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M93C66-RMB6TG

STMicroelectronics

M93C66-RMB6TG by STMicroelectronics

STMicroelectronics M93C66-RMB6TG is a 4096-bit EEPROM with 256x16 organization, operating at 1 MHz clock frequency. It features software write protection and MICROWIRE serial bus type, suitable for industrial applications requiring reliable non-volatile memory storage. With a small outline package style and low standby current of 0.000002 Amp, it offers endurance of 1000000 Write/Erase Cycles.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$0.172

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-

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38

$0.172

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Vyrian

USA . 6,905 parts In-Stock

1+ parts

-

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6,905

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LIBRA Elektronik GmbH

Germany . 2,410 parts In-Stock

1+ parts

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2,410

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Anansix

USA . 1,180 parts In-Stock

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1,180

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Digiode

USA . 187 parts In-Stock

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187

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,035 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

$0.169

3,035

$0.172

-

-

$0.169

Argo Parts USA

USA . 1,120 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

1,120

$0.172

-

-

$0.167

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.172

100+ parts

-

1k+ parts

$0.163

10k+ parts

$0.160

1,000

$0.172

-

$0.163

$0.160

IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

$2.286

10k+ parts

-

516

$2.540

-

$2.286

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MKK Technologies

India . 1,172 parts In-Stock

1+ parts

$4.777

100+ parts

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1,172

$4.777

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DigiPath Technology Company

USA . 1,172 parts In-Stock

1+ parts

$4.777

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1,172

$4.777

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Ampacity Inc.

Singapore . 267 parts In-Stock

1+ parts

$5.000

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267

$5.000

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AZTECH Wire

Italy . 208 parts In-Stock

1+ parts

$11.234

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208

$11.234

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Microchip USA

USA . 378 parts In-Stock

1+ parts

$42.074

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378

$42.074

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A-Z Elektronik GmbH

Germany . 6,617 parts In-Stock

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6,617

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Alle Elektronik GmbH

Germany . 4,411 parts In-Stock

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Corphita

USA . 4,141 parts In-Stock

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4,141

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Kepictronics

USA . 2,494 parts In-Stock

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2,494

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Parana Technologies

USA . 1,223 parts In-Stock

1+ parts

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100+ parts

$3.037

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1,223

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$3.037

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Perfect Parts

USA . 587 parts In-Stock

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587

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Overview

Unlock the power of reliable data storage with the M93C66-RMB6TG EEPROM by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and innovative technology in every product. This small outline, very thin profile memory device is perfect for a wide range of applications, providing seamless operation and secure data protection. Say goodbye to data loss worries and hello to efficient performance with the M93C66-RMB6TG - your ultimate solution for all your memory needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy integration onto circuit boards, saving space and simplifying assembly process.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred in sync with clock signals, improving overall efficiency and reliability of the device.

Nominal Supply Voltage / Vsup (V): 5

5V supply voltage ensures stable and consistent power delivery to the EEPROM, enhancing performance and longevity of the product.

Memory Density: 4096 bit

High memory density allows for storage of a large amount of data in a compact form factor, making it ideal for applications requiring high storage capacity.

Endurance: 1000000 Write/Erase Cycles

High endurance rating ensures the EEPROM can withstand frequent read/write operations without degradation, ensuring reliable long-term performance.

Serial Bus Type: MICROWIRE

Microwire serial bus interface is easy to implement and offers fast data transfer rates, making it suitable for applications requiring efficient communication.

Technical Specifications

EEPROM M93C66-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-XDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X16

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

SOFTWARE

Trade Compliance

M93C66-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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