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M29W200BB70N6

STMicroelectronics

M29W200BB70N6 by STMicroelectronics

M29W200BB70N6 from STMicroelectronics is a 2Mbit NOR Flash memory with a 3.3V supply, featuring an asynchronous operating mode and a max access time of 70 ns. It supports industrial applications with -40 °C to 85 °C temp range and offers high endurance of 100K write/erase cycles. Its compact SOIC package ensures efficient surface mounting for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 11,200 parts In-Stock

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Vyrian

USA . 6,135 parts In-Stock

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Digiode

USA . 2,265 parts In-Stock

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2,265

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Anansix

USA . 2,054 parts In-Stock

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NexGen Digital

USA . 38 parts In-Stock

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38

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,343 parts In-Stock

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$3.536

100+ parts

-

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$3.182

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1,343

$3.536

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$3.182

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MKK Technologies

India . 1,602 parts In-Stock

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$6.648

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1,602

$6.648

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DigiPath Technology Company

USA . 1,602 parts In-Stock

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$6.648

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1,602

$6.648

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AZTECH Wire

Italy . 109 parts In-Stock

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$8.320

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109

$8.320

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Component Stockers USA

USA . 401 parts In-Stock

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$99.990

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401

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,826 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,884 parts In-Stock

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Corphita

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Assy Fe

Spain . 2,302 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 337 parts In-Stock

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$4.227

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Microchip USA

USA . 161 parts In-Stock

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Perfect Parts

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Overview

Unlock exceptional performance with the M29W200BB70N6 flash memory from STMicroelectronics, a leader in innovative semiconductor solutions. Engineered for reliability and efficiency, this high-quality NOR-type memory enhances your applications, from industrial controls to consumer electronics. With its compact design and impressive endurance, it ensures lasting value and seamless integration, offering you peace of mind and superior functionality in every project. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and long-term performance in various environments.

Surface Mount: YES

Allows for a compact design, making it suitable for modern electronic devices with limited space.

Package Shape: RECTANGULAR

Standard shape facilitates easy integration into circuit layouts.

Operating Mode: ASYNCHRONOUS

Provides flexibility in operation, enabling faster response times for applications.

Nominal Supply Voltage / Vsup (V): 3.3

Widely accepted voltage level, ensuring compatibility with many devices.

Power Supplies (V): 3/3.3

Versatile power supply range enhances system compatibility.

No. of Terminals: 48

Sufficient terminals facilitate more functionality and connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Optimized for space-saving designs, ideal for portable devices.

Alternate Memory Width: 8

Supports standard data transfer sizes for efficient processing.

Maximum Operating Temperature: 85 °C

High-temperature rating ensures operation in challenging environments.

Organization: 128KX16

Efficient organization enables quick access and retrieval of data.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes it suitable for industrial applications.

No. of Sectors/Size: 1,2,1,3

Flexible sector sizes allow for optimized memory usage based on application needs.

Terminal Finish: TIN LEAD

Reliable lead finish enhances solderability and long-term durability.

Terminal Position: DUAL

Facilitates easier mounting and improved electrical performance.

Maximum Seated Height: 1.2 mm

Low profile design allows for integration into space-constrained environments.

Width: 12 mm

Compact width enables seamless integration into small form factor devices.

Minimum Supply Voltage (Vsup): 2.7 V

Lower voltage operational capability provides more flexibility in power sourcing.

Type: NOR TYPE

NOR flash is suitable for applications requiring fast random access and high reliability.

Length: 20 mm

Standard length fits well with established design patterns in various devices.

Programming Voltage (V): 2.7

Supports efficient programming operations without needing excessive voltages.

Temperature Grade: INDUSTRIAL

Designed for robust performance in industrial applications subject to harsh conditions.

Technology: CMOS

Low power consumption technology enhances overall device energy efficiency.

Parallel or Serial: PARALLEL

Parallel processing capability allows for faster data access and retrieval speeds.

Terminal Form: GULL WING

Facilitates easy surface mounting and aligns well with PCB designs.

Sector Size (Words): 16K, 8K, 32K, 64K

Varied sector sizes optimize memory management and data storage efficiency.

Maximum Supply Current: 20 mA

Low current requirements contribute to energy-efficient designs.

No. of Words: 131072 words

Provides substantial storage capacity for diverse applications.

Toggle Bit: YES

Enables more efficient data management and error handling processes.

Memory Width: 16

Standard memory width ensures compatibility with prevalent data architectures.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density packaging and compact design implementations.

No. of Words Code: 128K

Offers adequate word code count to meet a variety of data handling needs.

Command User Interface: YES

User-friendly interface facilitates ease of programming and operation.

Ready or Busy: YES

Status indication enhances operational safety and performance monitoring.

Maximum Supply Voltage (Vsup): 3.6 V

Wide voltage margin ensures stable operation across various systems.

Endurance: 100000 Write/Erase Cycles

High endurance ensures long-lasting performance for frequent storage tasks.

Boot Block: BOTTOM

Boot block configuration allows for secure and efficient boot processes.

Memory Density: 2097152 bit

High memory density provides ample storage for complex data requirements.

Memory IC Type: FLASH

Flash memory technology ensures non-volatile data storage, ideal for various applications.

Maximum Standby Current: 0.0001 Amp

Ultra-low standby current enhances energy efficiency during idle times.

Maximum Access Time: 70 ns

Fast access time improves system responsiveness and performance.

Data Polling: YES

Data polling capability ensures real-time read capabilities, allowing for efficient data management.

Technical Specifications

Flash Memory M29W200BB70N6 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

20 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,3

No. of Terminals:

48

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

PARALLEL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

1.2 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

YES

Type:

NOR TYPE

Width:

12 mm

Trade Compliance

M29W200BB70N6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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