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MK50H25N25

STMicroelectronics

MK50H25N25 by STMicroelectronics

STMicroelectronics' MK50H25N25 is a Serial Communication Controller with 24-bit Address Bus, 16-bit External Data Bus, and 25 MHz Clock Frequency. It is used in applications requiring SYNC HDLC, X.25, X.32 protocols for serial communication at temperatures ranging from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,355 parts In-Stock

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2,355

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Digiode

USA . 1,996 parts In-Stock

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1,996

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Anansix

USA . 1,037 parts In-Stock

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1,037

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ACDS - Activité Composants Distribution Service

France . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,486 parts In-Stock

1+ parts

$18.219

100+ parts

-

1k+ parts

$16.397

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1,486

$18.219

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$16.397

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MKK Technologies

India . 65 parts In-Stock

1+ parts

$34.259

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65

$34.259

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DigiPath Technology Company

USA . 65 parts In-Stock

1+ parts

$34.259

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65

$34.259

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Corphita

USA . 843 parts In-Stock

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843

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Parana Technologies

USA . 230 parts In-Stock

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$21.783

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230

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$21.783

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Overview

Unlock seamless and efficient communication with the MK50H25N25 by STMicroelectronics, a top-tier Serial Communication Controller that sets the standard for reliability and performance. Manufactured by industry leader STMicroelectronics, this product boasts unparalleled quality and precision engineering. Ideal for a wide range of applications, this device offers customers unmatched value with its ease of use, versatility, and cutting-edge technology. Upgrade your serial communication capabilities today with the MK50H25N25 and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for greater flexibility in power supply options.

Address Bus Width: 24

Wide address bus width allows for efficient communication and data processing.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to integrate into various designs and installations.

No. of Terminals: 48

Sufficient number of terminals for connecting to other devices and components.

External Data Bus Width: 16

Wide external data bus allows for fast and efficient data transfer.

Communication Protocol: SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

Compatibility with multiple communication protocols enables versatile usage.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency ensures fast data processing and communication.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Technical Specifications

Serial Communication Controllers MK50H25N25 attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

Address Bus Width:

24

Boundary Scan:

NO

Bus Compatibility:

68020; 68000; Z8000; 80386SX; 80286; 80186; 8086; 8088; Z80

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC HDLC; X.25; X.32; X.75; LAPB; LAPD

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T48

JESD-609 Code:

e3

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

MK50H25N25 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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