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M74HC259RM13TR

STMicroelectronics

M74HC259RM13TR by STMicroelectronics

M74HC259RM13TR by STMicroelectronics is an 8-bit CMOS latch with a propagation delay of 57 ns and operates b/w 2V to 6V. It features a compact SO package, ideal for space-constrained applications. This device is suitable for data storage in digital circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,400 parts In-Stock

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LWI Electronics Inc

India . 7,795 parts In-Stock

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Digiode

USA . 3,288 parts In-Stock

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Pegasus Components GmbH

Germany . 2,843 parts In-Stock

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Anansix

USA . 2,696 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 2,500 parts In-Stock

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R&J Components

USA . 1,921 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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1,784

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ACDS - Activité Composants Distribution Service

France . 750 parts In-Stock

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750

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J2 Sourcing AB

Sweden . 64 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 401 parts In-Stock

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$2.787

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401

$2.787

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AZTECH Wire

Italy . 372 parts In-Stock

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$11.980

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372

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IDEA Electronic Components Group

UK . 176 parts In-Stock

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$24.236

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$21.812

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MKK Technologies

India . 2,256 parts In-Stock

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$45.573

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DigiPath Technology Company

USA . 2,256 parts In-Stock

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$45.573

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Perfect Parts

USA . 5,467 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,082 parts In-Stock

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Corphita

USA . 4,838 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,388 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 867 parts In-Stock

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$28.977

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Overview

Elevate your designs with the M74HC259RM13TR from STMicroelectronics, a leader in semiconductor innovation. This versatile 8-bit latch offers exceptional performance and reliability for various applications, from consumer electronics to industrial automation. Its compact, surface-mount package and low power consumption make it perfect for space-constrained projects. Trust in STMicroelectronics' commitment to quality and precision to drive your next successful project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to environmental factors, making the product reliable in various applications.

Propagation Delay At Nominal Supply: 57 ns

A short propagation delay allows for faster response times in digital circuits, enhancing overall system performance.

Surface Mount: YES

Being a surface mount device enables efficient space-saving on printed circuit boards (PCBs) and simplifies automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape is compact and allows for versatile placements on DIY and commercial boards.

No. of Bits: 8

An 8-bit configuration allows increased data storage and processing capabilities, suitable for advanced computing tasks.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal voltage of 4.5V achieves the balance between performance and power consumption.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF helps manage power dissipation and signal integrity, supporting stable operation in high-speed environments.

Power Supplies (V): 2/6

The range of power supplies provides flexibility for design requirements, accommodating various applications.

No. of Terminals: 16

With 16 terminals, the device offers multiple connection options, enhancing functionality and versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact designs, which are essential for modern electronic devices.

Maximum I (ol): 4 Amp

A maximum output current rating of 4 Amps allows for powering higher load devices directly, making it suitable for diverse applications.

Propagation Delay (tpd): 210 ns

Though higher than the nominal supply propagation, it still supports moderate-speed applications where timing is important.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature expands the range of environments where the device can function effectively, especially in harsh conditions.

Trigger Type: LOW LEVEL

A low-level trigger type is beneficial for applications needing low signal levels to activate, enhancing noise immunity.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature allows the product to be used in extreme cold environments, perfect for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The quality terminal finish ensures excellent reliability and conductivity, important for long-term performance.

Terminal Position: DUAL

Dual terminal position facilitates easy integration on PCBs, saving design freedom and layout space.

Maximum Seated Height: 1.75 mm

A low seated height helps in maintaining compact designs, fulfilling modern space-saving requirements.

Width: 3.9 mm

A narrow width allows for denser component placement on PCBs, which is crucial for miniaturization trends.

Output Polarity: TRUE

True output polarity supports direct compatibility with standard logic levels, simplifying integration into existing systems.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for usage in battery-operated and energy-efficient applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification allows for flexible PCB assembly processes during soldering, ensuring strong and reliable solder joints.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature accommodates modern lead-free solder processes, supporting eco-friendly manufacturing practices.

Length: 9.9 mm

The compact length aligns with the needs of space-constrained applications, providing wide applicability.

Temperature Grade: MILITARY

A military temperature grade ensures robust performance in demanding applications, meeting strict military standards.

Technology: CMOS

Utilizing CMOS technology delivers low power consumption while maintaining high-speed operation, suitable for a variety of applications.

Terminal Form: GULL WING

Gull wing terminal form is ideal for automated soldering processes, ensuring reliability in assembly.

Packing Method: TR

Tape and reel packing method ensures efficient handling and automated placement, enhancing manufacturing productivity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCB designs, facilitating easier integration into various applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 provides adequate protection against moisture-induced defects during soldering.

Maximum Supply Voltage (Vsup): 6 V

A maximum supply voltage of 6 V allows flexibility in designing circuits to ensure compatibility with various components.

Technical Specifications

Latches & Flip-Flops M74HC259RM13TR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

57 ns

Propagation Delay (tpd):

210 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

3.9 mm

Trade Compliance

M74HC259RM13TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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