Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M87C257-90C1TR by STMicroelectronics is a 32Kx8 OTP ROM with a max access time of 90 ns, operating at 5V. It features a compact chip carrier package and supports asynchronous operation. Ideal for applications requiring reliable data storage in commercial environments.
Median Price
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Suppliers In-Stock
3
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1k+
Vyrian
1+ parts
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Digiode
Anansix
IDEA Electronic Components Group
$2.737
$2.463
AZTECH Wire
$3.640
$3.500
$3.430
$3.360
MKK Technologies
$5.147
DigiPath Technology Company
Microchip USA
$5.475
Component Stockers USA
$99.990
Corphita
Parana Technologies
$3.272
The use of durable plastic/epoxy material ensures robustness and protection against environmental factors, making this device suitable for various applications.
Surface mount capability allows for a smaller footprint on PCBs, enabling more compact designs.
The rectangular shape is ideal for efficient space utilization in tight layouts.
Asynchronous operation benefits design flexibility and can help speed up system response times.
Common I/O type allows for simplified interfacing with other components, reducing complexity.
Standard operating voltage ensures compatibility with a wide range of electronic systems.
Single supply voltage simplifies design and reduces the need for multiple power sources.
A moderate number of terminals provides ample connectivity for various applications without being overly complex.
Chip carrier lends itself well to professional assembly processes, enhancing product reliability.
A maximum operating temperature of 70 °C ensures reliable operation in many standard environmental conditions.
This memory organization makes it suitable for applications requiring moderate data storage without additional complexity.
3-state output enhances the versatility of interfacing with multiple devices on the same bus.
With a minimum operating temperature of 0 °C, this product is suitable for a variety of indoor applications.
Matte tin finish improves solderability and durability, ensuring long-term reliability in electronic connections.
Quad terminal positioning helps in optimal space utilization and straightforward PCB designs.
Low profile height allows for compact designs while maintaining adequate electrical performance.
The width allows for easy integration into various PCB layouts without excessive space consumption.
Flexibility in supply voltage minimizes design constraints and broadens application possibilities.
A manageable length makes it suitable for compact circuit boards and confined spaces.
Commercial temperature grade ensures a wide range of applications in typical operating conditions.
CMOS technology offers low power consumption and high density, making it suitable for modern applications.
Parallel access provides high-speed data retrieval, enhancing performance in data-intensive applications.
J bend terminals are compatible with various PCB assembly methods, promoting design flexibility.
A maximum supply current of 30 mA makes it suitable for battery-operated devices without excessive drain.
The ample word capacity allows for sufficient data storage in a variety of applications.
An 8-bit memory width strikes a balance between data throughput and complexity.
Standard terminal pitch facilitates easier PCB design and component placement.
The 32K word capacity is ideal for many embedded applications, providing adequate code storage without over-specification.
A maximum supply voltage of 5.5V affords flexibility in design, accommodating slight variations in power supply.
This memory density is suitable for a range of applications requiring reliable, non-volatile storage.
As an OTP ROM, this memory type is ideal for applications requiring permanent programming without the need for reusability.
Low standby current ensures minimal energy consumption, extending battery life in portable devices.
Fast access time of 90 ns facilitates efficient data retrieval, making it suitable for high-performance applications.
OTP ROM M87C257-90C1TR attributes and parameters. Explore more OTP ROM devices from STMicroelectronics
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M87C257-90C1TR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
1N4148WS
Weitron Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
Taitron Components
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
CBP28S45MJ
Texas Instruments
The Texas Instruments CBP28S45MJ is a MIL-STD-883 Class B OTP ROM with 512x8 organization, 4096-bit memory density, and 60ns max access time. Ideal for military applications due to its MILITARY temperature grade and ceramic package material. Operating b/w -55°C to 125°C, it features a 24-terminal IN-LINE package style suitable for rugged environments.
5962-01-143-5798
Advanced Micro Devices
5962-01-143-5798 by Advanced Micro Devices is an OTP ROM with 512x8 organization, MILITARY grade, and 70ns access time. It is used in applications requiring reliable memory storage in harsh environments.
DS2406P/T&R
Maxim Integrated
DS2406P/T&R by Maxim Integrated is a 1Kx1 OTP ROM with 1024-bit memory density. Operating at 3V, it features a small outline package and industrial temperature grade. Suitable for applications requiring asynchronous operation and serial communication, it has a terminal pitch of 1.27mm and C-bend terminal form.
