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M93C46-RDS6G

STMicroelectronics

M93C46-RDS6G by STMicroelectronics

M93C46-RDS6G by STMicroelectronics is a 1024-bit EEPROM with a synchronous operating mode and a max clock frequency of 1 MHz. It features software write protection, operates b/w -40 °C to 85 °C, and supports both 2V and 5V power supplies. Ideal for industrial applications requiring reliable data retention and endurance of up to 1 million cycles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,832 parts In-Stock

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Digiode

USA . 1,410 parts In-Stock

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Anansix

USA . 769 parts In-Stock

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769

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IDEA Electronic Components Group

UK . 748 parts In-Stock

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$2.743

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$2.468

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748

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MKK Technologies

India . 1,177 parts In-Stock

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$5.157

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DigiPath Technology Company

USA . 1,177 parts In-Stock

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$5.157

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$5.157

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AZTECH Wire

Italy . 858 parts In-Stock

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$12.970

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858

$12.970

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QUARKTWIN TECHNOLOGY LTD

USA . 5,984 parts In-Stock

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Microchip USA

USA . 4,729 parts In-Stock

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Parana Technologies

USA . 1,645 parts In-Stock

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$3.279

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Corphita

USA . 888 parts In-Stock

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Overview

Unlock the power of reliable data storage with the M93C46-RDS6G EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact and robust device offers exceptional endurance and versatility, perfect for industrial applications requiring memory retention in extreme conditions. With its efficient synchronous operation, you can trust this memory solution to deliver outstanding performance while saving space—empowering your designs with quality and reliability that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection against environmental factors, making it ideal for various applications.

Surface Mount: YES

Being surface mount technology (SMT) allows for more efficient use of space on PCBs and enables automated assembly, reducing production costs.

Package Shape: SQUARE

The square package shape facilitates tighter placement on PCBs, making it more versatile for various designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance and efficiency, allowing faster data processing and communication.

Nominal Supply Voltage / Vsup: 5V

A nominal voltage of 5V ensures compatibility with a wide range of circuits and systems, making it easy to integrate.

Power Supplies: 2/5V

Supports a range of power supply voltages, offering flexibility in design for different applications.

No. of Terminals: 8

Having 8 terminals allows for a compact design while providing sufficient connectivity for functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications, common in portable and consumer electronics.

Alternate Memory Width: 8

An alternate memory width of 8 bits contributes to enhanced data throughput, essential in performance-critical tasks.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliability under moderate to high temperature conditions, suitable for industrial applications.

Organization: 64X16

The organized structure of 64x16 supports efficient data storage and retrieval, ideal for a variety of applications.

Minimum Operating Temperature: -40 °C

A low operating temperature range allows for applications in colder environments, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish ensures better conductivity and long-term reliability in connections, critical for performance.

Terminal Position: DUAL

Dual terminal position enhances design flexibility and allows better routing options on PCBs.

Write Protection: SOFTWARE

Software-based write protection provides easier implementation and flexibility in ensuring data integrity.

Maximum Seated Height: 1.1 mm

A low seated height enables use in ultra-thin devices, aligning with modern trends in compact electronics.

Maximum Clock Frequency (fCLK): 1 MHz

A clock frequency of 1 MHz supports moderate speeds, balancing performance with power consumption.

Width: 3 mm

A compact width makes this EEPROM suitable for space-limited applications.

Minimum Supply Voltage (Vsup): 1.8V

The low minimum voltage allows for operation in low-power applications, making it energy efficient.

Length: 3 mm

Short length contributes to a compact form factor, suitable for tight spaces in electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable operation in harsh environments, making it ideal for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, perfect for battery-operated devices.

Parallel or Serial: SERIAL

Serialized data communication allows for simpler connections and reduced pin count, useful in compact designs.

Terminal Form: GULL WING

Gull-wing terminals provide reliable connections and are easy to solder, contributing to manufacturing efficiency.

Maximum Supply Current: 2 mA

Low maximum supply current indicates energy efficiency, making it suitable for battery-powered devices.

No. of Words: 64 words

The memory organization into words provides a straightforward approach for data handling, suitable for various applications.

Memory Width: 16

A 16-bit memory width enhances data handling capabilities, supporting more complex applications.

Minimum Data Retention Time: 40 years

Long data retention time ensures reliability and longevity of stored information, critical for many applications.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for denser circuitry on PCBs, accommodating more components in limited space.

No. of Words Code: 64

The defined number of words allows for systematic data addressing, optimizing usage in applications.

Maximum Supply Voltage (Vsup): 5.5V

The flexibility to support up to 5.5V enables integration into both standard and higher power applications.

Endurance: 1,000,000 Write/Erase Cycles

High endurance for write/erase cycles makes it suitable for applications requiring frequent data updates.

Serial Bus Type: MICROWIRE

The Microwire protocol allows for a simple interface and ease of integration, ideal for a wide range of systems.

Maximum Write Cycle Time (tWC): 10 ms

Fast write cycle time facilitates quick data updates, enhancing overall system responsiveness.

Memory Density: 1024 bit

The 1024-bit memory density provides ample storage for embedded applications, meeting modern data needs.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile storage, retaining data even without power, essential for critical applications.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current helps in preserving battery life, ideal for energy-sensitive designs.

Technical Specifications

EEPROM M93C46-RDS6G attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C46-RDS6G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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