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M74HCT373RM13TR

STMicroelectronics

M74HCT373RM13TR by STMicroelectronics

M74HCT373RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 45 ns and operates at a nominal voltage of 5V. It features a compact SO package, ideal for space-constrained applications. This CMOS device supports dual ports and offers 3-state output characteristics.

Median Price

$0.188

Lifecycle Status

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8

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1k+

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DigiKey

USA . 319 parts In-Stock

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Digiode

USA . 328 parts In-Stock

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$0.542

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Vyrian

USA . 4,507 parts In-Stock

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LWI Electronics Inc

India . 1,942 parts In-Stock

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Anansix

USA . 1,246 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 743 parts In-Stock

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A&K Electronics

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Bristol Electronics

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Corphita

USA . 2,980 parts In-Stock

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$0.513

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Andel Nordic

Denmark . 3,651 parts In-Stock

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$7.101

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$6.817

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$6.817

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$6.817

Microchip USA

USA . 450 parts In-Stock

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$18.885

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$18.885

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IDEA Electronic Components Group

UK . 1,724 parts In-Stock

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$25.055

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MKK Technologies

India . 1,344 parts In-Stock

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DigiPath Technology Company

USA . 1,344 parts In-Stock

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Component Stockers USA

USA . 547 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 6,198 parts In-Stock

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Authorized Procurement Solutions

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Alle Elektronik GmbH

Germany . 4,132 parts In-Stock

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 743 parts In-Stock

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Glotronic Ltd.

UK . 594 parts In-Stock

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Parana Technologies

USA . 353 parts In-Stock

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$29.957

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Overview

Unlock seamless data communication with the M74HCT373RM13TR from STMicroelectronics, your trusted partner in high-quality electronic components. This versatile bus driver excels in efficiency and reliability, making it ideal for a range of applications from industrial automation to consumer electronics. With robust 3-state outputs and exceptional temperature resilience, this device not only enhances performance but also ensures durability, delivering unmatched value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures robust protection against environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 45 ns

A low propagation delay allows for faster data transmission, enhancing overall system performance.

Surface Mount: YES

Being a surface mount component simplifies the assembly process and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space in compact designs.

No. of Bits: 8

An 8-bit data width facilitates efficient data handling, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal voltage of 5V ensures compatibility with many existing systems.

Load Capacitance (CL): 50 pF

A low load capacitance provides better signal integrity and faster switching speeds.

Power Supplies (V): 5

Compatible with common 5V power supplies, ensuring ease of integration into designs.

No. of Terminals: 20

A sufficient number of terminals allows for versatile connectivity options in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save space, ideal for compact and high-density applications.

Maximum I (ol): 6 Amp

A maximum output current of 6A allows the driver to support various loads, ensuring flexibility in design.

Propagation Delay (tpd): 56 ns

The propagation delay ensures fast data transfer, which is crucial for high-speed circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature rating makes it suitable for harsh and demanding environments.

Output Characteristics: 3-STATE

3-state output characteristics provide versatile functionality, enabling easy interfacing with multiple devices.

Minimum Operating Temperature: -55 °C

A wide temperature range guarantees reliable operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning promotes design flexibility and ease of integration into diverse PCB layouts.

No. of Ports: 2

Having two ports allows for easier and more flexible data communication between devices.

Maximum Seated Height: 2.65 mm

A low seated height contributes to compactness and fits in tighter spaces on the PCB.

Width: 7.5 mm

The width is tailored for modern PCB design, ensuring easy routing and placement.

Output Polarity: TRUE

The true output polarity is beneficial for straightforward integration in systems expecting standard output levels.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum voltage requirement ensures compatibility with systems that operate at lower power settings.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for compatibility with standard reflow soldering processes, ensuring reliability in assembly.

Peak Reflow Temperature °C: 260

Withstand high reflow temperatures, ensuring proper soldering while maintaining component integrity.

Length: 12.8 mm

The compact length contributes to efficient use of board space, making it ideal for miniaturized devices.

Temperature Grade: MILITARY

The military-grade temperature specification ensures high reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption while providing high-speed operation and noise resilience.

Terminal Form: GULL WING

Gull-wing terminals allow for easier soldering and better mechanical support on PCBs.

Packing Method: TR

Tape and reel packing method facilitates automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

The standardized terminal pitch enhances design compatibility with existing layouts and components.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 suggests moderate sensitivity to moisture, balancing reliability with ease of handling.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage threshold of 5.5V offers design safety margins, ensuring stable operation.

Technical Specifications

Bus Driver & Transceivers M74HCT373RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

56 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HCT373RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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