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M74HCT573RM13TR

STMicroelectronics

M74HCT573RM13TR by STMicroelectronics

M74HCT573RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 45 ns and operates at a nominal voltage of 5V. Its compact SO package and military-grade temperature range make it ideal for reliable data transmission in harsh environments. With a max output current of 6A, it's perfect for high-performance applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 5,052 parts In-Stock

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Anansix

USA . 1,424 parts In-Stock

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LWI Electronics Inc

India . 1,000 parts In-Stock

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SPM Sales

USA . 805 parts In-Stock

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Digiode

USA . 697 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Connector Distribution Corp

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Right Parts Inc.

USA . 223 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 140 parts In-Stock

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$5.556

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140

$5.556

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Andel Nordic

Denmark . 3,827 parts In-Stock

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$7.324

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$7.031

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$7.031

3,827

$7.324

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$7.031

IDEA Electronic Components Group

UK . 1,552 parts In-Stock

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$12.232

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$11.009

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AZTECH Wire

Italy . 426 parts In-Stock

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$16.180

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MKK Technologies

India . 2,276 parts In-Stock

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$23.002

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DigiPath Technology Company

USA . 2,276 parts In-Stock

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$23.002

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Ampacity Inc.

Singapore . 1,114 parts In-Stock

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$52.000

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Component Stockers USA

USA . 271 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,026 parts In-Stock

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Corphita

USA . 4,335 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,017 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Parana Technologies

USA . 2,058 parts In-Stock

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Kepictronics

USA . 555 parts In-Stock

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ChipstoGo Electronic ltd

UK . 150 parts In-Stock

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Overview

Unlock unparalleled performance with the M74HCT573RM13TR from STMicroelectronics, a leader in innovation and reliability. Designed for seamless data transmission, this 8-bit bus driver ensures low power consumption and high-speed operation, making it perfect for automotive and industrial applications. Experience enhanced durability and efficiency while enjoying the peace of mind that comes from using a product crafted by a trusted manufacturer renowned for quality and excellence. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 45 ns

With a low propagation delay, this product allows for fast signal transmission, enhancing overall circuit performance.

Surface Mount: YES

Being surface mount technology (SMT) compatible enables efficient use of PCB space, contributing to compact designs.

Package Shape: RECTANGULAR

The rectangular shape aids in the systematic layout of components on the PCB, optimizing space utilization.

No. of Bits: 8

With 8 bits, it provides adequate data handling capabilities for a variety of applications, supporting diverse communication scenarios.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply ensures compatibility with many existing systems, simplifying integration.

Load Capacitance (CL): 50 pF

The load capacitance specification supports reliable operation in high-speed applications, minimizing signal degradation.

Power Supplies (V): 5

Single voltage power supply requirement enhances ease of use and reduces complexity in design.

No. of Terminals: 20

With 20 terminals, the product offers multiple I/O options, allowing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes space-saving design without compromising performance.

Maximum I (ol): 6 Amp

A maximum output current of 6A ensures robust performance even in high-load applications, enhancing system reliability.

Propagation Delay (tpd): 59 ns

The propagation delay is still competitive, ensuring efficient data transmission in various digital applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes this product suitable for harsh environments and demanding applications.

Output Characteristics: 3-STATE

3-state output enables versatile bus configurations and allows multiple devices to share the same communication lines.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature ensures functionality in extremely cold environments, making it suitable for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish provides excellent solderability and corrosion resistance, ensuring dependable connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easy layout and integration into various PCB designs.

No. of Ports: 2

The presence of 2 ports allows for greater connectivity options, supporting complex communication requirements.

Maximum Seated Height: 2.65 mm

The low profile can be beneficial in space-constrained environments, allowing for more compact designs.

Width: 7.5 mm

A moderate width ensures ease of integration into standard PCB layouts while still occupying minimal space.

Output Polarity: TRUE

True output polarity simplifies the design of circuits, ensuring compatibility with standard digital logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage allows for flexibility in powering the device with various power supply options.

Maximum Time At Peak Reflow Temperature (s): 30

A defined maximum time at peak reflow temperature ensures reliability during assembly and reduction of thermal stress.

Peak Reflow Temperature °C: 260

The elevated peak reflow temperature accommodates robust soldering processes, enhancing the durability of the connections.

Length: 12.8 mm

Compact length contributes to space efficiency on the PCB, making it ideal for portable electronics.

Temperature Grade: MILITARY

The military-grade specification indicates high reliability and performance in demanding conditions, suitable for defense applications.

Technology: CMOS

The CMOS technology provides low power consumption while maintaining high speed, ideal for modern electronic applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and provides good mechanical stability on the PCB.

Packing Method: TR

The tape and reel packing method allows for easy automated assembly and efficient handling in manufacturing processes.

Terminal Pitch: 1.27 mm

The standard terminal pitch ensures compatibility with various PCB designs and simplifies layout considerations.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, which can be managed during storage and handling for long-term reliability.

Maximum Supply Voltage (Vsup): 5.5 V

The extended maximum supply voltage ensures compatibility with a range of power supply configurations, providing design flexibility.

Technical Specifications

Bus Driver & Transceivers M74HCT573RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

59 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HCT573RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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