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ST72F561R9TCTR

STMicroelectronics

ST72F561R9TCTR by STMicroelectronics

ST72F561R9TCTR by STMicroelectronics is an 8-bit microcontroller with 61440 ROM words, 2048 RAM bytes, and 48 I/O lines. It operates at a max clock frequency of 16 MHz and is ideal for automotive applications due to its temperature grade.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,763 parts In-Stock

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8,763

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Digiode

USA . 2,899 parts In-Stock

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2,899

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Anansix

USA . 2,190 parts In-Stock

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2,190

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 777 parts In-Stock

1+ parts

$6.300

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777

$6.300

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Ampacity Inc.

Singapore . 350 parts In-Stock

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$14.000

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350

$14.000

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IDEA Electronic Components Group

UK . 517 parts In-Stock

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$57.082

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$51.374

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517

$57.082

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$51.374

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MKK Technologies

India . 926 parts In-Stock

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$107.340

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926

$107.340

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DigiPath Technology Company

USA . 926 parts In-Stock

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$107.340

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926

$107.340

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Corphita

USA . 2,658 parts In-Stock

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Microchip USA

USA . 2,475 parts In-Stock

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2,475

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Parana Technologies

USA . 2,127 parts In-Stock

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$68.251

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$68.251

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Vigor

Singapore . 1,082 parts In-Stock

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1,082

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unleash the power of innovation with the ST72F561R9TCTR microcontroller by STMicroelectronics. Designed with precision and reliability in mind, this high-quality product offers endless possibilities for your applications. From automotive to industrial control systems, this microcontroller delivers unparalleled performance and efficiency. Elevate your projects and unlock new opportunities with the ST72F561R9TCTR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between sturdiness and cost-effectiveness, making the product durable and affordable.

Surface Mount: YES

Surface mount technology allows for compact and reliable circuit designs, saving space and improving performance.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage ensures compatibility with various power sources and prevents damage from voltage spikes.

Package Shape: SQUARE

The square shape makes the package easy to handle and mount on a circuit board, simplifying the assembly process.

Bit Size: 8

The 8-bit architecture allows for efficient data processing and control, suitable for a wide range of applications.

Power Supplies (V): 5

Operating at 5 volts makes the product compatible with standard voltage levels, ensuring widespread usability.

No. of Terminals: 64

Having 64 terminals offers flexibility in I/O configurations, enabling complex connectivity options for diverse functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design saves space in compact devices while providing efficient heat dissipation for improved reliability.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures stable operation even in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, suitable for demanding applications.

CPU Family: ST72

Belonging to the ST72 CPU family signifies reliability, performance, and compatibility with a range of STMicroelectronics products and tools.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125°C ensures reliable operation in both extreme cold and hot environments.

ADC Channels: YES

Having ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and external devices for accurate input processing.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections, contributing to a clean and organized PCB layout.

ROM Words: 61440

With a large ROM capacity of 61440 words, the product can store significant program code and data, facilitating complex operations.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm enables slim and compact device designs, ideal for space-constrained applications.

Width: 14 mm

The moderate width of 14 mm allows for easy integration into standard PCB layouts, ensuring compatibility with industry norms.

Maximum Clock Frequency: 16 MHz

Operating at a maximum clock frequency of 16 MHz provides fast processing speeds, enhancing overall system performance.

Length: 14 mm

The compact length of 14 mm contributes to a space-efficient footprint, making the product suitable for small form factor designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets stringent temperature and reliability requirements for automotive electronics.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product combines CPU, memory, and I/O interfaces in a single chip, offering a cost-effective solution for embedded systems.

RAM Bytes: 2048

With 2048 bytes of RAM, the product provides sufficient memory for data storage and processing, supporting multitasking and data-intensive applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with modern digital systems, improving efficiency and performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and rework processes, enhancing reliability and ease of assembly.

Maximum Supply Current: 15 mA

Operating at a maximum supply current of 15 mA minimizes power consumption, prolonging battery life and reducing operating costs.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 volts ensures stable and consistent operation, meeting standard voltage requirements for reliable performance.

PWM Channels: YES

Having PWM channels allows for precise control of analog signals, enabling efficient motor control, dimming, and other applications requiring variable output.

ROM Programmability: MROM

The MROM programability ensures secure and permanent storage of firmware and software, preventing unauthorized access or tampering of critical data.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm enables high-density mounting on PCBs, optimizing board space and facilitating complex circuit designs.

Speed: 8 rpm

Operating at a speed of 8 rpm ensures efficient data processing and control, meeting the performance requirements of various applications.

No. of I/O Lines: 48

Having 48 I/O lines provides extensive connectivity options for interfacing with external devices, sensors, and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers ST72F561R9TCTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

61440

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST72F561R9TCTR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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