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M74HC245TTR

STMicroelectronics

M74HC245TTR by STMicroelectronics

M74HC245TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of 27 ns and operates b/w 2-6 V. It features a compact SO package, ideal for space-constrained applications. This CMOS device supports bidirectional data transfer in high-speed circuits.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 601 parts In-Stock

1+ parts

$0.460

100+ parts

$0.271

1k+ parts

$0.244

10k+ parts

$0.161

601

$0.460

$0.271

$0.244

$0.161

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,759 parts In-Stock

1+ parts

$0.437

100+ parts

-

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3,759

$0.437

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Chip Stock

USA . 28,500 parts In-Stock

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28,500

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Vyrian

USA . 7,662 parts In-Stock

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7,662

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ACDS - Activité Composants Distribution Service

France . 3,012 parts In-Stock

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3,012

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Anansix

USA . 2,441 parts In-Stock

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2,441

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Distributors (Availability)

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Component Stockers USA

USA . 771 parts In-Stock

1+ parts

$0.400

100+ parts

$0.260

1k+ parts

-

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-

771

$0.400

$0.260

-

-

Corphita

USA . 3,992 parts In-Stock

1+ parts

$0.414

100+ parts

-

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3,992

$0.414

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Andel Nordic

Denmark . 3,220 parts In-Stock

1+ parts

$2.737

100+ parts

-

1k+ parts

$2.628

10k+ parts

$2.628

3,220

$2.737

-

$2.628

$2.628

Microchip USA

USA . 332 parts In-Stock

1+ parts

$5.020

100+ parts

-

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332

$5.020

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IDEA Electronic Components Group

UK . 425 parts In-Stock

1+ parts

$14.119

100+ parts

-

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$12.707

10k+ parts

-

425

$14.119

-

$12.707

-

MKK Technologies

India . 2,293 parts In-Stock

1+ parts

$26.550

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2,293

$26.550

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DigiPath Technology Company

USA . 2,293 parts In-Stock

1+ parts

$26.550

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2,293

$26.550

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RC Electronics

USA . 63,815 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 51,000 parts In-Stock

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Perfect Parts

USA . 14,512 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,250 parts In-Stock

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13,250

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A-Z Elektronik GmbH

Germany . 4,838 parts In-Stock

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4,838

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Alle Elektronik GmbH

Germany . 3,225 parts In-Stock

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3,225

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Glotronic Ltd.

UK . 3,190 parts In-Stock

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3,190

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 822 parts In-Stock

1+ parts

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$16.882

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822

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$16.882

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ChipstoGo Electronic ltd

UK . 370 parts In-Stock

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370

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Kepictronics

USA . 314 parts In-Stock

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314

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Overview

Unlock seamless data communication with the M74HC245TTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This robust bus driver excels in efficiency and versatility, perfect for connecting microcontrollers in demanding environments. With its compact design and exceptional temperature range, it ensures reliable performance across diverse applications—from industrial automation to consumer electronics—offering you superior value and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable package material ensures reliable performance in various environments.

Propagation Delay At Nominal Supply: 27 ns

A low propagation delay guarantees fast data transmission, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs, suitable for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards.

No. of Bits: 8

An 8-bit architecture supports a wide range of data processing applications.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a standard nominal supply voltage ensures compatibility with various systems.

Power Supplies (V): 2/6

Versatile voltage supply range provides flexibility for different applications.

No. of Terminals: 20

With 20 terminals, it allows for comprehensive connectivity options for various designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is beneficial for space-constrained applications.

Maximum I (ol): 6 Amp

A high output current capability enables effective performance in demanding applications.

Propagation Delay (tpd): 180 ns

Although higher than nominal, this delay is still suitable for many applications requiring moderate speed.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, it provides reliability in extreme conditions.

Output Characteristics: 3-STATE

3-state outputs enhance versatility in data bus management within complex systems.

Minimum Operating Temperature: -55 °C

This wide temperature range ensures functionality in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and reduces oxidation, ensuring longer lifespan.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and integration.

No. of Ports: 2

Having two ports facilitates bidirectional data transfer, optimizing system performance.

Maximum Seated Height: 1.2 mm

A low seated height supports dense PCB designs and enhances thermal management.

Width: 4.4 mm

A narrow width contributes to overall compactness in electronic assemblies.

Output Polarity: TRUE

True output polarity ensures compatibility with various logic levels in electronic interfaces.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a lower supply voltage broadens its applicability in energy-sensitive applications.

Length: 6.5 mm

A manageable length aids in fitting easily into various devices without compromising space.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring robustness and reliability in critical systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and improve the reliability of connections.

Packing Method: TR

Tape and reel packing optimizes automation in manufacturing processes.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for higher density interconnections, beneficial in compact designs.

Count Direction: BIDIRECTIONAL

Bidirectional counting enhances flexibility in data transmission, suitable for both input and output operations.

Control Type: COMMON CONTROL

Common control facilitates simplified design architecture in multi-device configurations.

Maximum Supply Voltage (Vsup): 6 V

The device can handle a maximum supply voltage suitable for a variety of applications requiring higher power.

Technical Specifications

Bus Driver & Transceivers M74HC245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

27 ns

Propagation Delay (tpd):

180 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Translation:

N/A

Width:

4.4 mm

Trade Compliance

M74HC245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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