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M93C06-DS3TP

STMicroelectronics

M93C06-DS3TP by STMicroelectronics

M93C06-DS3TP by STMicroelectronics is a 256-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It features an automotive temperature grade, operating b/w -40 °C to 125 °C. Ideal for compact applications, it comes in a small outline package with 8 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,531 parts In-Stock

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Anansix

USA . 1,939 parts In-Stock

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Digiode

USA . 787 parts In-Stock

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787

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IDEA Electronic Components Group

UK . 343 parts In-Stock

1+ parts

$2.688

100+ parts

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$2.419

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343

$2.688

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$2.419

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MKK Technologies

India . 1,127 parts In-Stock

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$5.055

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$5.055

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DigiPath Technology Company

USA . 1,127 parts In-Stock

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$5.055

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$5.055

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Corphita

USA . 1,978 parts In-Stock

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Parana Technologies

USA . 337 parts In-Stock

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$3.214

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337

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$3.214

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Overview

Unlock the potential of your projects with the M93C06-DS3TP EEPROM from STMicroelectronics! Renowned for its exceptional quality and reliability, STMicroelectronics delivers cutting-edge technology ideal for automotive and industrial applications. This compact, surface-mount memory solution ensures swift data access, durability under extreme temperatures, and seamless integration into your designs. Experience enhanced performance and peace of mind by choosing a trusted leader in semiconductor innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration into compact and high-density circuits.

Package Shape: SQUARE

The square shape optimizes layout and PCB space, facilitating efficient circuit design.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures better timing control and data integrity, enhancing overall performance.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V aligns with common power specifications in many devices, ensuring compatibility.

No. of Terminals: 8

With 8 terminals, this EEPROM can easily connect to various designs while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact and thin profile allows for space-efficient designs in various electronic applications.

Alternate Memory Width: 8

An 8-bit memory width allows for efficient data handling and reduces complexity in data transmission.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this EEPROM suitable for automotive and high-temperature environments.

Organization: 16X16

The 16x16 organization facilitates easy data structuring and access, optimizing performance for specific applications.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 to 125 °C) ensures reliable operation in extreme conditions, ideal for automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position enhances connection flexibility, allowing for various mounting options in circuit designs.

Maximum Seated Height: 1.1 mm

A low profile of 1.1 mm makes it suitable for space-constrained applications, allowing for more compact devices.

Maximum Clock Frequency (fCLK): 2 MHz

With a maximum clock frequency of 2 MHz, it supports efficient data transfer rates suitable for a variety of applications.

Width: 3 mm

A compact width of 3 mm aids in designing space-saving electronic equipment.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for operation in slightly lower power environments while maintaining functionality.

Length: 3 mm

Combined with a small width, a length of 3 mm provides an overall small footprint for the product.

Temperature Grade: AUTOMOTIVE

Designed with an automotive temperature grade ensures robustness and reliability in vehicles under various conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient operation.

Parallel or Serial: SERIAL

The serial interface allows for simpler connections and reduces the number of required I/O pins, promoting design efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and help provide a solid electrical connection.

No. of Words: 16 words

The EEPROM can store 16 words, providing adequate data capacity for simple applications.

Memory Width: 16

A memory width of 16 allows for robust data handling and access patterns that meet various design needs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm provides connectivity options suitable for several PCB layouts, enhancing design versatility.

No. of Words Code: 16

The coding allows for efficient use of the EEPROM's storage capacity, suitable for lightweight applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a maximum voltage of 5.5V, ensuring versatile operation across a range of devices.

Serial Bus Type: MICROWIRE

Support for the Microwire serial bus type simplifies the communication protocol with other devices.

Maximum Write Cycle Time (tWC): 10 ms

With a write cycle time of 10 ms, this EEPROM provides efficient write operations suitable for many applications.

Memory Density: 256 bit

A memory density of 256 bits encompasses efficient storage while minimizing physical size.

Memory IC Type: EEPROM

Being an EEPROM allows for non-volatile storage, making it essential for applications that require data retention.

Technical Specifications

EEPROM M93C06-DS3TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

256 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93C06-DS3TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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