TBP24SA81-55N1
TBP24SA81-55N1 by Texas Instruments is a 2Kx4 OTP ROM with 8192-bit memory density and 55ns max access time. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring fast and reliable non-volatile memory storage in a compact rectangular package style.
5962-8863603LA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
DS2502S+T&R
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 128;
DS1982-F3
Dallas Semiconductor
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 2; Package Shape: ROUND; Terminal Position: RADIAL; Package Body Material: METAL;
SNC54S3708J
SNC54S3708J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 1KX8 organization, 8192-bit memory density, and TTL technology. It operates b/w -55°C to 125°C, making it ideal for military applications requiring reliable data storage in harsh environments. The package style is IN-LINE with 24 terminals on a RECTANGULAR CERAMIC body.
TBP24S10MJ
TBP24S10MJ by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at 5V, has a max access time of 75ns, and is designed for military-grade applications. The package style is in-line, with a rectangular shape and ceramic, glass-sealed body material.
JBP34S16XMFK
JBP34S16XMFK by Texas Instruments is a 4Kx4 OTP ROM memory IC with 16384-bit memory density. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. With a package style of chip carrier and terminal pitch of 1.27mm, this device is ideal for surface-mount designs requiring reliable non-volatile memory storage.
JBP34S10-20MJ
JBP34S10-20MJ by Texas Instruments is a MILITARY-grade OTP ROM with 256X4 organization, 1024-bit memory density, and operates at -55 to 125 °C. It has 16 terminals in an IN-LINE package style and is ideal for secure data storage applications in harsh environments.
JBP34L16XMFK
JBP34L16XMFK by Texas Instruments is a 4KX4 OTP ROM with 16384 bit memory density. Operating b/w -55 to 125 °C, it has a supply voltage of 5V and comes in a square chip carrier package. Ideal for military applications requiring reliable non-volatile memory storage.
AT27C4096-55PU
Atmel
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
DS2502R+T&R
Analog Devices
Analog Devices' DS2502R+T&R is a 1024-bit OTP ROM with 128x8 organization. Operating at -40 to 85°C, it has a supply voltage range of 2.8-6V and max access time of 15000ns. Ideal for industrial applications requiring small outline, thin profile memory ICs in gull wing package style.
5962-01-065-0198
Texas Instruments' 5962-01-065-0198 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
CMS68P256N-200
Texas Instruments' CMS68P256N-200 is a 256KX8 OTP ROM with 3-STATE output. Operating at 5V, it has a max access time of 200ns and supports parallel input/output. Ideal for applications requiring non-volatile memory storage in microelectronic assemblies.
5962-8851805LA
Teledyne E2v (uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .12 Amp;
JBP24S81MJ
The Texas Instruments JBP24S81MJ is a MILITARY-grade OTP ROM with 2KX4 organization, 8192-bit memory density, and 85ns max access time. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring fast non-volatile memory storage in military applications.
TBP24S81-55MJ
TBP24S81-55MJ by Texas Instruments is a MILITARY-grade OTP ROM with 2KX4 organization, 8192-bit memory density, and 55ns max access time. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring fast data retrieval in military applications.
5962-01-242-6201
Texas Instruments' 5962-01-242-6201 is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75ns max access time. It operates b/w -55 to 125 °C and has a supply voltage of 5V. Ideal for applications requiring reliable non-volatile memory in harsh environments.
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M87C257-10X3TR
STMicroelectronics
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Technology: CMOS;
M87C257-10C6X
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M87C257-10C3
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
M87C257-10X1TR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
M87C257-10C7
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M87C257-10C6
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 32768 words;
M87C257-10X3X
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
M87C257-10C1TR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M87C257-10C6XTR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Length: 13.995 mm;
M87C257-10C3TR
M87C257-10C7XTR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm;
M87C257-10C7TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M87C257-10C3XTR
OTP ROM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
M87C257-10X1X
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
M87C257-10C1XTR
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Surface Mount: YES;
M87C257-10C6TR
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
M87C257-10C1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
M87C257-10C1X
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;
M87C257-10C3X
M87C257-10C7X
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-609 Code: e3;
Supply Digital Components
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