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M74HC74TTR

STMicroelectronics

M74HC74TTR by STMicroelectronics

M74HC74TTR by STMicroelectronics is a dual positive edge-triggered flip-flop in a compact 14-terminal SOIC package. It operates b/w 2-6V, with a max frequency of 21MHz and propagation delay of just 225ns. Ideal for high-speed digital applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,439 parts In-Stock

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4,439

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ComSIT Distribution GmbH

Germany . 3,636 parts In-Stock

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3,636

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Vyrian

USA . 2,640 parts In-Stock

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2,640

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Anansix

USA . 2,475 parts In-Stock

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2,475

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Microfarads

USA . 289 parts In-Stock

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289

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Distributors (Availability)

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Microchip USA

USA . 473 parts In-Stock

1+ parts

$9.382

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473

$9.382

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AZTECH Wire

Italy . 437 parts In-Stock

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$12.550

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437

$12.550

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IDEA Electronic Components Group

UK . 155 parts In-Stock

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$23.505

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$21.155

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155

$23.505

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$21.155

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MKK Technologies

India . 977 parts In-Stock

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$44.200

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977

$44.200

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DigiPath Technology Company

USA . 977 parts In-Stock

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$44.200

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977

$44.200

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Perfect Parts

USA . 18,222 parts In-Stock

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18,222

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Corphita

USA . 1,481 parts In-Stock

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1,481

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Parana Technologies

USA . 1,018 parts In-Stock

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$28.104

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1,018

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$28.104

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Overview

Unlock the power of precision with the M74HC74TTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality latch and flip-flop device offers exceptional performance for a variety of applications, ensuring reliable data storage and processing. With its compact design and robust operational capabilities, it delivers unmatched efficiency, making it perfect for advanced electronics projects. Elevate your designs today and experience the advantage of ST’s excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures a lightweight and cost-effective design while maintaining durability.

Surface Mount: YES

Surface mount design allows for easy integration into modern PCBs, enhancing the overall assembly efficiency.

No. of Functions: 2

Having two functions in one package increases versatility, enabling more compact circuit designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, making it ideal for density-sensitive applications.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal supply voltage of 4.5 V is typical for a range of applications and simplifies power supply design.

Load Capacitance (CL): 50 pF

A low load capacitance of 50 pF helps to reduce power consumption and improves switching speed.

Power Supplies (V): 2/6

Compatible with a wide range of power supplies, this part is versatile for various design requirements.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for complex designs while keeping a compact form factor.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile allows for low-profile designs, making it suitable for portable and space-constrained devices.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this latch/flip-flop can drive significant loads, which is excellent for high-performance applications.

Propagation Delay (tpd): 225 ns

A propagation delay of 225 ns ensures fast response times, which is essential for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

Its high operating temperature rating makes it suitable for demanding environments, including industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge triggering ensures precise timing control, essential for reliable digital logic operations.

Minimum Operating Temperature: -55 °C

The extended temperature range allows this device to perform reliably in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish ensures excellent electrical performance and prevents oxidation, enhancing reliability.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in PCB layout, facilitating easier routing of signals.

Maximum Seated Height: 1.2 mm

Its low seating height is beneficial for slim design requirements, making it suitable for modern electronic devices.

Width: 4.4 mm

A narrow width allows for efficient use of PCB space, especially in densely packed layouts.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for flexibility in circuit design, making integration easier.

Minimum Supply Voltage (Vsup): 2 V

Operating down to 2 V increases the range of applications, especially for low-power designs.

Length: 5 mm

A compact length contributes to overall space savings in the design, catering to miniaturization trends.

Temperature Grade: MILITARY

This military grade specification assures high reliability and durability, ideal for critical applications.

Maximum Frequency At Nominal Supply: 21 MHz

With a maximum operational frequency of 21 MHz, this latch/flip-flop can handle moderate-speed digital signals effectively.

Technology: CMOS

The CMOS technology provides low power consumption along with high noise immunity, making this product more efficient.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and facilitates automated assembly processes.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch strikes a balance between density and manufacturability, suitable for modern electronic applications.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz ensures compatibility with a variety of digital circuits and systems.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, making proper handling and storage crucial but manageable.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6 V provides flexibility in voltage applications, ensuring compatibility across a range of devices.

Technical Specifications

Latches & Flip-Flops M74HC74TTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

M74HC74TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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