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M93C06-DS3TG

STMicroelectronics

M93C06-DS3TG by STMicroelectronics

M93C06-DS3TG from STMicroelectronics is a 256-bit EEPROM with a synchronous operating mode and a max clock frequency of 2 MHz. It operates b/w -40 °C to 125 °C, making it ideal for automotive applications. This surface-mount device features an 8-terminal gull-wing design for efficient integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,399 parts In-Stock

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4,399

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Vyrian

USA . 2,332 parts In-Stock

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2,332

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Anansix

USA . 1,522 parts In-Stock

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1,522

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IDEA Electronic Components Group

UK . 823 parts In-Stock

1+ parts

$2.797

100+ parts

-

1k+ parts

$2.517

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823

$2.797

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$2.517

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MKK Technologies

India . 1,632 parts In-Stock

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$5.259

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1,632

$5.259

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DigiPath Technology Company

USA . 1,632 parts In-Stock

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$5.259

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1,632

$5.259

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Corphita

USA . 3,114 parts In-Stock

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3,114

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Parana Technologies

USA . 177 parts In-Stock

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$3.344

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Overview

Unlock unparalleled reliability with the M93C06-DS3TG EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, surface-mount memory offers exceptional performance across diverse applications—from automotive systems to consumer electronics. Benefit from its robust operating temperature range and superior quality, ensuring your designs are both efficient and durable. Elevate your projects with a trusted partner delivering value, efficiency, and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to various environmental conditions, making the EEPROM reliable for automotive applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuit boards, saving space in electronic applications.

Package Shape: SQUARE

A square shape facilitates efficient placement on PCB layouts and optimizes performance in space-constrained applications.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer rates and synchronization with system clocks, improving overall efficiency.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5V makes the EEPROM compatible with a wide range of electronic devices and circuits.

No. of Terminals: 8

With 8 terminals, this EEPROM offers a simple interface for easy connection and integration into various circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for a sleek design, saving space on the PCB while maintaining robust performance.

Alternate Memory Width: 8

Supports an alternate memory width of 8 bits, making the EEPROM flexible for various applications and data handling needs.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes this EEPROM suitable for high-temperature automotive and industrial environments.

Organization: 16X16

The 16x16 organization allows for efficient data storage and retrieval, enhancing performance in applications requiring quick access.

Minimum Operating Temperature: -40 °C

This specification ensures functionality in extremely low temperatures, making it ideal for harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning enhances compatibility and allows flexible layout options on PCB designs.

Maximum Seated Height: 1.1 mm

The low seated height allows for use in thin electronics and compact device designs, providing versatility in applications.

Maximum Clock Frequency (fCLK): 2 MHz

A maximum clock frequency of 2 MHz allows for efficient and rapid data processing, suitable for high-speed applications.

Width: 3 mm

A compact width of 3 mm allows for easy integration into tight spaces within electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

This specification ensures reliable operation even at lower supply voltages, enhancing versatility in usage.

Length: 3 mm

At only 3 mm in length, the EEPROM is very compact, enabling use in miniaturized electronic products.

Temperature Grade: AUTOMOTIVE

Being graded for automotive use signifies reliability and long-term performance under rigorous conditions, making it an excellent choice for automotive applications.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies connections and can reduce the number of required pins, facilitating easier integration into designs.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and facilitate easy soldering, enhancing the reliability of connections.

No. of Words: 16 words

With a storage capacity of 16 words, this EEPROM can manage adequate data for many simple applications without added complexity.

Memory Width: 16

A memory width of 16 bits allows for efficient data handling and storage, suitable for various applications requiring moderate data sizes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch of 0.65 mm allows for denser layouts on PCBs, facilitating modern compact designs.

No. of Words Code: 16

The 16 words code provides a straightforward means of addressing memory, simplifying implementation in systems.

Maximum Supply Voltage (Vsup): 5.5 V

This wider supply voltage range ensures adaptability across different electronic environments and devices.

Serial Bus Type: MICROWIRE

The Microwire protocol ensures reliability and ease of use in communication, making it ideal for various applications.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms allows for reasonably fast data writing, enhancing overall system performance.

Memory Density: 256 bit

With a density of 256 bits, this EEPROM provides an adequate amount of storage for many embedded applications.

Memory IC Type: EEPROM

As an EEPROM, it allows for non-volatile memory storage, retaining data even when power is removed, making it essential for many applications.

Technical Specifications

EEPROM M93C06-DS3TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

256 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93C06-DS3TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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