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M74HC574RM13TR

STMicroelectronics

M74HC574RM13TR by STMicroelectronics

M74HC574RM13TR by STMicroelectronics is an 8-bit bus driver with a 3-state output, ideal for high-speed data transmission. It operates b/w 2V and 6V, featuring a max frequency of 21 MHz and a propagation delay of just 285 ns. Its compact design suits various applications in military-grade electronics.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 820 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

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$0.500

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820

$0.770

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Digiode

USA . 4,723 parts In-Stock

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Vyrian

USA . 2,994 parts In-Stock

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Zilex Electronics Inc.

Canada . 2,378 parts In-Stock

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Anansix

USA . 2,322 parts In-Stock

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Sunrise Surplus Inc.

USA . 817 parts In-Stock

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ComSIT Distribution GmbH

Germany . 745 parts In-Stock

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745

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ACDS - Activité Composants Distribution Service

France . 193 parts In-Stock

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Elcom Components

USA . 38 parts In-Stock

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38

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 3,548 parts In-Stock

1+ parts

$3.614

100+ parts

-

1k+ parts

$3.470

10k+ parts

$3.470

3,548

$3.614

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$3.470

$3.470

Microchip USA

USA . 409 parts In-Stock

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$6.812

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409

$6.812

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$9.575

100+ parts

$8.713

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$7.852

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50

$9.575

$8.713

$7.852

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AZTECH Wire

Italy . 274 parts In-Stock

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$15.350

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274

$15.350

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IDEA Electronic Components Group

UK . 1,438 parts In-Stock

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$18.691

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$16.822

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1,438

$18.691

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$16.822

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MKK Technologies

India . 1,711 parts In-Stock

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$35.147

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DigiPath Technology Company

USA . 1,711 parts In-Stock

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$35.147

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Perfect Parts

USA . 15,430 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,005 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,670 parts In-Stock

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4,670

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Parana Technologies

USA . 851 parts In-Stock

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$22.348

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Authorized Procurement Solutions

USA . 523 parts In-Stock

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523

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Cyclops Electronics Ltd (Excess)

UK . 193 parts In-Stock

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Glotronic Ltd.

UK . 154 parts In-Stock

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Corphita

USA . 118 parts In-Stock

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Overview

Unlock the power of precision with the M74HC574RM13TR from STMicroelectronics! Renowned for their exceptional quality and innovation, STMicroelectronics delivers this 8-bit bus driver, perfect for seamless data transmission in high-performance applications. With superior reliability in extreme conditions, you gain unmatched durability and efficiency. Elevate your projects with a robust solution that ensures outstanding performance, making your designs smarter and more reliable!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, enhancing the product's longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB, enabling efficient layout design.

No. of Bits: 8

An 8-bit configuration is versatile for various applications, offering adequate data handling capabilities for many digital systems.

Nominal Supply Voltage / Vsup: 4.5 V

Operating at a nominal voltage of 4.5 V makes this device compatible with a wide range of applications and systems.

Load Capacitance (CL): 50 pF

Low load capacitance minimizes power consumption and signal degradation, promoting high-speed performance.

Power Supplies (V): 2/6

This dual voltage capability allows the driver to operate in diverse environments, catering to different system requirements.

No. of Terminals: 20

With 20 terminals, this product offers extensive connectivity options for complex signal interfacing.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to reduced board space requirement, facilitating higher component density.

Maximum I (ol): 6 Amp

Supporting a high output current of 6 Amps allows this device to handle demanding applications with ease.

Propagation Delay (tpd): 285 ns

A propagation delay of 285 ns offers fast response times, making it suitable for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C makes this product ideal for harsh environments and industrial applications.

Output Characteristics: 3-STATE

The 3-state output feature allows for better control of bus systems, enabling multiple devices to share the same communication lines.

Trigger Type: POSITIVE EDGE

A positive edge trigger makes synchronization with other digital components straightforward, ensuring reliable performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this device is suited for extreme conditions, particularly in military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures optimal conductivity and corrosion resistance, improving overall reliability.

Terminal Position: DUAL

The dual terminal position facilitates easy mounting and ensures flexible design options for PCB layout.

No. of Ports: 2

Having 2 ports allows for versatile connections and data routing, enhancing the device's functionality in applications.

Maximum Seated Height: 2.65 mm

A low seated height helps decrease overall device profile, contributing to slimmer designs in space-limited projects.

Width: 7.5 mm

A width of 7.5 mm contributes to compact designs, making it easier to fit into small form-factor products.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, making integration into existing systems easier.

Minimum Supply Voltage (Vsup): 2 V

A minimum operating voltage of 2 V enhances flexibility for low-power applications, driving energy-efficient designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product is optimized for efficient manufacturing processes.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance ensures reliability during assembly and minimizes the risk of damage during soldering.

Length: 12.8 mm

A compact length of 12.8 mm helps facilitate efficient layout designs in multi-component assemblies.

Temperature Grade: MILITARY

MILITARY-grade rating guarantees high durability and reliability under extreme conditions, making it perfect for defense applications.

Maximum Frequency At Nominal Supply: 21,000,000 Hz

A high maximum frequency supports demanding signal processing requirements, making it suitable for advanced communication systems.

Technology: CMOS

CMOS technology offers low power consumption and high-density integration, making this device energy-efficient and cost-effective.

Terminal Form: GULL WING

The gull wing terminal form provides excellent soldering attributes, enhancing the reliability of PCB connections.

Packing Method: TR

Tape and reel packing allows for efficient automated assembly processes, ensuring streamlined production.

Terminal Pitch: 1.27 mm

1.27 mm pitch supports a compact layout and is standard for many applications, simplifying component placement on PCBs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the device has moderate sensitivity to moisture, suggesting standard precautions are necessary during handling and storage.

Maximum Supply Voltage (Vsup): 6 V

With a maximum supply voltage of 6 V, this product is versatile enough to accommodate varying application requirements.

Technical Specifications

Bus Driver & Transceivers M74HC574RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

M74HC574RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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