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M74HC32B1R

STMicroelectronics

M74HC32B1R by STMicroelectronics

M74HC32B1R by STMicroelectronics is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 22 ns at 4.5V, suitable for military-grade applications requiring fast response times. The through-hole package style with nickel palladium gold finish makes it ideal for high-temperature environments up to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Vyrian

USA . 5,238 parts In-Stock

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Digiode

USA . 4,806 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,400 parts In-Stock

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Extreme Components

USA . 770 parts In-Stock

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Anansix

USA . 305 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 140 parts In-Stock

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Resion

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EMSNET

USA . 29 parts In-Stock

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PC Components Company LLC

USA . 20 parts In-Stock

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Prism Electronics

USA . 20 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

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$9.541

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$8.587

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AZTECH Wire

Italy . 386 parts In-Stock

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$14.780

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MKK Technologies

India . 1,938 parts In-Stock

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$17.942

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DigiPath Technology Company

USA . 1,938 parts In-Stock

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$17.942

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Perfect Parts

USA . 19,435 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 14,171 parts In-Stock

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Microchip USA

USA . 5,832 parts In-Stock

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Corphita

USA . 2,004 parts In-Stock

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Metaverse IC Inc.

Canada . 1,240 parts In-Stock

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Parana Technologies

USA . 436 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 432 parts In-Stock

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Glotronic Ltd.

UK . 234 parts In-Stock

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Overview

Discover the superior quality and reliability of the M74HC32B1R logic gate by STMicroelectronics. With over 30 years of experience in semiconductor manufacturing, STMicroelectronics guarantees top-notch performance in every product. This versatile logic gate is perfect for a wide range of applications, from industrial automation to consumer electronics. Experience fast propagation delays and low power consumption, making it a cost-effective solution for your project. Trust STMicroelectronics to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the M74HC32B1R today and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the logic gates, ensuring longevity and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 22 ns

The low propagation delay allows for quick signal processing and response, making this product suitable for high-speed applications where fast operation is essential.

No. of Functions: 4

The multiple functions provided by this logic gates offer versatility in circuit design and implementation, making it a flexible choice for different applications.

Nominal Supply Voltage / Vsup (V): 4.5

The specific supply voltage of 4.5V ensures stable and efficient operation of the logic gates, optimizing performance and reducing power consumption.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand elevated temperatures, making it suitable for industrial and automotive applications where heat resistance is crucial.

Technical Specifications

Logic Gates M74HC32B1R attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC32B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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