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M74HC374RM13TR

STMicroelectronics

M74HC374RM13TR by STMicroelectronics

M74HC374RM13TR by STMicroelectronics is an 8-bit bus driver with a 3-state output, ideal for high-speed data transfer. It operates b/w 2V and 6V, featuring a max frequency of 21 MHz and a propagation delay of just 285 ns. Its compact design suits various electronic applications in military-grade environments.

Median Price

$1.250

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 662 parts In-Stock

1+ parts

-

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$1.250

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662

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$1.250

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Distributors (In-Stock)

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Digiode

USA . 4,718 parts In-Stock

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$2.498

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4,718

$2.498

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Component Electronics Inc.

Canada . 62 parts In-Stock

1+ parts

$3.080

100+ parts

$2.310

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$2.000

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62

$3.080

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$2.000

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Vyrian

USA . 3,817 parts In-Stock

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Anansix

USA . 1,590 parts In-Stock

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1,590

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ComSIT Distribution GmbH

Germany . 1,280 parts In-Stock

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1,280

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

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1,000

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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1,000

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R&J Components

USA . 577 parts In-Stock

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577

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Bristol Electronics

USA . 155 parts In-Stock

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$0.366

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$0.211

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155

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$0.366

$0.211

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Microfarads

USA . 149 parts In-Stock

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149

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Distributors (Availability)

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Corphita

USA . 3,702 parts In-Stock

1+ parts

$2.367

100+ parts

-

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3,702

$2.367

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Andel Nordic

Denmark . 496 parts In-Stock

1+ parts

$4.659

100+ parts

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$4.472

10k+ parts

$4.472

496

$4.659

-

$4.472

$4.472

IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$9.992

100+ parts

-

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$8.993

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943

$9.992

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$8.993

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MKK Technologies

India . 41 parts In-Stock

1+ parts

$18.790

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41

$18.790

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DigiPath Technology Company

USA . 41 parts In-Stock

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$18.790

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41

$18.790

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Microchip USA

USA . 116 parts In-Stock

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$28.908

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116

$28.908

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Component Stockers USA

USA . 439 parts In-Stock

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$99.990

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439

$99.990

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A-Z Elektronik GmbH

Germany . 7,373 parts In-Stock

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7,373

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,915 parts In-Stock

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4,915

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Perfect Parts

USA . 4,499 parts In-Stock

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4,499

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Cyclops Electronics Ltd (Excess)

UK . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 798 parts In-Stock

1+ parts

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$11.947

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798

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$11.947

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Overview

Unlock the power of seamless data transfer with the M74HC374RM13TR from STMicroelectronics. This robust 8-bit bus driver excels in performance, offering unmatched reliability for your applications, whether in automotive, industrial, or consumer electronics. With its superior quality and advanced design, you can expect lower power consumption and faster signal integrity, ensuring your systems run efficiently. Elevate your projects with ST’s trusted engineering expertise and enjoy the benefits of a high-performance solution that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and easier automated assembly, making it suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and facilitates integration into various circuit layouts.

No. of Bits: 8

An 8-bit configuration provides ample data handling capabilities for many applications, balancing complexity and performance.

Nominal Supply Voltage / Vsup: 4.5 V

The nominal supply voltage permits compatibility with a wide range of power sources, suitable for diverse applications.

Load Capacitance (CL): 50 pF

A low load capacitance ensures faster switching speeds, enhancing the overall performance of the circuit.

Power Supplies (V): 2/6

The ability to operate across a range of voltage supplies (2V-6V) provides flexibility in power management for different applications.

No. of Terminals: 20

With 20 terminals, this device supports multiple I/O options, allowing for extensive connectivity within complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for limited spaces, enabling compact device designs without compromising performance.

Maximum I (ol): 6 Amp

A maximum output current of 6 Amps allows for robust power delivery, making it suitable for high-demand applications.

Propagation Delay (tpd): 285 ns

A relatively low propagation delay ensures quick data transmission, enhancing the overall speed and efficiency of the system.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for use in demanding environments where heat could be a factor.

Output Characteristics: 3-STATE

The 3-state output feature allows for versatile signal management, enabling effective communication in multi-device scenarios.

Trigger Type: POSITIVE EDGE

Positive edge triggering facilitates synchronization in digital circuits, ensuring that data is processed at the right moment.

Minimum Operating Temperature: -55 °C

The capability to function in low temperatures makes this device ideal for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, leading to improved performance and reliability.

Terminal Position: DUAL

Dual terminal positioning offers flexible mounting options, suitable for a variety of PCB designs.

No. of Ports: 2

Having 2 ports enhances the connectivity options, allowing for more complex circuit configurations.

Maximum Seated Height: 2.65 mm

The low seated height is ideal for space-constrained applications, providing a slimmer profile for compact device designs.

Width: 7.5 mm

The 7.5 mm width strikes a balance between compact size and ease of handling during assembly.

Output Polarity: TRUE

True output polarity allows for straightforward integration into systems with established logic levels.

Minimum Supply Voltage (Vsup): 2 V

With a minimum supply voltage of 2V, this product can efficiently operate in battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures that the device can withstand high-temperature soldering processes.

Peak Reflow Temperature °C: 260

The ability to endure reflow soldering at 260 °C minimizes the risk of damage during the assembly process.

Length: 12.8 mm

The compact length enables integration into tight spaces, ideal for modern, miniaturized electronic devices.

Temperature Grade: MILITARY

The military temperature grade ensures durability and reliability in extreme conditions, suitable for critical applications.

Maximum Frequency At Nominal Supply: 21,000,000 Hz

A high maximum frequency allows for rapid data transfer and processing, making this device optimal for high-speed applications.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, contributing to longer battery life in portable devices.

Terminal Form: GULL WING

Gull wing terminals are common in surface mount devices and provide good mechanical strength and solder joint reliability.

Packing Method: TR

Tape and reel (TR) packing method simplifies the automated assembly process, making it a cost-effective choice for manufacturing.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with standard PCB layouts, ensuring easy integration into existing designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, guiding appropriate storage and handling practices to maintain quality.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V allows for wide application in both consumer and industrial electronic devices requiring greater voltage.

Technical Specifications

Bus Driver & Transceivers M74HC374RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

285 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

M74HC374RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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