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L6611N

STMicroelectronics

L6611N by STMicroelectronics

L6611N by STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and supports up to 5 channels. It features adjustable thresholds, operates b/w 4.5V and 6V, and has a max supply current of 7mA. Ideal for power supply support circuits in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,150 parts In-Stock

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Anansix

USA . 1,355 parts In-Stock

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1,355

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Digiode

USA . 415 parts In-Stock

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415

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AZTECH Wire

Italy . 909 parts In-Stock

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$9.250

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909

$9.250

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IDEA Electronic Components Group

UK . 240 parts In-Stock

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$15.933

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$14.339

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240

$15.933

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$14.339

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MKK Technologies

India . 1,528 parts In-Stock

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$29.960

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1,528

$29.960

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DigiPath Technology Company

USA . 1,528 parts In-Stock

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$29.960

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$29.960

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Component Stockers USA

USA . 574 parts In-Stock

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$99.990

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574

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,748 parts In-Stock

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Microchip USA

USA . 4,399 parts In-Stock

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4,399

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Corphita

USA . 4,268 parts In-Stock

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4,268

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Vigor

Singapore . 2,938 parts In-Stock

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2,938

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Parana Technologies

USA . 2,137 parts In-Stock

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$19.050

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2,137

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$19.050

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Overview

Elevate your power management solutions with the L6611N from STMicroelectronics, a trusted leader in innovation. This versatile IC delivers reliability and efficiency across diverse applications, from consumer electronics to industrial systems. Its robust design ensures optimal performance while streamlining integration into your projects. Experience enhanced operational stability and lower energy costs, making the L6611N your go-to choice for superior power management.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space in circuit board layouts, allowing for efficient use of real estate in tight designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard in many applications, providing compatibility with common electronic systems.

Power Supplies (V): 5

This specification indicates that the product can function effectively with standard 5V power supplies, simplifying integration into existing designs.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enhancing the versatility and expandability of the circuit design.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy placement on PCBs, streamlining assembly processes in manufacturing environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides excellent solderability and corrosion resistance, ensuring reliable connections in the assembly.

Terminal Position: DUAL

Dual terminal positioning aids in better layout options on the PCB, improving circuit design flexibility.

Maximum Seated Height: 3.93 mm

The compact height of 3.93 mm ensures that the IC can fit into low-profile designs, conserving height in devices.

Width (mm): 7.62 mm

A width of 7.62 mm strikes a balance between footprint and functionality, allowing for efficient layout while accommodating necessary features.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is essential for managing power requirements in complex systems, enhancing overall performance.

Minimum Supply Voltage (Vsup): 4.5 V

Supporting a minimum supply voltage of 4.5V allows for use in a variety of applications with slightly varying power sources.

Maximum Supply Current (Isup): 7 mA

The maximum supply current of 7 mA indicates low power consumption, leading to longer battery life in portable applications.

No. of Channels: 5

Offering 5 channels makes this IC suitable for applications requiring multiple outputs and functionality without needing additional components.

Technology: BCDMOS

Utilization of BCDMOS technology allows for high performance and efficient power management, making it ideal for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical stability and ease of handling during assembly and soldering processes.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard, which ensures compatibility with most PCB layouts and simplifies the manufacturing process.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V provides flexibility for various power requirements and system designs.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization in voltage settings, making this IC adaptable to specific application needs.

Technical Specifications

Power Management ICs L6611N attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

L6611N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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