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M93C06-DS3T

STMicroelectronics

M93C06-DS3T by STMicroelectronics

M93C06-DS3T by STMicroelectronics is a 256-bit EEPROM with a synchronous operating mode, ideal for automotive applications. It features an 8-terminal, thin-profile package and operates b/w -40 °C to 125 °C. With a max clock frequency of 2 MHz, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,726 parts In-Stock

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2,726

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Anansix

USA . 2,603 parts In-Stock

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2,603

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Vyrian

USA . 472 parts In-Stock

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472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,286 parts In-Stock

1+ parts

$4.018

100+ parts

-

1k+ parts

$3.616

10k+ parts

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1,286

$4.018

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$3.616

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MKK Technologies

India . 2,342 parts In-Stock

1+ parts

$7.555

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2,342

$7.555

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DigiPath Technology Company

USA . 2,342 parts In-Stock

1+ parts

$7.555

100+ parts

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2,342

$7.555

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Corphita

USA . 1,560 parts In-Stock

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1,560

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Parana Technologies

USA . 1,455 parts In-Stock

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$4.804

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1,455

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$4.804

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Overview

Unlock the potential of your projects with the M93C06-DS3T EEPROM from STMicroelectronics, a leader in cutting-edge technology. This compact, high-performance memory solution ensures reliable data storage with a robust temperature range, making it perfect for automotive applications and beyond. With its synchronous operation and small footprint, it delivers superior efficiency without compromising on quality. Elevate your designs with ST’s trusted innovation, where reliability meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability in various environments, making this EEPROM suitable for automotive applications.

Surface Mount: YES

Being surface mount compatible allows for easy integration into modern compact circuit designs, saving board space.

Package Shape: SQUARE

The square shape design is advantageous for uniform layouts and facilitates efficient heat dissipation.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer efficiency, making it ideal for high-speed applications.

Nominal Supply Voltage / Vsup: 5 V

A nominal supply voltage of 5 V offers compatibility with standard digital circuits, simplifying integration.

No. of Terminals: 8

With 8 terminals, this EEPROM provides sufficient connections for various communication interfaces while remaining compact.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile reduce space requirements on PCBs, which is crucial for modern compact designs.

Alternate Memory Width: 8

An alternate memory width of 8 bits allows flexibility in data handling, catering to different application needs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this EEPROM is suitable for use in high-temperature environments typical of automotive applications.

Organization: 16X16

The 16X16 organization ensures efficient data storage and retrieval, optimizing performance in memory-intensive applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability and functionality in extreme cold environments, vital for automotive use.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and ensures robust connections on PCBs.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, easing integration into various circuit designs.

Maximum Seated Height: 1.1 mm

The low profile of 1.1 mm minimizes the space consumed on the PCB, allowing better layering and design flexibility.

Maximum Clock Frequency (fCLK): 2 MHz

A maximum clock frequency of 2 MHz enables fairly rapid data access, suitable for many performance-oriented applications.

Width: 3 mm

The compact width of 3 mm is ideal for space-constrained applications, making this EEPROM suitable for compact product designs.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a minimum supply voltage of 4.5 V allows for flexibility in power supply choices.

Length: 3 mm

The 3 mm length further contributes to the compactness of this EEPROM, making it suitable for multi-layered PCBs.

Temperature Grade: AUTOMOTIVE

Being rated for automotive temperature grades indicates high reliability and performance, making it perfect for vehicle applications.

Technology: CMOS

CMOS technology offers lower power consumption compared to other types, which is essential for battery-operated devices.

Parallel or Serial: SERIAL

The use of a serial interface minimizes pin counts while maintaining efficient communications, suitable for compact designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability, enhancing overall reliability.

No. of Words: 16 words

Sixteen words of storage provide a balanced capacity for various data logging and sensor applications.

Memory Width: 16

A memory width of 16 bits allows for greater data handling in applications requiring larger data chunks.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is standard for many PCB designs, ensuring compatibility with current manufacturing processes.

No. of Words Code: 16

Offering a code of 16 words signifies well-defined data organization, enhancing application efficiency.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to operate at a maximum supply voltage of 5.5 V allows for wide-ranging compatibility with various circuits.

Serial Bus Type: MICROWIRE

The MICROWIRE serial bus type is well-known for its simplicity and efficient data transfer, making integration straightforward.

Maximum Write Cycle Time (tWC): 10 ms

A maximum write cycle time of 10 ms ensures timely updates, which is critical for applications with fast data changes.

Memory Density: 256 bit

The 256-bit memory density provides efficient storage for small to medium data sets, making it suitable for a wide range of applications.

Memory IC Type: EEPROM

As an EEPROM type, this memory allows for non-volatile storage, essential for retaining information without constant power.

Technical Specifications

EEPROM M93C06-DS3T attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Alternate Memory Width:

8

Maximum Clock Frequency (fCLK):

2 MHz

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Memory Density:

256 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

MICROWIRE

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

M93C06-DS3T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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