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MK50H27Q25

STMicroelectronics

MK50H27Q25 by STMicroelectronics

STMicroelectronics MK50H27Q25 is a Serial Communication Controller with 24-bit Address Bus, 16-bit External Data Bus, and 25 MHz Clock Frequency. It is used in applications requiring high-speed data transfer up to 6.375 MBps, such as serial IO and communication control in commercial-grade systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,628 parts In-Stock

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Anansix

USA . 2,400 parts In-Stock

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2,400

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Digiode

USA . 2,365 parts In-Stock

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2,365

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Bristol Electronics

USA . 361 parts In-Stock

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361

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Dan-Mar Components

USA . 361 parts In-Stock

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361

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ComSIT Distribution GmbH

Germany . 41 parts In-Stock

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41

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Prism Electronics

USA . 25 parts In-Stock

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25

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Electronic Expediters

USA . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$37.246

100+ parts

-

1k+ parts

$33.522

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1,606

$37.246

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$33.522

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MKK Technologies

India . 1,350 parts In-Stock

1+ parts

$70.039

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1,350

$70.039

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DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$70.039

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1,350

$70.039

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Corphita

USA . 3,816 parts In-Stock

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Kepictronics

USA . 1,380 parts In-Stock

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1,380

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Parana Technologies

USA . 512 parts In-Stock

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$44.534

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512

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Perfect Parts

USA . 28 parts In-Stock

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Overview

Unlock the power of seamless communication with the MK50H27Q25 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Serial Communication Controllers that are versatile and reliable. Ideal for various applications, this product offers unparalleled value, providing customers with efficient data transfer rates and compatibility with a wide range of bus systems. Experience the benefits of a superior technology solution that meets your needs with the MK50H27Q25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the serial communication controller, making it suitable for various industrial environments.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on circuit boards, enabling efficient assembly processes.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage tolerance, providing flexibility in system design and preventing voltage-related issues.

Address Bus Width: 24

A wider address bus width allows for larger memory addressing capabilities, enhancing the controller's overall performance and data handling capabilities.

Package Shape: SQUARE

Square package shape enables efficient use of board space and facilitates a compact design for the overall system.

No. of Terminals: 52

Having a sufficient number of terminals allows for versatile connectivity options and integration with other components in the system.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature ensures reliable performance even in demanding thermal conditions, increasing the controller's robustness and longevity.

Maximum Data Transfer Rate: 6.375 MBps

High data transfer rate offers fast and efficient communication between devices, making the controller ideal for applications requiring real-time data processing.

Minimum Operating Temperature: 0 °C

A low minimum operating temperature ensures the controller can function in a wide range of environments, including cold temperatures, enhancing its versatility.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and reliable electrical connections, ensuring long-term performance and durability of the controller.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal interference or disconnection during operation.

Maximum Seated Height: 5.08 mm

Low seated height contributes to a compact and space-efficient design, which is beneficial for applications where size constraints are a concern.

External Data Bus Width: 16

Wider external data bus width enables the controller to process larger amounts of data simultaneously, improving overall system performance and efficiency.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency allows for fast processing speeds, making the controller suitable for applications requiring quick data transmission and response times.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the controller's reliability and performance in standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed specifically for serial communication tasks, this controller offers optimized performance and functionality for managing serial data transfer and communication protocols.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the serial communication controller.

Terminal Form: J BEND

J bend terminal form allows for easy and secure soldering, ensuring reliable connections and reducing the risk of signal loss or interruptions.

Nominal Supply Voltage: 5 V

Stable and standard nominal supply voltage simplifies system integration and power management, contributing to the controller's overall reliability and compatibility.

Bus Compatibility: 68040; 68000; 6800; Z8000; Z80; 80486; 8086; I960

Compatible with various bus architectures and processors, offering versatile connectivity and integration options for different system configurations and applications.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration with common connectors and circuit board layouts, simplifying assembly and installation processes.

Technical Specifications

Serial Communication Controllers MK50H27Q25 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68040; 68000; 6800; Z8000; Z80; 80486; 8086; I960

Maximum Clock Frequency:

25 MHz

Maximum Data Transfer Rate:

6.375 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.05 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.05 mm

Trade Compliance

MK50H27Q25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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