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MK50H25N33

STMicroelectronics

MK50H25N33 by STMicroelectronics

STMicroelectronics' MK50H25N33 is a Serial Communication Controller with 24-bit Address Bus, 6.375 MBps Data Transfer Rate, and 33 MHz Clock Frequency. It is used in applications requiring SYNC HDLC, X.25, X.32 communication protocols for data transfer at temperatures ranging from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,763 parts In-Stock

1+ parts

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3,763

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Digiode

USA . 3,702 parts In-Stock

1+ parts

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3,702

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Anansix

USA . 2,654 parts In-Stock

1+ parts

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2,654

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,768 parts In-Stock

1+ parts

$40.141

100+ parts

-

1k+ parts

$36.127

10k+ parts

-

1,768

$40.141

-

$36.127

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MKK Technologies

India . 792 parts In-Stock

1+ parts

$75.483

100+ parts

-

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792

$75.483

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DigiPath Technology Company

USA . 792 parts In-Stock

1+ parts

$75.483

100+ parts

-

1k+ parts

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10k+ parts

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792

$75.483

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Corphita

USA . 828 parts In-Stock

1+ parts

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828

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Parana Technologies

USA . 755 parts In-Stock

1+ parts

-

100+ parts

$47.995

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755

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$47.995

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Overview

Unlock seamless and reliable communication with the MK50H25N33 from STMicroelectronics. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled quality and performance. Its versatile applications make it an essential component for various electronic devices. Trust in STMicroelectronics' reputation for excellence and innovation to deliver a product that exceeds expectations. Experience the value and benefits of the MK50H25N33, providing customers with a competitive edge in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and ruggedness, making it suitable for harsh operating environments.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power input and helps prevent damage from voltage fluctuations.

Address Bus Width: 24

The wide address bus width of 24 enhances data processing capabilities and allows for handling larger amounts of data efficiently.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this serial communication controller into various electronic devices and systems.

Maximum Data Transfer Rate: 6.375 MBps

The high maximum data transfer rate ensures fast and efficient communication between devices, improving overall system performance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The specific type of peripheral IC ensures seamless and reliable serial communication, making this product a good choice for various applications.

Communication Protocol: SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Support for multiple communication protocols allows for versatile connectivity and compatibility with different systems and devices.

Maximum Clock Frequency: 33 MHz

The high maximum clock frequency enables fast data processing and efficient communication, making this product suitable for high-speed applications.

Technical Specifications

Serial Communication Controllers MK50H25N33 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Maximum Clock Frequency:

33 MHz

Communication Protocol:

SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Maximum Data Transfer Rate:

6.375 MBps

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e3

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

MK50H25N33 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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