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L6610N

STMicroelectronics

L6610N by STMicroelectronics

L6610N by STMicroelectronics is a versatile power management IC featuring a 5V nominal voltage, 6 channels, and BCDMOS technology. Its compact design includes 24 terminals in an in-line package with adjustable thresholds. Ideal for power supply support circuits in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,612 parts In-Stock

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5,612

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Digiode

USA . 2,865 parts In-Stock

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2,865

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Anansix

USA . 1,936 parts In-Stock

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1,936

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Distributors (Availability)

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Microchip USA

USA . 229 parts In-Stock

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$1.000

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229

$1.000

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AZTECH Wire

Italy . 240 parts In-Stock

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$8.120

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240

$8.120

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IDEA Electronic Components Group

UK . 2,299 parts In-Stock

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$17.619

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$15.857

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2,299

$17.619

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$15.857

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MKK Technologies

India . 2,001 parts In-Stock

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$33.131

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2,001

$33.131

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DigiPath Technology Company

USA . 2,001 parts In-Stock

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$33.131

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2,001

$33.131

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Component Stockers USA

USA . 713 parts In-Stock

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$99.990

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713

$99.990

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Vigor

Singapore . 3,631 parts In-Stock

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3,631

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Parana Technologies

USA . 1,341 parts In-Stock

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$21.066

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1,341

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$21.066

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Corphita

USA . 178 parts In-Stock

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Overview

Unlock unparalleled efficiency and reliability with the L6610N from STMicroelectronics, a leader in power management innovation. Designed for diverse applications, this versatile IC ensures optimal performance, delivering superior voltage support and adjustable thresholds tailored to your needs. Its robust quality reflects STMicroelectronics' commitment to excellence, providing you with peace of mind and enhanced value in every project. Experience the advantage of choosing L6610N—where cutting-edge technology meets exceptional performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this IC reliable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, making it easier to integrate into designs with varying layouts.

Nominal Supply Voltage (Vsup): 5 V

The 5 V nominal supply voltage is standard for many applications, providing compatibility with a wide range of electronic devices.

No. of Terminals: 24

With 24 terminals, this IC offers a comprehensive range of connections, accommodating complex circuitry and various functionalities.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style allows for compact designs, which is advantageous for space-constrained electronic applications.

Terminal Position: DUAL

The dual terminal position provides versatility in PCB layout design, enabling better routing and improved electrical performance.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm helps maintain a low profile, which is beneficial for applications requiring slim designs.

Width: 7.62 mm

At 7.62 mm in width, this component can easily fit in various enclosures, aiding in compact device design.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for stabilizing voltage and managing power distribution, ensuring reliable performance.

Length: 22.86 mm

The length of 22.86 mm is balanced, providing adequate spacing for terminals while maintaining a manageable footprint on PCBs.

No. of Channels: 6

With 6 channels, this IC can support multiple output sources, making it an ideal choice for complex power management applications.

Technology: BCDMOS

The BCDMOS technology combines CMOS and bipolar transistors, providing high efficiency, low power consumption, and robust performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances mechanical stability, providing a stronger connection in applications where durability is critical.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm allows for easier soldering and better heat dissipation, ensuring reliable performance under load.

Adjustable Threshold: YES

The adjustable threshold feature offers flexibility in design, allowing engineers to customize performance according to specific application requirements.

Technical Specifications

Power Management ICs L6610N attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T24

Length:

22.86 mm

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

L6610N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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