+ parts

-

1k+ parts

-

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4,544

$1.976

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.660

100+ parts

-

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50

$2.660

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-

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Legend Electronics Inc.

USA . 26,471 parts In-Stock

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26,471

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Vyrian

USA . 4,553 parts In-Stock

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4,553

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Chip Stock

USA . 4,180 parts In-Stock

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4,180

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Anansix

USA . 2,490 parts In-Stock

1+ parts

-

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2,490

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-

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TME

Poland . 2,000 parts In-Stock

1+ parts

-

100+ parts

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$1.720

10k+ parts

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2,000

-

-

$1.720

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

-

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1,000

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Euro-Tech

UK . 645 parts In-Stock

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645

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Connector Distribution Corp

USA . 406 parts In-Stock

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406

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Right Parts Inc.

USA . 406 parts In-Stock

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406

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Bristol Electronics

USA . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 111 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

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10k+ parts

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111

$0.710

-

-

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Corohmni

South Africa . 1,049 parts In-Stock

1+ parts

$0.742

100+ parts

-

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-

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1,049

$0.742

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IDEA Electronic Components Group

UK . 1,681 parts In-Stock

1+ parts

$0.794

100+ parts

-

1k+ parts

$0.715

10k+ parts

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1,681

$0.794

-

$0.715

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MKK Technologies

India . 1,260 parts In-Stock

1+ parts

$1.493

100+ parts

-

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1,260

$1.493

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DigiPath Technology Company

USA . 1,260 parts In-Stock

1+ parts

$1.493

100+ parts

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1,260

$1.493

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Ampacity Inc.

Singapore . 5,154 parts In-Stock

1+ parts

$1.770

100+ parts

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5,154

$1.770

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Corphita

USA . 3,848 parts In-Stock

1+ parts

$1.872

100+ parts

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3,848

$1.872

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Bastille Electronics

Australia . 450 parts In-Stock

1+ parts

$2.660

100+ parts

$2.527

1k+ parts

$2.401

10k+ parts

$2.367

450

$2.660

$2.527

$2.401

$2.367

Continental Prestige Electronics

USA . 2,034 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

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10k+ parts

$2.607

2,034

$2.660

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-

$2.607

Argo Parts USA

USA . 1,859 parts In-Stock

1+ parts

$2.660

100+ parts

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1,859

$2.660

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Semicontronic

India . 1,997 parts In-Stock

1+ parts

$4.770

100+ parts

$4.651

1k+ parts

$4.627

10k+ parts

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1,997

$4.770

$4.651

$4.627

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Microchip USA

USA . 9,311 parts In-Stock

1+ parts

$15.898

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9,311

$15.898

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Kepictronics

USA . 15,320 parts In-Stock

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15,320

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Perfect Parts

USA . 12,320 parts In-Stock

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12,320

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RC Electronics

USA . 10,377 parts In-Stock

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10,377

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,028 parts In-Stock

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5,028

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Epart123

USA . 5,000 parts In-Stock

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5,000

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,821 parts In-Stock

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4,821

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Lixinc

USA . 4,308 parts In-Stock

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4,308

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Parana Technologies

USA . 1,220 parts In-Stock

1+ parts

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$0.949

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1,220

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$0.949

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iodParts Technologies Inc.

India . 1,000 parts In-Stock

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1,000

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Assy Fe

Spain . 388 parts In-Stock

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388

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Speed Components Ltd (Excess)

Israel . 170 parts In-Stock

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170

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Overview

Discover the unmatched quality and reliability of the STB12NM50T4 by STMicroelectronics, a leading manufacturer in the industry. This N-CHANNEL Power Field Effect Transistor is perfect for switching applications, offering a high breakdown voltage of 500V and a maximum pulsed drain current of 48A. With a package body material of PLASTIC/EPOXY and a small outline design, this transistor provides exceptional performance with a maximum power dissipation of 160W. Trust STMicroelectronics to deliver cutting-edge technology and maximize efficiency in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and thermal stability, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient switching performance, enhancing overall system efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making it a convenient choice for compact applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and fast response times.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, making installation straightforward and efficient.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into existing designs.

Terminal Form: GULL WING

The gull wing terminals provide strong mechanical support and secure connections, improving overall reliability.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control and low on-resistance, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 48 A

With a high pulsed drain current rating, this FET can handle sudden surges in power without issue.

Avalanche Energy Rating (EAS): 400 mJ

The high avalanche energy rating ensures reliable performance under high stress conditions.

Maximum Drain Current (Abs) (ID): 12 A

With a high drain current rating, this FET can handle high current loads with ease.

No. of Terminals: 2

The two terminal design simplifies circuit connectivity and reduces complexity in design.

Maximum Power Dissipation (Abs): 160 W

The high power dissipation rating ensures stable performance even under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This advanced technology offers low on-resistance and fast switching speeds.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon material offers high reliability and consistent performance over time.

Minimum Operating Temperature: -65 °C

With a low minimum operating temperature, this FET can operate in extreme cold conditions without issue.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Maximum Drain Current (ID): 12 A

With a high drain current rating, this FET can handle heavy loads with ease.

Maximum Drain-Source On Resistance: 0.35 ohm

The low on-resistance ensures minimal power loss and efficient operation.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and reduces complexity during installation.

Maximum Time At Peak Reflow Temperature (s): 30

With a short reflow time, this FET can be quickly and easily integrated into circuit boards.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for reliable soldering and secure connections.

Technical Specifications

Power Field Effect Transistors (FET) STB12NM50T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.35 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-65 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB12NM50T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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