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M29F400BB70M6E

STMicroelectronics

M29F400BB70M6E by STMicroelectronics

M29F400BB70M6E from STMicroelectronics is a 5V NOR Flash memory with a 256Kx16 organization, ideal for industrial applications. It features a max access time of 70 ns and supports up to 100k write/erase cycles. This compact SOIC package ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,637 parts In-Stock

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Digiode

USA . 3,697 parts In-Stock

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3,697

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Anansix

USA . 416 parts In-Stock

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416

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$5.342

100+ parts

-

1k+ parts

$4.807

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505

$5.342

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$4.807

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AZTECH Wire

Italy . 1,117 parts In-Stock

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$10.030

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$10.030

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MKK Technologies

India . 2,329 parts In-Stock

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$10.044

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2,329

$10.044

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DigiPath Technology Company

USA . 2,329 parts In-Stock

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$10.044

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2,329

$10.044

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QUARKTWIN TECHNOLOGY LTD

USA . 19,029 parts In-Stock

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Corphita

USA . 4,445 parts In-Stock

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Perfect Parts

USA . 2,698 parts In-Stock

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2,698

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Microchip USA

USA . 101 parts In-Stock

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Parana Technologies

USA . 35 parts In-Stock

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$6.387

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35

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$6.387

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Overview

Unlock the potential of your designs with the M29F400BB70M6E Flash Memory from STMicroelectronics. Renowned for its high-quality components, STMicroelectronics delivers exceptional reliability and performance, ensuring your applications run smoothly in even the toughest environments. With versatile storage solutions, this NOR Flash memory is perfect for a range of industrial applications, offering outstanding endurance and fast access times that enhance efficiency and innovation. Elevate your projects with proven technology that consistently exceeds expectations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and environmental resistance, ensuring longevity in various applications.

Surface Mount: YES

Surface mount capability enables easier assembly and integration into modern compact electronic devices.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient PCB space utilization and design flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operating mode offers faster data access, enhancing overall system performance.

Nominal Supply Voltage / Vsup: 5V

Standard 5V operation is commonly supported, making it compatible with a variety of systems.

Power Supplies (V): 5V

5V power supply ensures compatibility with standard electronic circuits.

No. of Terminals: 44

A well-defined number of terminals allows for efficient connectivity while still maintaining compact design.

Package Style (Meter): SMALL OUTLINE

The small outline package is suited for space-constrained applications without compromising performance.

Alternate Memory Width: 8

Allows for versatile data handling and efficient memory access.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in harsh environments.

Organization: 256KX16

The organization of memory enables efficient data management and manipulation.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures reliability in extreme conditions, making it suitable for industrial applications.

No. of Sectors/Size: 1,2,1,7

Flexible sector sizes allow for tailored memory management, improving data organization.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

High-quality terminal finish enhances conductivity and prevents corrosion, ensuring a stable connection.

Terminal Position: DUAL

Dual terminal positioning supports effective layout design and connectivity in multi-layer PCBs.

Maximum Seated Height: 2.62 mm

Low seated height is optimal for space-constrained applications and ensures compatibility with other components.

Width: 13.3 mm

Compact width makes it ideal for modern designs where space is at a premium.

Minimum Supply Voltage (Vsup): 4.5V

Maintaining function at a lower voltage increases device compatibility and efficiency.

Type: NOR TYPE

NOR type flash memory offers fast random access and is ideal for embedded applications requiring quick data retrieval.

Length: 28.2 mm

A manageable length that fits well within compact electronic designs.

Programming Voltage (V): 5

Standard programming voltage helps streamline manufacturing and ensures consistency in operation.

Temperature Grade: INDUSTRIAL

Ideal for industrial applications, ensuring durability and reliability under tough conditions.

Technology: CMOS

CMOS technology improves energy efficiency and reduces heat generation during operation.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer rates, enhancing performance in high-speed applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and improve the mechanical bond to PCBs.

Sector Size (Words): 16K,8K,32K,64K

Variety in sector sizes aids in efficient memory management tailored to different application needs.

Maximum Supply Current: 20 mA

Low maximum supply current allows for power-efficient designs, important for battery-operated devices.

No. of Words: 262144 words

Offers substantial memory capacity for storing a significant amount of data.

Toggle Bit: YES

The presence of a toggle bit enhances the reliability of data integrity during operations.

Memory Width: 16

Wider memory width allows for more efficient data processing and transfer.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easier layout design and interconnectivity with other components.

No. of Words Code: 256K

256K word capacity supports a variety of application requirements for data storage.

Command User Interface: YES

User command interface simplifies control and integration into different systems.

Ready or Busy: YES

Ready/busy signals enable smooth operation by indicating the status of memory access.

Maximum Supply Voltage (Vsup): 5.5V

Flexible supply voltage limits ensure compatibility with a wide range of electronic designs.

Endurance: 100000 Write/Erase Cycles

High endurance rating provides long-lasting performance suitable for intensive data logging applications.

Boot Block: BOTTOM

A bottom boot block configuration can streamline the initialization process for embedded systems.

Memory Density: 4194304 bit

High memory density supports more complex applications requiring significant data storage.

Memory IC Type: FLASH

Flash memory type is non-volatile, ensuring data retention even without power.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current helps conserve power in idle applications.

Maximum Access Time: 70 ns

Fast maximum access time boosts overall system performance in data-intensive applications.

Data Polling: YES

Data polling feature enhances data integrity monitoring during read/write operations.

Technical Specifications

Flash Memory M29F400BB70M6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Additional Features:

BOTTOM BOOT BLOCK

Alternate Memory Width:

8

Boot Block:

BOTTOM

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3/e4

Length:

28.2 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Sectors/Size:

1,2,1,7

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP44,.63

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Ready or Busy:

YES

Maximum Seated Height:

2.62 mm

Sector Size (Words):

16K,8K,32K,64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Toggle Bit:

YES

Type:

NOR TYPE

Width:

13.3 mm

Trade Compliance

M29F400BB70M6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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