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LSM320DL

STMicroelectronics

LSM320DL by STMicroelectronics

LSM320DL by STMicroelectronics is a 28-terminal chip carrier with a supply voltage of 3V. It operates in industrial temperatures ranging from -40 to 85 °C, making it suitable for various applications requiring precise motion sensing and control. With surface mount capability and plastic/epoxy package material, it offers reliable performance in demanding environments.

Median Price

$4.002

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 940 parts In-Stock

1+ parts

$3.363

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$3.363

-

-

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Chip1Stop

Japan . 940 parts In-Stock

1+ parts

$4.640

100+ parts

-

1k+ parts

-

10k+ parts

-

940

$4.640

-

-

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Verical

USA . 940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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940

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,539 parts In-Stock

1+ parts

$3.195

100+ parts

-

1k+ parts

-

10k+ parts

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4,539

$3.195

-

-

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Vyrian

USA . 4,874 parts In-Stock

1+ parts

-

100+ parts

-

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4,874

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Anansix

USA . 771 parts In-Stock

1+ parts

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771

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 306 parts In-Stock

1+ parts

$3.027

100+ parts

-

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-

10k+ parts

-

306

$3.027

-

-

-

IDEA Electronic Components Group

UK . 844 parts In-Stock

1+ parts

$6.998

100+ parts

-

1k+ parts

$6.298

10k+ parts

-

844

$6.998

-

$6.298

-

MKK Technologies

India . 1,004 parts In-Stock

1+ parts

$13.158

100+ parts

-

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-

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1,004

$13.158

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-

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DigiPath Technology Company

USA . 1,004 parts In-Stock

1+ parts

$13.158

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

$13.158

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-

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AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$14.100

100+ parts

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252

$14.100

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

1+ parts

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90,000

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Parana Technologies

USA . 1,619 parts In-Stock

1+ parts

-

100+ parts

$8.367

1k+ parts

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10k+ parts

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1,619

-

$8.367

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

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100+ parts

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1,100

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Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

-

-

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Overview

Unlock the potential of your electronic applications with the LSM320DL by STMicroelectronics. Manufactured with precision and expertise, this high-quality semiconductor offers unparalleled performance and reliability. Whether you're in need of motion sensing solutions for automotive, industrial, or consumer electronics, this versatile chip carrier is the perfect choice. With a nominal supply voltage of 3V and an industrial temperature grade, the LSM320DL delivers exceptional value and benefits to customers looking for top-notch functionality in a compact and efficient package. Experience the advantages of cutting-edge technology with the LSM320DL from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and resistant to impact, making the product suitable for applications where ruggedness is required.

Surface Mount: YES

The surface mount capability allows for easy installation on printed circuit boards, saving space and improving overall efficiency.

Nominal Supply Voltage (Vsup): 3 V

The low nominal supply voltage of 3V makes this product energy-efficient and suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high-temperature environments, making it reliable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures, from -40 °C to 85°C, ensures that the product can function effectively in both extreme cold and heat conditions.

Terminal Pitch: 0.6 mm

The small terminal pitch of 0.6mm allows for high-density mounting on PCBs, making this product suitable for compact electronic devices.

Technical Specifications

Other Function Semiconductors LSM320DL attributes and parameters. Explore more Other Function Semiconductors devices from STMicroelectronics

Specs

JESD-30 Code:

R-PQCC-N28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.18X.3,24

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.6 mm

Terminal Position:

QUAD

Trade Compliance

LSM320DL Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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