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AT24CM01-SHD-T-989

Microchip Technology

AT24CM01-SHD-T-989 by Microchip Technology

AT24CM01-SHD-T-989 by Microchip is a 128KX8 EEPROM with I2C control, operating at 1 MHz. It has a temperature range of -40 to 85 °C and offers 1000000 Write/Erase Cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory storage in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 30,285 parts In-Stock

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Vyrian

USA . 1,035 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,143 parts In-Stock

1+ parts

$2.489

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$2.489

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Corohmni

South Africa . 251 parts In-Stock

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$3.510

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$3.510

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Ampacity Inc.

Singapore . 195 parts In-Stock

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$9.000

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$9.000

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AZTECH Wire

Italy . 456 parts In-Stock

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$14.379

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456

$14.379

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Semicontronic

India . 405 parts In-Stock

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$15.000

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$14.625

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$14.550

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405

$15.000

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$14.550

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GreenTree Electronics

Israel . 15,154 parts In-Stock

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Marpe Global Electronics

Taiwan . 7,411 parts In-Stock

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QualityLine Systems

Poland . 7,411 parts In-Stock

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XL Components Corporation

Australia . 7,411 parts In-Stock

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Continental Prestige Electronics

USA . 5,442 parts In-Stock

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Argo Parts USA

USA . 4,085 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience the superior quality and reliability of the Microchip Technology AT24CM01-SHD-T-989 EEPROM. With a strong reputation in the industry, Microchip Technology delivers exceptional products that meet the highest standards. This EEPROM is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in Microchip Technology to provide you with cutting-edge technology that enhances your projects and brings your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures the product is robust and reliable for long-term use.

Surface Mount: YES

Easy installation and integration into circuit boards for efficient use.

Operating Mode: SYNCHRONOUS

Allows for precise timing and coordination with other components in the system.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for easy compatibility with various systems.

No. of Terminals: 8

Simplifies connectivity and reduces the complexity of the setup.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Output Characteristics: OPEN-DRAIN

Provides flexibility in driving different loads and circuits.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without any issues.

Write Protection: HARDWARE

Enhanced security features to prevent unauthorized data modification.

Maximum Clock Frequency (fCLK): 1 MHz

Fast operation speed for quick data transfer and processing.

Memory Density: 1048576 bit

High-density memory storage for storing a large amount of data.

Endurance: 1000000 Write/Erase Cycles

Long-lasting durability with a high number of write/erase cycles for data retention.

Serial Bus Type: I2C

Efficient communication protocol for data transfer between components.

Technical Specifications

EEPROM AT24CM01-SHD-T-989 attributes and parameters. Explore more EEPROM devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

100

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

Length:

5.29 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.23

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Programming Voltage (V):

5

Reverse Pinout:

NO

Screening Level:

TS 16949

Maximum Seated Height:

2.16 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.24 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

AT24CM01-SHD-T-989 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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