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MK5027Q

STMicroelectronics

MK5027Q by STMicroelectronics

STMicroelectronics' MK5027Q is a Serial Communication Controller with 24-bit Address Bus, 0.875 MBps Data Transfer Rate, and 10 MHz Clock Frequency. It is used in applications requiring high-speed serial I/O communication, compatible with various bus systems like 68000 and Z80.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,769

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-

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Vyrian

USA . 2,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,901

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Anansix

USA . 1,852 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,852

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,335 parts In-Stock

1+ parts

$55.624

100+ parts

-

1k+ parts

$50.062

10k+ parts

-

1,335

$55.624

-

$50.062

-

MKK Technologies

India . 953 parts In-Stock

1+ parts

$104.598

100+ parts

-

1k+ parts

-

10k+ parts

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953

$104.598

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DigiPath Technology Company

USA . 953 parts In-Stock

1+ parts

$104.598

100+ parts

-

1k+ parts

-

10k+ parts

-

953

$104.598

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Corphita

USA . 2,831 parts In-Stock

1+ parts

-

100+ parts

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2,831

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Parana Technologies

USA . 1,571 parts In-Stock

1+ parts

-

100+ parts

$66.507

1k+ parts

-

10k+ parts

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1,571

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$66.507

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Overview

Upgrade your communication systems with the MK5027Q by STMicroelectronics, a top-of-the-line Serial Communication Controller. Crafted with precision and reliability in mind, this product ensures seamless data transfer at high speeds, making it perfect for a wide range of applications. With a durable plastic/epoxy body and a maximum supply voltage of 5.25V, this chip carrier package offers unparalleled performance and flexibility. Experience the value and benefits of advanced technology with the MK5027Q - the ultimate solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability while keeping the overall weight and cost of the product low.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 5.25 V

Provides a wide range of supply voltage tolerance, making the product versatile and compatible with different systems.

Address Bus Width: 24

Allows for the handling of large amounts of address data, suitable for complex communication tasks.

Package Shape: SQUARE

Offers a compact and space-saving design, ideal for devices with limited real estate for components.

No. of Terminals: 52

Provides a sufficient number of connection points for interfacing with other components and peripherals.

Package Style (Meter): CHIP CARRIER

Ensures efficient heat dissipation and electrical performance, contributing to the overall reliability of the product.

Maximum Operating Temperature: 70 °C

Ensures stable operation even in challenging environmental conditions, making the product suitable for a wide range of applications.

Maximum Data Transfer Rate: 0.875 MBps

Enables high-speed data communication, essential for real-time applications and efficient data exchange.

Minimum Operating Temperature: 0 °C

Ensures reliable performance even in low-temperature environments, enhancing the product's versatility.

Terminal Finish: MATTE TIN

Provides a corrosion-resistant surface finish for long-term reliability and durability.

Terminal Position: QUAD

Facilitates easy and secure connections with other components, reducing installation errors and ensuring a stable electrical interface.

Maximum Seated Height: 5.08 mm

Offers a compact overall profile, suitable for slim devices and applications with tight space constraints.

Width: 19.05 mm

Ensures compatibility with standard mounting options and provides a balanced form factor for easy integration into various systems.

External Data Bus Width: 16

Supports the efficient transfer of data between the controller and external devices, enhancing overall performance.

Maximum Clock Frequency: 10 MHz

Provides ample processing speed for handling data communication tasks efficiently, suitable for high-speed applications.

Length: 19.05 mm

Complements the width dimension for a compact and standardized form factor, allowing for easy integration and compatibility.

Temperature Grade: COMMERCIAL

Suitable for standard commercial operating environments, ensuring compatibility with a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed specifically for serial communication tasks, providing optimized performance and reliability in such applications.

Technology: CMOS

Offers low power consumption, high noise immunity, and high-speed operation, making the product energy-efficient and reliable.

Terminal Form: J BEND

Facilitates easy and secure soldering of terminals for reliable connections, reducing the risk of electrical failures.

Nominal Supply Voltage: 5 V

Standard voltage level suitable for most applications, ensuring compatibility and ease of integration.

Bus Compatibility: 68000; 6800; LSI-11; Z8000; Z80; 8086; 8088; 8080

Supports a wide range of bus architectures, enabling seamless integration with various systems and devices.

Terminal Pitch: 1.27 mm

Provides a standard spacing for terminals, facilitating easy connection and compatibility with standard PCB layouts.

Technical Specifications

Serial Communication Controllers MK5027Q attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68000; 6800; LSI-11; Z8000; Z80; 8086; 8088; 8080

Maximum Clock Frequency:

10 MHz

Maximum Data Transfer Rate:

.875 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.05 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.05 mm

Trade Compliance

MK5027Q Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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