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MK50H25N16

STMicroelectronics

MK50H25N16 by STMicroelectronics

MK50H25N16 by STMicroelectronics is a Serial Communication Controller with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 16 MHz. It is ideal for applications requiring SYNC HDLC, X.25, X.32 communication protocols in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,827 parts In-Stock

1+ parts

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2,827

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Digiode

USA . 1,652 parts In-Stock

1+ parts

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1,652

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Vyrian

USA . 510 parts In-Stock

1+ parts

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510

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ComSIT Distribution GmbH

Germany . 34 parts In-Stock

1+ parts

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,948 parts In-Stock

1+ parts

$42.180

100+ parts

-

1k+ parts

$37.962

10k+ parts

-

1,948

$42.180

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$37.962

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MKK Technologies

India . 1,969 parts In-Stock

1+ parts

$79.317

100+ parts

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1,969

$79.317

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DigiPath Technology Company

USA . 1,969 parts In-Stock

1+ parts

$79.317

100+ parts

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1,969

$79.317

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Corphita

USA . 3,998 parts In-Stock

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3,998

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Parana Technologies

USA . 224 parts In-Stock

1+ parts

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100+ parts

$50.433

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224

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$50.433

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Kepictronics

USA . 98 parts In-Stock

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98

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Overview

Enhance your communication systems with the MK50H25N16 by STMicroelectronics, a top-tier manufacturer known for quality and reliability. This Serial Communication Controller offers seamless data transfer and compatibility with various bus systems, making it ideal for a wide range of applications. From industrial automation to telecommunications, this product provides unmatched value and performance, ensuring smooth operations and enhanced functionality for your projects. Upgrade your systems today with the MK50H25N16 and experience the difference in efficiency and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides a durable and lightweight construction, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 5.25 V

A higher maximum supply voltage allows for flexibility in power supply options and can accommodate various system requirements.

Address Bus Width: 24

The 24 address bus width enables the product to handle larger memory capacities and complex data communication tasks efficiently.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into different system designs and layouts.

No. of Terminals: 48

Having 48 terminals allows for versatile connectivity options and supports multiple input/output configurations.

Minimum Supply Voltage: 4.75 V

A lower minimum supply voltage ensures compatibility with a wide range of power sources and enhances the product's reliability under varying voltage conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can perform reliably in high-temperature environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows for operation in a wide range of temperature conditions, ensuring versatility and performance consistency.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent corrosion resistance and solderability, enhancing the product's durability and longevity.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in connection orientations and improves the overall usability of the product.

Width: 15.24 mm

The compact width of 15.24 mm allows for space-efficient installation and integration into tight system layouts.

External Data Bus Width: 16

The 16 external data bus width enables high-speed data transfer and efficient communication between the product and external devices.

Communication Protocol: SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Support for multiple communication protocols enhances interoperability and compatibility with different systems and devices.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides fast processing speed and responsiveness, making the product suitable for high-performance applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature environments, making the product suitable for a wide range of commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type as a serial IO/communication controller emphasizes the product's connectivity capabilities and suitability for serial communication tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, enhancing the product's overall performance and efficiency.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure connections, ensuring reliable operation and robust connectivity.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is a standard voltage level widely supported by various systems and components, ensuring seamless integration and compatibility.

Bus Compatibility: 68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Compatibility with multiple bus types such as 68020, 68000, Z8000, and others allows for versatile integration and connectivity options across different systems and architectures.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm provides standard spacing for easy connections and compatibility with a wide range of standard connectors and sockets.

Technical Specifications

Serial Communication Controllers MK50H25N16 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Maximum Clock Frequency:

16 MHz

Communication Protocol:

SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e3

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

MK50H25N16 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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