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M74HC04B1R

STMicroelectronics

M74HC04B1R by STMicroelectronics

STMicroelectronics M74HC04B1R is a CMOS Logic Gates IC with 6 functions, 29ns propagation delay at 4.5V supply. It operates in -55 to 125 °C temperature range and has through-hole terminals for military-grade applications.

Median Price

$4.948

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 1 parts In-Stock

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$9.800

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1

$9.800

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Vyrian

USA . 9,870 parts In-Stock

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9,870

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Digiode

USA . 4,546 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,360 parts In-Stock

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Sensible Micro Corp

USA . 1,609 parts In-Stock

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$0.097

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$0.090

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1,609

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$0.097

$0.090

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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ComSIT USA

USA . 1,000 parts In-Stock

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MISTER SPROCKETS

USA . 1,000 parts In-Stock

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Anansix

USA . 820 parts In-Stock

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820

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LWI Electronics Inc

India . 404 parts In-Stock

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Whistler Technology

UK . 325 parts In-Stock

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325

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EMSNET

USA . 175 parts In-Stock

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J2 Sourcing AB

Sweden . 119 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 606 parts In-Stock

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$18.220

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$18.220

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IDEA Electronic Components Group

UK . 1,486 parts In-Stock

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$24.258

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$21.832

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MKK Technologies

India . 1,854 parts In-Stock

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$45.615

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$45.615

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DigiPath Technology Company

USA . 1,854 parts In-Stock

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$45.615

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$45.615

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Ampacity Inc.

Singapore . 1,555 parts In-Stock

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$58.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,913 parts In-Stock

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Perfect Parts

USA . 5,816 parts In-Stock

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Microchip USA

USA . 5,328 parts In-Stock

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Authorized Procurement Solutions

USA . 4,100 parts In-Stock

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Corphita

USA . 4,019 parts In-Stock

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Metaverse IC Inc.

Canada . 2,443 parts In-Stock

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Parana Technologies

USA . 560 parts In-Stock

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$29.004

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560

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Kepictronics

USA . 475 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 52 parts In-Stock

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Overview

Elevate your electronic projects with the M74HC04B1R by STMicroelectronics, a high-quality logic gates component designed to deliver exceptional performance. With a focus on reliability and precision, STMicroelectronics is a trusted manufacturer known for producing top-of-the-line components like the M74HC04B1R. Ideal for a wide range of applications, this logic gates component offers customers unparalleled value and benefits. Whether you're working on DIY projects or professional applications, the M74HC04B1R provides the quality and advantages you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 29 ns

Low propagation delay ensures fast response times in signal processing, making this product efficient for high-speed applications.

No. of Functions: 6

Having 6 functions in one package offers versatility and flexibility in circuit design, making this product a cost-effective choice for multiple logic operations.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V ensures compatibility with standard power sources, making integration into existing systems seamless.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, this product can withstand harsh environmental conditions, ensuring reliable performance in varied applications.

Technical Specifications

Logic Gates M74HC04B1R attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

29 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

5.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

M74HC04B1R Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-469-6192, 5962144696192, 5962-01-459-9330, 5962014599330

NIIN

144696192, 014599330

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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