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M74HC365RM13TR

STMicroelectronics

M74HC365RM13TR by STMicroelectronics

M74HC365RM13TR by STMicroelectronics is a 6-bit bus driver with a propagation delay of just 27 ns, ideal for high-speed applications. It operates b/w 2V and 6V, featuring a compact SO package. This CMOS device supports dual ports and offers true output polarity for efficient signal management.

Median Price

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Lifecycle Status

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14

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Vyrian

USA . 8,530 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,170 parts In-Stock

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Digiode

USA . 3,578 parts In-Stock

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Resion

USA . 1,882 parts In-Stock

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Inventory MP

USA . 1,536 parts In-Stock

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Bristol Electronics

USA . 1,536 parts In-Stock

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Anansix

USA . 1,504 parts In-Stock

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PC Components Company LLC

USA . 1,367 parts In-Stock

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J2 Sourcing AB

Sweden . 1,084 parts In-Stock

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Semi Source

USA . 499 parts In-Stock

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499

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ACDS - Activité Composants Distribution Service

France . 468 parts In-Stock

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Prism Electronics

USA . 135 parts In-Stock

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Semtec, LLC

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Distributors (Availability)

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Andel Nordic

Denmark . 539 parts In-Stock

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$1.337

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$1.283

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$1.283

539

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$1.283

Microchip USA

USA . 118 parts In-Stock

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$4.688

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IDEA Electronic Components Group

UK . 498 parts In-Stock

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$9.541

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$8.587

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MKK Technologies

India . 1,633 parts In-Stock

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$17.942

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DigiPath Technology Company

USA . 1,633 parts In-Stock

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$17.942

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AZTECH Wire

Italy . 1,209 parts In-Stock

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$21.310

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Ampacity Inc.

Singapore . 344 parts In-Stock

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$53.000

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 6,939 parts In-Stock

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GreenTree Electronics

Israel . 6,009 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 6,009 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 6,009 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,626 parts In-Stock

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Kepictronics

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Corphita

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Parana Technologies

USA . 626 parts In-Stock

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Authorized Procurement Solutions

USA . 450 parts In-Stock

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450

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Overview

Elevate your designs with the M74HC365RM13TR from STMicroelectronics, a trusted leader in semiconductor innovation. This robust bus driver and transceiver offers exceptional performance and reliability, perfect for high-speed applications where efficiency is key. With its compact, durable design and versatile operating range, it seamlessly integrates into various systems, ensuring superior signal integrity and optimized power consumption—empowering your projects with unmatched quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, ensuring long-term performance in various applications.

Propagation Delay At Nominal Supply: 27 ns

A low propagation delay ensures high-speed communication, making this component suitable for fast data transmission.

Surface Mount: YES

Surface mount technology (SMT) allows for easier assembly and reduced PCB space, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout design and optimizes space on the PCB.

No. of Bits: 6

With 6 bits, this device can handle a moderate amount of data, allowing for effective communication in various applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal voltage of 4.5V is ideal for many digital circuits, ensuring compatibility with a wide range of technologies.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for effective driving of capacitive loads, enhancing performance in high-frequency applications.

Power Supplies (V): 2/6

Supports a wide range of supply voltages (2V to 6V), making it versatile for different power supply settings.

No. of Terminals: 16

With 16 terminals, this device can manage a variety of connections, facilitating complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for compact designs, saving space on the PCB.

Maximum I (ol): 6 Amp

Capable of handling up to 6 Amps ensures it can drive loads effectively, suitable for robust applications.

Propagation Delay (tpd): 195 ns

A propagation delay of 195 ns still supports moderately fast operation, balancing performance and power consumption.

Maximum Operating Temperature: 125 °C

This high-temperature rating makes the product suitable for demanding environments, enhancing reliability.

Output Characteristics: 3-STATE

3-state output allows for versatile signal management, supporting bus systems and multiple device connections.

Minimum Operating Temperature: -55 °C

The ability to operate in extreme cold makes this component ideal for aerospace and military applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish enhances solderability and connection reliability over time.

Terminal Position: DUAL

Dual terminal positioning allows for diverse mounting options, accommodating different PCB layouts.

No. of Ports: 2

Having 2 ports increases versatility, allowing for multiple connections in complex systems.

Maximum Seated Height: 1.75 mm

The low profile design helps save space while ensuring secure mounting on the PCB.

Width: 3.9 mm

The compact width allows for easy integration into smaller designs, making it versatile for various applications.

Output Polarity: TRUE

True output polarity ensures consistent and reliable signal logic levels for effective circuit design.

Minimum Supply Voltage (Vsup): 2 V

Minimum supply voltage of 2V ensures compatibility with low-power applications, expanding its use cases.

Maximum Time At Peak Reflow Temperature (s): 30

Longer reflow time ensures robust solder joints during assembly, improving product reliability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature supports various soldering processes, suitable for modern assembly techniques.

Length: 9.9 mm

Compact length makes it easier to fit in tight spaces on PCBs while maintaining performance.

Temperature Grade: MILITARY

With military-grade specifications, this component is built to withstand harsh conditions, ensuring durability and reliability.

Technology: CMOS

CMOS technology offers low power consumption while providing high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy assembly and provide reliable connections, enhancing performance.

Packing Method: TR

The tape and reel packing method ensures efficient handling and automated assembly, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between compact size and ease of soldering in various applications.

Control Type: ENABLE LOW

The ENABLE LOW control type simplifies circuit logic, making it easier to integrate with other components.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, guiding storage and handling procedures for reliability.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6V ensures that this product can operate in a variety of higher voltage applications, providing versatility.

Technical Specifications

Bus Driver & Transceivers M74HC365RM13TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

195 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

M74HC365RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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