Loading...

L6615D013TR

STMicroelectronics

L6615D013TR by STMicroelectronics

STMicroelectronics L6615D013TR is a Power Management IC with 8 terminals, Vsup range of 2.7V to 22V, and BCDMOS technology. It operates in industrial temperature range (-40°C to 85°C) and supports power supply circuits. The package is small outline rectangular shape made of plastic/epoxy for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,807

-

-

-

-

Chip Stock

USA . 8,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,200

-

-

-

-

Digiode

USA . 4,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,732

-

-

-

-

Anansix

USA . 2,636 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,636

-

-

-

-

Bristol Electronics

USA . 413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

413

-

-

-

-

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

91

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,021 parts In-Stock

1+ parts

$1.380

100+ parts

-

1k+ parts

-

10k+ parts

-

2,021

$1.380

-

-

-

Ampacity Inc.

Singapore . 1,315 parts In-Stock

1+ parts

$6.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,315

$6.500

-

-

-

Microchip USA

USA . 1,993 parts In-Stock

1+ parts

$6.728

100+ parts

-

1k+ parts

-

10k+ parts

-

1,993

$6.728

-

-

-

IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$9.937

100+ parts

-

1k+ parts

$8.943

10k+ parts

-

708

$9.937

-

$8.943

-

AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$13.780

100+ parts

-

1k+ parts

-

10k+ parts

-

322

$13.780

-

-

-

MKK Technologies

India . 535 parts In-Stock

1+ parts

$18.686

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$18.686

-

-

-

DigiPath Technology Company

USA . 535 parts In-Stock

1+ parts

$18.686

100+ parts

-

1k+ parts

-

10k+ parts

-

535

$18.686

-

-

-

Kepictronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,493

-

-

-

-

Alle Elektronik GmbH

Germany . 4,995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,995

-

-

-

-

Corphita

USA . 4,735 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,735

-

-

-

-

Parana Technologies

USA . 1,476 parts In-Stock

1+ parts

-

100+ parts

$11.881

1k+ parts

-

10k+ parts

-

1,476

-

$11.881

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Experience the superior quality and reliability of STMicroelectronics with the L6615D013TR Power Management IC. This innovative product is designed to meet the demanding requirements of industrial applications, providing efficient power supply support circuitry in a compact small outline package. With a wide operating temperature range and adjustable threshold, this versatile IC offers unmatched value and performance for your power management needs. Trust STMicroelectronics to deliver cutting-edge solutions that drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the Power Management IC, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape is commonly used for IC packages, ensuring compatibility with standard mounting processes.

Nominal Supply Voltage (Vsup): 12 V

Suitable for applications requiring a stable 12V power supply.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

Compact size helps in reducing the overall footprint of the circuit, beneficial for space-constrained designs.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Can operate in harsh environmental conditions with low temperatures, ensuring reliability in various applications.

Maximum Seated Height: 1.75 mm

Low profile design enables installation in compact spaces and reduces the overall height of the system.

Width (mm): 3.9 mm

Compact width dimension aids in fitting the IC in tight spaces, facilitating efficient PCB layout.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, making it a reliable choice for power management applications.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a wide range of input voltage levels, providing flexibility in power supply requirements.

Length: 4.9 mm

Optimal length dimension for easy integration into electronic circuits with minimal space constraints.

Temperature Grade: INDUSTRIAL

Tailored for industrial environments, ensuring robust performance under demanding conditions.

Technology: BCDMOS

Utilizes BCDMOS technology for efficient power management and control, enhancing the overall performance of the IC.

Terminal Form: GULL WING

Gull wing terminals offer secure solder connections, improving reliability in PCB assembly.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy soldering and compatibility with standard PCB layouts.

Maximum Supply Voltage (Vsup): 22 V

Supports higher voltage levels, expanding the range of applications where the IC can be used.

Adjustable Threshold: YES

Offers the flexibility to adjust threshold levels, enabling customization for specific power management requirements.

Technical Specifications

Power Management ICs L6615D013TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

L6615D013TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10