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ST72F324BJ4T6

STMicroelectronics

ST72F324BJ4T6 by STMicroelectronics

ST72F324BJ4T6 microcontroller from STMicroelectronics features a 5V supply, 16 MHz clock, and 44 terminals. It operates in extreme temperatures (-40 °C to 85 °C) and includes ADC channels for versatile applications in industrial control systems. Ideal for low-profile designs with robust connectivity options.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 13,960 parts In-Stock

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Vyrian

USA . 6,197 parts In-Stock

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Digiode

USA . 3,411 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,920 parts In-Stock

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Anansix

USA . 809 parts In-Stock

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$20.240

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$20.240

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Microchip USA

USA . 2,478 parts In-Stock

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$21.875

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IDEA Electronic Components Group

UK . 2,328 parts In-Stock

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$51.999

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$46.799

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$51.999

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$46.799

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MKK Technologies

India . 299 parts In-Stock

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$97.781

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299

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DigiPath Technology Company

USA . 299 parts In-Stock

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$97.781

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299

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Component Stockers USA

USA . 730 parts In-Stock

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$99.990

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Kepictronics

USA . 5,600 parts In-Stock

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RC Electronics

USA . 3,680 parts In-Stock

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Corphita

USA . 2,974 parts In-Stock

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Vigor

Singapore . 2,816 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,860 parts In-Stock

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Assy Fe

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Perfect Parts

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Parana Technologies

USA . 658 parts In-Stock

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ChipstoGo Electronic ltd

UK . 47 parts In-Stock

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Overview

Unlock your project's potential with the ST72F324BJ4T6 microcontroller from STMicroelectronics — a leader in innovation and quality. This versatile, low-profile solution offers exceptional performance for a wide range of applications, from industrial automation to consumer electronics. Experience reliability and efficiency with its robust features, ensuring seamless connectivity and precision control. Elevate your design with a trusted partner that delivers unmatched value and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates easier and more compact PCB design, allowing for efficient use of board space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in system design and compatibility with standard power supplies.

Package Shape: SQUARE

The square package shape allows for uniform thermal distribution and efficient space utilization on PCBs.

Bit Size: 8

An 8-bit architecture is suitable for simpler applications requiring less processing power, providing efficiency in operation.

Power Supplies (V): 5

Operating at a nominal voltage of 5 V ensures compatibility with many existing electronic systems.

No. of Terminals: 44

With 44 terminals, this microcontroller supports a wide array of peripheral connectivity and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design reduces height constraints in tight spaces, making it suitable for compact devices.

Minimum Supply Voltage: 3.8 V

The ability to operate at a minimum supply voltage of 3.8 V extends usable range and battery life for portable applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C supports industrial applications where components may be subjected to higher temperatures.

CPU Family: ST72

Being part of the ST72 family means proven reliability and performance for embedded applications.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures of -40 °C makes this microcontroller suitable for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

The annealed matte tin finish helps to prevent corrosion and enhances solderability during assembly.

ADC Channels: YES

Integrated ADC channels enable direct interfacing with analog sensors, providing versatility for various applications.

Terminal Position: QUAD

Quad terminal positioning allows for effective circuit board routing and reduces design complexity.

ROM Words: 16384

With 16,384 ROM words, ample memory is available for storing complex programs and routines.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm is advantageous for space-constrained applications, enabling a flat design profile.

Width: 10 mm

The compact width of 10 mm is ideal for modern electronics requiring tighter layouts.

Peripherals: POR, TIMER(4)

Integrated peripherals including Power-On Reset and multiple timers enhance functionality for task management.

Maximum Clock Frequency: 16 MHz

A 16 MHz clock frequency offers sufficient processing power for most general applications, balancing performance and power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures that the microcontroller can withstand the solder reflow process without damage, contributing to manufacturing reliability.

Peak Reflow Temperature: 260 °C

Able to endure high reflow temperatures, this model is suited for modern surface mount assembly techniques.

Length: 10 mm

The 10 mm length is also conducive to miniaturized designs, allowing integration into compact devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robustness and reliability in challenging operational environments.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is designed to manage various tasks and control operations effectively in embedded applications.

RAM Bytes: 512

512 bytes of RAM provides space for variable storage during execution, aiding in performance for moderately complex tasks.

Technology: CMOS

CMOS technology enhances power efficiency and performance, which is critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics, improving manufacturability and reliability.

Analog To Digital Converters: 12-Ch 10-Bit

With 12 channels and 10-bit resolution, the ADC can accurately convert multiple analog signals simultaneously, ideal for data acquisition.

Maximum Supply Current: 5.5 mA

A low maximum supply current of 5.5 mA contributes to energy efficiency, which is important for portable or battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V ensures broad compatibility with power systems and simplicity in design.

PWM Channels: YES

The availability of PWM channels allows for precise control of motors and other devices needing variable power levels.

Connectivity: SCI, SPI

Support for serial communication interfaces like SCI and SPI makes it versatile for diverse communication requirements.

ROM Programmability: FLASH

Flash memory programmability allows for easy updates and modifications of firmware, enhancing longevity and flexibility in applications.

Terminal Pitch: 0.8 mm

A pitch of 0.8 mm allows for dense component placement and flexibility in circuit design.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 means that it can withstand typical assembly processes without additional precautions.

Speed: 8 rpm

While a modest operational speed, it is adequate for applications where precise control is prioritized over high-frequency processing.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows for straightforward and efficient program execution tailored to many embedded applications.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller can interface with a wide range of peripherals and sensors, enhancing its applicability in diverse projects.

Technical Specifications

Microcontrollers ST72F324BJ4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

5.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SCI, SPI

Peripherals:

POR, TIMER(4)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

ST72F324BJ4T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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