Loading...

L6611DTR

STMicroelectronics

L6611DTR by STMicroelectronics

L6611DTR by STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and supports up to 5 channels. It features a compact rectangular package (7.5mm x 12.8mm) and operates efficiently with a max current of 7mA. Ideal for power supply support in various electronic applications, it ensures reliable performance with adjustable thresholds.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,411

-

-

-

-

Digiode

USA . 2,359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

-

-

-

-

Anansix

USA . 736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

736

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 164 parts In-Stock

1+ parts

$8.654

100+ parts

-

1k+ parts

$7.789

10k+ parts

-

164

$8.654

-

$7.789

-

AZTECH Wire

Italy . 894 parts In-Stock

1+ parts

$9.490

100+ parts

-

1k+ parts

-

10k+ parts

-

894

$9.490

-

-

-

Microchip USA

USA . 393 parts In-Stock

1+ parts

$9.667

100+ parts

-

1k+ parts

-

10k+ parts

-

393

$9.667

-

-

-

MKK Technologies

India . 1,145 parts In-Stock

1+ parts

$16.274

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$16.274

-

-

-

DigiPath Technology Company

USA . 1,145 parts In-Stock

1+ parts

$16.274

100+ parts

-

1k+ parts

-

10k+ parts

-

1,145

$16.274

-

-

-

Vigor

Singapore . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

Parana Technologies

USA . 1,981 parts In-Stock

1+ parts

-

100+ parts

$10.348

1k+ parts

-

10k+ parts

-

1,981

-

$10.348

-

-

Corphita

USA . 1,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,670

-

-

-

-

Overview

Unlock the potential of your projects with the L6611DTR Power Management IC from STMicroelectronics. Renowned for their commitment to innovation and quality, STMicroelectronics delivers a versatile solution that enhances efficiency in various applications—from consumer electronics to industrial automation. This compact, surface-mount IC offers reliable performance, adjustable thresholds, and multiple channels, ensuring seamless integration and optimal power management, ultimately driving greater value and reliability for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mounting allows for a more compact design and facilitates automated assembly, making it efficient for large-scale production.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout on PCB and optimizes space utilization for high-density designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V enhances compatibility with a wide range of devices and power sources.

Power Supplies (V): 5

Designed for typical power supply configurations, ensuring reliable performance across various applications.

No. of Terminals: 20

With 20 terminals, this IC provides adequate connectivity for multiple channels and functions, supporting complex circuitry.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space while maximizing performance, making it suitable for compact designs.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes ensure superior conductivity and corrosion resistance, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning improves layout flexibility, accommodating various PCB designs and configurations.

Maximum Seated Height: 2.65 mm

Low profile design allows for easier integration into compact systems where space is a constraint.

Width (mm): 7.5 mm

A width of 7.5 mm helps in fitting within limited spaces while ensuring robustness and stability.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specialized as a power supply support circuit, this IC is optimized to enhance the performance of power management systems.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate at a minimum of 4.5V provides flexibility for various battery and voltage sources.

Length: 12.8 mm

Length of 12.8 mm strikes a balance between compactness and sufficient terminal spacing for effective heat dissipation.

Maximum Supply Current (Isup): 7 mA

A maximum supply current of 7 mA ensures low power consumption, making it ideal for energy-sensitive applications.

No. of Channels: 5

Having 5 channels allows for multiple outputs, making it versatile for power distribution in complex circuits.

Technology: BCDMOS

Using BCDMOS technology combines the advantages of both bipolar and CMOS processes for higher performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form is widely used, ensuring compatibility with automated soldering processes and reliable connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard footprint compatibility with various PCB designs.

Maximum Supply Voltage (Vsup): 6 V

The ability to handle a maximum of 6V enhances versatility, accommodating different power supply configurations.

Adjustable Threshold: YES

Adjustable threshold capability allows for customized voltage levels, offering design flexibility for specific applications.

Technical Specifications

Power Management ICs L6611DTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

L6611DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10