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M74HCT373TTR

STMicroelectronics

M74HCT373TTR by STMicroelectronics

M74HCT373TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 45 ns and operates at a nominal voltage of 5V. Its compact design features a thin profile, ideal for space-constrained applications. This CMOS device supports 3-state outputs, making it suitable for various digital circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,095 parts In-Stock

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Digiode

USA . 4,010 parts In-Stock

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Connector Distribution Corp

USA . 2,500 parts In-Stock

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Right Parts Inc.

USA . 2,500 parts In-Stock

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Anansix

USA . 647 parts In-Stock

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647

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Distributors (Availability)

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Andel Nordic

Denmark . 520 parts In-Stock

1+ parts

$2.333

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$2.240

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$2.240

520

$2.333

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$2.240

Microchip USA

USA . 431 parts In-Stock

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$6.859

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431

$6.859

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IDEA Electronic Components Group

UK . 2,294 parts In-Stock

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$10.212

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$9.191

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$10.212

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AZTECH Wire

Italy . 1,200 parts In-Stock

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$14.460

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MKK Technologies

India . 72 parts In-Stock

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$19.203

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DigiPath Technology Company

USA . 72 parts In-Stock

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$19.203

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Perfect Parts

USA . 8,288 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,045 parts In-Stock

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Kepictronics

USA . 5,500 parts In-Stock

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Authorized Procurement Solutions

USA . 5,200 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,030 parts In-Stock

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Parana Technologies

USA . 1,009 parts In-Stock

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$12.210

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$12.210

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Corphita

USA . 1,009 parts In-Stock

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Overview

Elevate your designs with the M74HCT373TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This 8-bit bus driver promises reliable performance with its robust 3-state outputs and exceptional speed, perfect for demanding applications. With its compact size and military-grade durability, it seamlessly integrates into space-constrained environments while delivering superior efficiency. Trust STMicroelectronics for unmatched quality and innovation that empowers your projects to excel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance in various environmental conditions.

Propagation Delay At Nominal Supply: 45 ns

Fast signal transmission allows for efficient data processing, making it suitable for high-speed applications.

Surface Mount: YES

Space-efficient design makes it ideal for compact circuit boards and modern electronic devices.

Package Shape: RECTANGULAR

Rectangular shape provides flexibility in layout design and efficient use of PCB space.

No. of Bits: 8

Supports 8-bit data processing, allowing it to interface with a wide range of digital systems.

Nominal Supply Voltage / Vsup: 5 V

Standard supply voltage ensures compatibility with most electronic systems.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes delays and enhances performance in high-frequency applications.

Power Supplies (V): 5

Single voltage supply simplifies the design and reduces component count.

No. of Terminals: 20

Sufficient number of terminals to accommodate various inputs and outputs, facilitating complex connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design enables easy integration into space-constrained applications.

Maximum I (ol): 6 Amp

High output current capability supports demanding electrical loads and ensures reliable operation.

Propagation Delay (tpd): 56 ns

Maintains fast data transfer speeds, crucial for real-time processing applications.

Maximum Operating Temperature: 125 °C

High-temperature rating makes it suitable for use in harsh environments.

Output Characteristics: 3-STATE

Flexible output states enhance device interoperability and control in complex circuits.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures reliable performance in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Robust terminal finish enhances solderability and improves overall connection reliability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options, facilitating diverse applications.

No. of Ports: 2

Multiple ports allow for greater connectivity and data transfer between devices.

Maximum Seated Height: 1.2 mm

Low seated height supports streamlined designs important for slim electronics.

Width: 4.4 mm

Compact width promotes space-saving designs on PCB layouts.

Output Polarity: TRUE

True output polarity allows compatibility with standard digital logic levels.

Minimum Supply Voltage (Vsup): 4.5 V

Flexible voltage range accommodates different power supply configurations.

Maximum Time At Peak Reflow Temperature: 40 s

Adaptable to various soldering processes, ensuring effective assembly without damaging the component.

Peak Reflow Temperature: 260 C

High peak temperature capability ensures robustness during the soldering process.

Length: 6.5 mm

Compact length supports space-efficient PCB designs and allows for easy integration.

Temperature Grade: MILITARY

Military-grade components are built for durability and reliability in extreme applications.

Technology: CMOS

CMOS technology ensures low power consumption and high efficiency in operations.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical strength and ease of soldering.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density placements on PCBs, maximizing design efficiency.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity ensures the component maintains reliability during handling and assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Adequate voltage threshold allows flexibility in operation while maintaining integrity and performance.

Technical Specifications

Bus Driver & Transceivers M74HCT373TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

M74HCT373TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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