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ST72F321R6TC

STMicroelectronics

ST72F321R6TC by STMicroelectronics

ST72F321R6TC by STMicroelectronics is an 8-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and 16 MHz clock frequency. Ideal for automotive applications, it features 5 timers, 16-Ch ADCs, and PWM channels. With I2C, SCI, SPI connectivity options and a compact FLATPACK package style at just 1.6mm seated height.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 18,000 parts In-Stock

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18,000

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Vyrian

USA . 7,375 parts In-Stock

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7,375

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Digiode

USA . 1,628 parts In-Stock

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1,628

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Anansix

USA . 561 parts In-Stock

1+ parts

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561

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 467 parts In-Stock

1+ parts

$11.288

100+ parts

-

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-

467

$11.288

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AZTECH Wire

Italy . 1,034 parts In-Stock

1+ parts

$19.170

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-

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1,034

$19.170

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IDEA Electronic Components Group

UK . 1,695 parts In-Stock

1+ parts

$44.909

100+ parts

-

1k+ parts

$40.418

10k+ parts

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1,695

$44.909

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$40.418

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MKK Technologies

India . 1,158 parts In-Stock

1+ parts

$84.448

100+ parts

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1,158

$84.448

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DigiPath Technology Company

USA . 1,158 parts In-Stock

1+ parts

$84.448

100+ parts

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10k+ parts

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1,158

$84.448

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A-Z Elektronik GmbH

Germany . 6,786 parts In-Stock

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6,786

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Vigor

Singapore . 5,268 parts In-Stock

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5,268

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

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$53.695

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1,380

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$53.695

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Corphita

USA . 1,262 parts In-Stock

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1,262

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Overview

Discover the ST72F321R6TC microcontroller by STMicroelectronics, a high-quality product designed to meet the needs of various applications. With a wide range of peripherals including timers and PWM channels, this microcontroller offers versatility and flexibility. Whether you're working on automotive projects or other applications, this product delivers reliable performance with its advanced technology and robust design. Trust STMicroelectronics for innovative solutions that provide value and benefits to customers, making your projects easier and more efficient.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides durability and protection for the microcontroller, ensuring it remains safe from external elements and physical damage.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can handle a wide range of power inputs, making it versatile and suitable for various applications.

Bit Size: 8

The 8-bit architecture provides a balance between performance and power consumption, making it a cost-effective choice for many embedded applications.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with other components and peripherals, enhancing its versatility.

Minimum Supply Voltage: 3.8 V

The low minimum supply voltage of 3.8 V allows for efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enables reliable performance in harsh environments, such as automotive or industrial applications.

CPU Family: ST72

The ST72 CPU family is known for its performance, reliability, and compatibility with various development tools, making this microcontroller a solid choice for developers.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its use cases in data acquisition and processing.

ROM Words: 32768

With 32,768 ROM words, this microcontroller offers ample memory for storing program instructions and data, enabling complex functionalities and applications.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures fast and efficient processing speeds, making this microcontroller suitable for applications requiring quick response times.

RAM Bytes: 1024

The 1,024 bytes of RAM provide temporary storage for data and variables during program execution, enhancing the microcontroller's processing capabilities and performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Analog To Digital Convertors: 16-Ch 10-Bit

The 16-channel 10-bit ADC capability allows for precise analog signal conversion, enabling accurate sensor readings and measurements in various applications.

PWM Channels: YES

The Pulse-Width Modulation (PWM) channels enable the microcontroller to generate precise analog voltage levels, useful for motor control, lighting dimming, and other applications requiring variable output levels.

Connectivity: I2C, SCI, SPI

Support for I2C, SCI, and SPI communication protocols provides versatile connectivity options for interfacing with external devices, sensors, and communication buses.

ROM Programmability: FLASH

The Flash ROM programmability allows for easy and quick updates to the microcontroller's firmware and software, enhancing flexibility and adaptability in application development.

Technical Specifications

Microcontrollers ST72F321R6TC attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of I/O Lines:

48

No. of Terminals:

64

No. of Timers:

5

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST72F321R6TC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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