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MK50H25Q33

STMicroelectronics

MK50H25Q33 by STMicroelectronics

STMicroelectronics MK50H25Q33 is a Serial Communication Controller with 24-bit address bus, 16-bit external data bus width, and 33 MHz clock frequency. It is used for high-speed data transfer applications in commercial-grade systems compatible with various processors like Z80 and 80386SX.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,299 parts In-Stock

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4,299

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Vyrian

USA . 2,017 parts In-Stock

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2,017

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Anansix

USA . 889 parts In-Stock

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889

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 120 parts In-Stock

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120

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

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Prism Electronics

USA . 41 parts In-Stock

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41

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ECAB

Sweden . 9 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$75.638

100+ parts

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1k+ parts

$68.074

10k+ parts

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2,344

$75.638

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$68.074

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MKK Technologies

India . 718 parts In-Stock

1+ parts

$142.232

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718

$142.232

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DigiPath Technology Company

USA . 718 parts In-Stock

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$142.232

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718

$142.232

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Kepictronics

USA . 5,783 parts In-Stock

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5,783

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Parana Technologies

USA . 1,055 parts In-Stock

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$90.436

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1,055

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$90.436

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Corphita

USA . 542 parts In-Stock

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542

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Perfect Parts

USA . 46 parts In-Stock

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46

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Overview

Enhance your communication systems with the MK50H25Q33 by STMicroelectronics, a top-tier manufacturer known for producing high-quality Serial Communication Controllers. This cutting-edge product offers unparalleled reliability and performance, making it an ideal solution for various applications. From improving data transfer rates to ensuring seamless synchronization, this chip carrier package delivers exceptional value and benefits to customers. Upgrade your systems today and experience the advantages of superior technology with the MK50H25Q33.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of power input without risk of damage.

Address Bus Width: 24

The 24-bit address bus width allows for communication with a large number of devices and memory locations.

Package Shape: SQUARE

The square package shape provides ease of mounting and efficient use of space on the PCB.

No. of Terminals: 52

Having 52 terminals allows for a robust and versatile connection interface with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and protection for the integrated circuits within.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures that the product can still operate reliably even under lower power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range makes this product suitable for use in various environmental conditions.

Maximum Data Transfer Rate: 6.375 MBps

The high data transfer rate enables fast and efficient communication between devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the product can function in colder environments without issues.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: QUAD

The quad terminal position layout allows for easy identification and connection of terminals.

Maximum Seated Height: 5.08 mm

The low maximum seated height helps in reducing the overall profile of the PCB.

Width: 19.05 mm

The compact width dimension saves space on the PCB and enables a more efficient layout.

External Data Bus Width: 16

With a 16-bit external data bus width, the product can handle large amounts of data effectively.

Communication Protocol: SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Support for multiple communication protocols allows for compatibility with a wide range of systems and devices.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency enables fast data processing and communication speed.

Length: 19.05 mm

The compact length dimension helps in optimizing PCB space and layout design.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes this product suitable for standard operating environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

This product serves as a versatile serial communication controller for various input/output tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Terminal Form: J BEND

The J bend terminal form provides secure and reliable solder connections on the PCB.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources.

Bus Compatibility: 68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Compatibility with a wide range of bus architectures makes this product highly versatile and suitable for diverse applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides sufficient spacing for easy soldering and maintenance of connections.

Technical Specifications

Serial Communication Controllers MK50H25Q33 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Maximum Clock Frequency:

33 MHz

Communication Protocol:

SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Maximum Data Transfer Rate:

6.375 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.05 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.05 mm

Trade Compliance

MK50H25Q33 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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