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MK50H27Q33B

STMicroelectronics

MK50H27Q33B by STMicroelectronics

MK50H27Q33B by STMicroelectronics is a CMOS serial communication controller with a max supply voltage of 5.25V and operates at up to 6.375 MBps. It features a 24-bit address bus and supports various bus types, making it ideal for embedded systems. Its compact chip carrier design ensures efficient integration in commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,048 parts In-Stock

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Digiode

USA . 4,044 parts In-Stock

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Anansix

USA . 868 parts In-Stock

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868

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Bristol Electronics

USA . 408 parts In-Stock

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Dan-Mar Components

USA . 408 parts In-Stock

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408

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Distributors (Availability)

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AZTECH Wire

Italy . 411 parts In-Stock

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$15.930

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$33.924

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$30.532

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113

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Microchip USA

USA . 258 parts In-Stock

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$57.938

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MKK Technologies

India . 862 parts In-Stock

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$63.792

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DigiPath Technology Company

USA . 862 parts In-Stock

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$63.792

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Corphita

USA . 4,181 parts In-Stock

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Assy Fe

Spain . 2,670 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Parana Technologies

USA . 1,373 parts In-Stock

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$40.561

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Overview

Unlock seamless connectivity and performance with the MK50H27Q33B from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful Serial Communication Controller ensures reliable data transfer for diverse applications, from industrial automation to consumer electronics. Experience exceptional quality and support backed by ST's expertise, empowering your designs with efficiency, versatility, and enhanced communication capabilities for a competitive edge.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environmental conditions, making it suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for a more compact design, enabling easier integration into modern circuit boards.

Maximum Supply Voltage: 5.25 V

A maximum supply voltage of 5.25 V provides flexibility in system design while maintaining performance efficiency.

Address Bus Width: 24

With a 24-bit address bus width, the controller can access a larger memory space, accommodating complex applications.

Package Shape: SQUARE

The square package shape aids in uniform heat distribution and simplifies layout considerations on PCBs.

No. of Terminals: 52

A higher number of terminals allows for increased connectivity options, making the product versatile for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is ideal for reliable surface mounting, enhancing manufacturing efficiency.

Minimum Supply Voltage: 4.75 V

A minimum supply voltage of 4.75 V ensures compatibility with a wide range of power sources in different applications.

Maximum Operating Temperature: 70 °C

Designed to operate at temperatures up to 70 °C, this product is suitable for use in various temperature-sensitive environments.

Maximum Data Transfer Rate: 6.375 MBps

A high data transfer rate of 6.375 MBps enhances communication speed between devices, enabling efficient data handling.

Minimum Operating Temperature: 0 °C

Capable of operating from 0 °C, this controller can function in a wider range of environmental conditions.

Terminal Position: QUAD

Quad terminal positioning promotes better performance and ease of routing in PCB designs.

Maximum Seated Height: 5.08 mm

A compact seated height of 5.08 mm allows for space-efficient designs in environments with stringent height requirements.

Width: 19.05 mm

Its width of 19.05 mm provides a balanced footprint that is suitable for various applications without compromising performance.

External Data Bus Width: 16

The 16-bit external data bus width supports efficient data transfer for applications requiring moderate bandwidth.

Maximum Clock Frequency: 33 MHz

With a maximum clock frequency of 33 MHz, this controller supports fast processing speeds essential for real-time applications.

Length: 19.05 mm

A compact length of 19.05 mm ensures that it can fit in tight spaces on modern circuit boards.

Temperature Grade: COMMERCIAL

Rated for commercial temperature grades, this product is suitable for a wide range of consumer and industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being categorized as a serial communication controller makes it excellent for various serial communication tasks.

Technology: CMOS

The CMOS technology provides high efficiency and low power consumption, making it ideal for battery-operated devices.

Terminal Form: J BEND

J bend terminals facilitate easy soldering and robust electrical connections, improving overall reliability.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, it is compatible with a majority of existing systems, enhancing its usability.

Bus Compatibility: 68040; 68000; 6800; Z8000; Z80; 80486; 8086; I960

Compatible with multiple bus architectures, this product offers flexibility, allowing integration into various systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standardized, making it easier to work with common PCB designs and components.

Technical Specifications

Serial Communication Controllers MK50H27Q33B attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68040; 68000; 6800; Z8000; Z80; 80486; 8086; I960

Maximum Clock Frequency:

33 MHz

Maximum Data Transfer Rate:

6.375 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J52

Length:

19.05 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.05 mm

Trade Compliance

MK50H27Q33B Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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