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MK50H27N25

STMicroelectronics

MK50H27N25 by STMicroelectronics

STMicroelectronics' MK50H27N25 is a Serial Communication Controller with 24-bit Address Bus, 6.375 MBps Data Transfer Rate, and 25 MHz Clock Frequency. Ideal for applications requiring high-speed serial I/O communication in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,224 parts In-Stock

1+ parts

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4,224

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Anansix

USA . 2,280 parts In-Stock

1+ parts

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2,280

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Digiode

USA . 1,099 parts In-Stock

1+ parts

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1,099

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 351 parts In-Stock

1+ parts

$20.492

100+ parts

-

1k+ parts

$18.443

10k+ parts

-

351

$20.492

-

$18.443

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MKK Technologies

India . 1,349 parts In-Stock

1+ parts

$38.534

100+ parts

-

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10k+ parts

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1,349

$38.534

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DigiPath Technology Company

USA . 1,349 parts In-Stock

1+ parts

$38.534

100+ parts

-

1k+ parts

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10k+ parts

-

1,349

$38.534

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A-Z Elektronik GmbH

Germany . 6,510 parts In-Stock

1+ parts

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6,510

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Corphita

USA . 2,871 parts In-Stock

1+ parts

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2,871

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

$24.501

1k+ parts

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1,361

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$24.501

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Perfect Parts

USA . 78 parts In-Stock

1+ parts

-

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78

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Overview

Experience seamless and reliable communication with the MK50H27N25 by STMicroelectronics, a leading manufacturer known for its top-quality products. This Serial Communication Controller offers fast data transfer rates and wide bus compatibility, making it ideal for a variety of applications. From industrial automation to telecommunications, this product ensures efficient performance and enhanced productivity. Benefit from its high supply voltage tolerance, durable package body material, and precise terminal finish. Trust STMicroelectronics for cutting-edge technology that delivers value and reliability to customers worldwide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, making the product versatile and suitable for various electrical systems.

Address Bus Width: 24

A wide address bus width of 24 allows for efficient data processing and handling, making the product suitable for handling large amounts of data.

Maximum Data Transfer Rate: 6.375 MBps

The high data transfer rate enables fast and efficient communication, making the product suitable for applications requiring quick data exchange.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency allows for fast processing speeds, making the product ideal for applications where real-time data processing is critical.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Serial Communication Controllers MK50H27N25 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68040; 68000; 6800; Z8000; Z80; 80486; 8086; I960

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

6.375 MBps

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e3

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

MK50H27N25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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