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M29F040B45K6E

STMicroelectronics

M29F040B45K6E by STMicroelectronics

M29F040B45K6E from STMicroelectronics is a 512Kx8 NOR Flash memory with a 5V supply, ideal for industrial applications. It features an asynchronous operating mode, max access time of 45 ns, and supports up to 100k write/erase cycles. This compact chip carrier design ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,114 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,516 parts In-Stock

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3,516

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Anansix

USA . 2,303 parts In-Stock

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2,303

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Digiode

USA . 245 parts In-Stock

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245

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LIBRA Elektronik GmbH

Germany . 63 parts In-Stock

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63

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 867 parts In-Stock

1+ parts

$4.467

100+ parts

-

1k+ parts

$4.020

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867

$4.467

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$4.020

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MKK Technologies

India . 1,537 parts In-Stock

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$8.399

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1,537

$8.399

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DigiPath Technology Company

USA . 1,537 parts In-Stock

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$8.399

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1,537

$8.399

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AZTECH Wire

Italy . 58 parts In-Stock

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$13.600

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58

$13.600

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Component Stockers USA

USA . 452 parts In-Stock

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$99.990

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452

$99.990

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Corphita

USA . 3,359 parts In-Stock

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3,359

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Parana Technologies

USA . 924 parts In-Stock

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$5.340

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Microchip USA

USA . 251 parts In-Stock

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Overview

Unlock unparalleled performance with the M29F040B45K6E from STMicroelectronics, a leader in innovative flash memory solutions. Engineered for reliability in demanding environments, this versatile NOR flash offers exceptional endurance and rapid access times, making it ideal for industrial applications. Experience seamless integration and enhanced efficiency, ensuring your projects benefit from top-tier quality and unmatched performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic assemblies.

Package Shape: RECTANGULAR

The rectangular shape optimizes space usage on PCBs, facilitating efficient layout designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster response times and increased performance in data retrieval.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V ensures compatibility with a wide range of electronic systems.

Power Supplies (V): 5

Standard power supply requirement simplifies integration and reduces design complexity.

No. of Terminals: 32

The 32 terminals enhance connectivity options, allowing for more sophisticated circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is suited for reliable and stable performance in various applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes this flash memory ideal for industrial and rugged environments.

Organization: 512KX8

This organization allows for efficient data management, catering perfectly to applications needing moderate data capacity.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme low temperatures ensures reliability in critical environments.

No. of Sectors/Size: 8

Having multiple sectors enables better data organization and management.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and provides good corrosion resistance.

Terminal Position: QUAD

Quad terminal positioning allows for efficient use of board space and easier connections.

Maximum Seated Height: 3.56 mm

A low seated height is advantageous for compact designs, fitting into smaller form factors.

Width: 11.43 mm

Compact width allows for easier integration into various circuit layouts and smaller devices.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage ensures the product can operate effectively in power-sensitive applications.

Type: NOR TYPE

NOR flash memory is known for its fast read speeds, which can be pivotal for performance-critical applications.

Length: 13.97 mm

Short length aids in fitting within space-constrained designs without sacrificing performance.

Programming Voltage (V): 5

Standard programming voltage ensures compatibility with commonly used programming equipment.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees reliability across harsh environments, suitable for demanding applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher efficiency, making it suitable for portable devices.

Parallel or Serial: PARALLEL

Parallel communication provides higher data throughput, essential for applications requiring quick data access.

Terminal Form: J BEND

J bend terminals facilitate smooth soldering and connection integrity on PCBs.

Sector Size (Words): 64K

A sector size of 64K allows optimal balance between performance and data organization during operations.

Maximum Supply Current: 20 mA

Low maximum supply current features enhance energy efficiency, vital for battery-operated devices.

No. of Words: 524288 words

The memory capacity of 524288 words provides ample storage for various applications, supporting complex programming needs.

Toggle Bit: YES

The presence of a toggle bit allows for effective error checking and data integrity verification.

Memory Width: 8

An 8-bit memory width aligns well with modern data management needs in various digital systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch aids in compatibility with standard PCB layouts, simplifying design processes.

No. of Words Code: 512K

The 512K word code ensures adequate memory for a variety of applications, balancing size and performance.

Command User Interface: YES

Having a user interface for commands makes it simpler to integrate and operate within various systems.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage flexibility improves scalability across diverse applications with varying power requirements.

Endurance: 100000 Write/Erase Cycles

High endurance level ensures long-lasting performance and reliability, crucial for frequent write/erase operations.

Memory Density: 4194304 bit

This high memory density promotes efficient data storage without occupying excessive board space.

Memory IC Type: FLASH

Flash memory is favored for its ability to retain data without power, making it suitable for numerous applications.

Maximum Standby Current: 0.0001 Amp

Very low standby current consumption contributes to energy savings in low-power electronic devices.

Maximum Access Time: 45 ns

Fast access time improves overall system performance, resulting in quicker data retrieval.

Data Polling: YES

Data polling capability allows for efficient monitoring of memory states, enhancing user control and ease of use.

Technical Specifications

Flash Memory M29F040B45K6E attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Command User Interface:

YES

Data Polling:

YES

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

8

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Toggle Bit:

YES

Type:

NOR TYPE

Width:

11.43 mm

Trade Compliance

M29F040B45K6E Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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