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M74HC573RM13TR

STMicroelectronics

M74HC573RM13TR by STMicroelectronics

M74HC573RM13TR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 33 ns and operates b/w 2-6 V. Its compact SO package features a dual terminal form, ideal for military applications. With a max temp of 125 °C, it ensures reliable performance in harsh environments.

Median Price

$0.900

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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DF Sales Co.

USA . 60 parts In-Stock

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$0.900

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60

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DF Sales Co.

USA . 60 parts In-Stock

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$0.900

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Vyrian

USA . 6,871 parts In-Stock

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Digiode

USA . 3,118 parts In-Stock

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Chip Stock

USA . 2,770 parts In-Stock

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Connector Distribution Corp

USA . 1,869 parts In-Stock

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Right Parts Inc.

USA . 1,869 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,340 parts In-Stock

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Anansix

USA . 857 parts In-Stock

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Pegasus Components GmbH

Germany . 635 parts In-Stock

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Inventory MP

USA . 447 parts In-Stock

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Bristol Electronics

USA . 447 parts In-Stock

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J2 Sourcing AB

Sweden . 378 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 259 parts In-Stock

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Dan-Mar Components

USA . 259 parts In-Stock

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Component Sense

UK . 154 parts In-Stock

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$0.531

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$0.531

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$0.531

154

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$0.531

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 1 parts In-Stock

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$2.000

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1

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Andel Nordic

Denmark . 2,250 parts In-Stock

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$8.057

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$7.734

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$7.734

2,250

$8.057

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$7.734

$7.734

IDEA Electronic Components Group

UK . 654 parts In-Stock

1+ parts

$9.159

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$8.243

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654

$9.159

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MKK Technologies

India . 948 parts In-Stock

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$17.222

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948

$17.222

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DigiPath Technology Company

USA . 948 parts In-Stock

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$17.222

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$17.222

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$17.416

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$15.849

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$14.281

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$17.416

$15.849

$14.281

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AZTECH Wire

Italy . 983 parts In-Stock

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$19.530

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RC Electronics

USA . 59,261 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

USA . 4,792 parts In-Stock

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Kepictronics

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Corphita

USA . 4,153 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,718 parts In-Stock

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Perfect Parts

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Parana Technologies

USA . 191 parts In-Stock

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$10.950

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Overview

Elevate your designs with the M74HC573RM13TR from STMicroelectronics, a trusted leader in quality semiconductor solutions. This 8-bit Bus Driver & Transceiver ensures seamless data transfer and robust performance for a variety of applications, enhancing reliability in your projects. With exceptional speed and temperature resilience, it guarantees durability while simplifying your circuit designs. Choose STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 33 ns

A low propagation delay ensures fast signal transmission, enhancing the overall performance of the bus driver.

Surface Mount: YES

Surface mount technology facilitates easy integration into compact designs, saving space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout and placement on PCBs, optimizing the design.

No. of Bits: 8

An 8-bit configuration supports handling of 8 separate data lines simultaneously, enabling efficient data transfer.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V ensures compatibility with standard low-voltage systems.

Load Capacitance (CL): 50 pF

A low load capacitance allows for rapid switching times and reduces power consumption.

Power Supplies (V): 2/6

Flexible power supply range makes it versatile for different applications and configurations.

No. of Terminals: 20

A sufficient number of terminals allows for multiple connections, enhancing device integration capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, minimizing board footprint.

Maximum I (ol): 6 Amp

A high output current capability (6A) supports robust performance in demanding applications.

Propagation Delay (tpd): 235 ns

While higher than the nominal delay, this propagation delay can still facilitate adequate speed for various functions.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this product suitable for applications in harsh environments.

Output Characteristics: 3-STATE

3-state output allows for greater flexibility in bus systems, enabling easy control of multiple devices.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enhances reliability in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent solderability and enhanced connection reliability.

Terminal Position: DUAL

Dual terminal positioning allows for better layout and compatibility with various circuit designs.

No. of Ports: 2

Two ports provide versatility in connectivity, enabling complex communication between devices.

Maximum Seated Height: 2.65 mm

A low seated height is ideal for compact designs, allowing for thinner end products.

Width: 7.5 mm

A narrow width makes it appropriate for high-density applications, preserving layout space.

Output Polarity: TRUE

True output polarity simplifies integration with standard logic levels in digital circuits.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage allows for compatibility with a wide range of devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak temperatures ensures reliable soldering without damaging the component.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows compatibility with modern soldering processes.

Length: 12.8 mm

A compact length supports integration into smaller devices, catering to modern electronic applications.

Temperature Grade: MILITARY

MIL-STD qualification ensures reliability and performance in demanding military applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making it efficient for modern electronics.

Terminal Form: GULL WING

Gull wing terminals offer better mechanical strength and easy soldering, increasing assembly reliability.

Packing Method: TR

Reel packaging (TR) allows for efficient automated assembly processes, enhancing production efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch facilitates compatibility with existing PCB designs, simplifying integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates adequate handling precautions are required, ensuring the product remains reliable after installation.

Maximum Supply Voltage (Vsup): 6 V

The ability to operate at a maximum supply voltage of 6V provides flexibility for various power supply configurations.

Technical Specifications

Bus Driver & Transceivers M74HC573RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

33 ns

Propagation Delay (tpd):

235 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

M74HC573RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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