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M74HCT646RM13TR

STMicroelectronics

M74HCT646RM13TR by STMicroelectronics

M74HCT646RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 65 ns and operates at a nominal voltage of 5V. It features independent control and supports bidirectional data flow. Ideal for military applications, it ensures reliable performance in extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,182 parts In-Stock

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4,182

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Digiode

USA . 3,233 parts In-Stock

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3,233

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Anansix

USA . 2,648 parts In-Stock

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2,648

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Distributors (Availability)

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Andel Nordic

Denmark . 2,975 parts In-Stock

1+ parts

$5.631

100+ parts

-

1k+ parts

$5.406

10k+ parts

$5.406

2,975

$5.631

-

$5.406

$5.406

IDEA Electronic Components Group

UK . 308 parts In-Stock

1+ parts

$16.839

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-

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$15.155

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308

$16.839

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$15.155

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AZTECH Wire

Italy . 324 parts In-Stock

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$17.360

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324

$17.360

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Ampacity Inc.

Singapore . 1,234 parts In-Stock

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$20.000

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1,234

$20.000

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MKK Technologies

India . 55 parts In-Stock

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$31.664

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55

$31.664

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DigiPath Technology Company

USA . 55 parts In-Stock

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$31.664

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55

$31.664

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Microchip USA

USA . 373 parts In-Stock

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$42.140

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373

$42.140

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Corphita

USA . 3,839 parts In-Stock

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3,839

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Parana Technologies

USA . 665 parts In-Stock

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$20.133

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665

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$20.133

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Overview

Elevate your designs with the M74HCT646RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust bus driver and transceiver offers exceptional performance with low propagation delays and high reliability, perfect for demanding applications in automotive, industrial, and communication systems. With its compact design and superior quality, you’ll experience seamless integration and enhanced efficiency, empowering you to achieve more while minimizing power consumption. Choose STMicroelectronics for unmatched durability and excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and reliability, making it suitable for various applications.

Propagation Delay At Nominal Supply: 65 ns

A low propagation delay is vital for achieving fast data transmission, enhancing overall system performance.

Surface Mount: YES

The surface mount feature allows for compact design and easy integration into modern circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient space utilization on PCBs.

No. of Bits: 8

With 8 bits, this product can handle substantial data transmission, making it versatile for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V increases compatibility with other components.

Power Supplies (V): 5

A consistent power supply requirement simplifies design and reduces potential errors during integration.

No. of Terminals: 24

Having 24 terminals provides ample connections for versatile configurations and easier signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables high-density mounting on circuit boards, saving space.

Maximum I (ol): 6 Amp

A high output current capability of 6 amps allows the device to drive larger loads effectively.

Propagation Delay (tpd): 75 ns

This additional specification for propagation delay helps in understanding performance limits under different conditions.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature applications, ensuring reliability in harsh environments.

Output Characteristics: 3-STATE

3-state output characteristics allow for flexible data lines and efficient bus control, improving interoperability.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides better sync and control in digital circuits, enhancing overall reliability.

Minimum Operating Temperature: -55 °C

The product's ability to operate at -55 °C makes it ideal for extreme temperature applications, ensuring reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity and minimizes oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide flexible mounting options, enhancing versatility in PCB design.

No. of Ports: 2

Two ports allow for bidirectional communication, making it suitable for intricate data exchange.

Maximum Seated Height: 2.65 mm

A compact seated height facilitates tighter layouts and improves space efficiency in design.

Width: 7.5 mm

A narrow width of 7.5 mm allows for efficient use of space in dense circuit designs.

Output Polarity: TRUE

True output polarity enhances signal integrity, making it suitable for use in critical applications.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V ensures functionality under various operational conditions.

Length: 15.4 mm

A length of 15.4 mm strikes a balance between size and performance, ideal for compact designs.

Temperature Grade: MILITARY

A military-grade temperature classification guarantees robust performance in extreme environments.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making it a modern choice for designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and connectivity to circuit boards, enhancing assembly efficiency.

Packing Method: TR

Tape and reel packing enables efficient automated handling and placement in production environments.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm offers compatibility with many PCB layouts, facilitating easy design integration.

Count Direction: BIDIRECTIONAL

Bidirectional count direction enhances the versatility of the device in data transmission applications.

Control Type: INDEPENDENT CONTROL

Independent control allows precise operation of each port, increasing flexibility in data handling.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides safety margins and ensures robust performance without risking damage.

Technical Specifications

Bus Driver & Transceivers M74HCT646RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

DIRECTION CONTROL; SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED OR REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

65 ns

Propagation Delay (tpd):

75 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

M74HCT646RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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