Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STMicroelectronics L6615D013TR is a Power Management IC with 8 terminals, Vsup range of 2.7V to 22V, and BCDMOS technology. It operates in industrial temperature range (-40°C to 85°C) and supports power supply circuits. The package is small outline rectangular shape made of plastic/epoxy for surface mount applications.
Median Price
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6
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1k+
Vyrian
1+ parts
100+ parts
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Chip Stock
Digiode
Anansix
Bristol Electronics
Nova Conductors
Vigor
$1.380
Ampacity Inc.
$6.500
Microchip USA
$6.728
IDEA Electronic Components Group
$9.937
$8.943
AZTECH Wire
$13.780
MKK Technologies
$18.686
DigiPath Technology Company
Kepictronics
A-Z Elektronik GmbH
Alle Elektronik GmbH
Corphita
Parana Technologies
$11.881
Netroflash
This material provides good durability and protection for the Power Management IC, making it suitable for various industrial applications.
Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.
Rectangular shape is commonly used for IC packages, ensuring compatibility with standard mounting processes.
Suitable for applications requiring a stable 12V power supply.
Provides sufficient connectivity options for interfacing with other components in the system.
Compact size helps in reducing the overall footprint of the circuit, beneficial for space-constrained designs.
Withstands high temperatures, making it suitable for industrial applications where heat dissipation is a concern.
Can operate in harsh environmental conditions with low temperatures, ensuring reliability in various applications.
Low profile design enables installation in compact spaces and reduces the overall height of the system.
Compact width dimension aids in fitting the IC in tight spaces, facilitating efficient PCB layout.
Specifically designed to support power supply functions, making it a reliable choice for power management applications.
Supports a wide range of input voltage levels, providing flexibility in power supply requirements.
Optimal length dimension for easy integration into electronic circuits with minimal space constraints.
Tailored for industrial environments, ensuring robust performance under demanding conditions.
Utilizes BCDMOS technology for efficient power management and control, enhancing the overall performance of the IC.
Gull wing terminals offer secure solder connections, improving reliability in PCB assembly.
Standard terminal pitch for easy soldering and compatibility with standard PCB layouts.
Supports higher voltage levels, expanding the range of applications where the IC can be used.
Offers the flexibility to adjust threshold levels, enabling customization for specific power management requirements.
Power Management ICs L6615D013TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics
Adjustable Threshold:
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L6615D013TR Other Function Semiconductors trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Packaging - CRP/14/8400 20/Mar/2014 Moisture Barrier Bag 09/May/2016
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
LM358N
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LM358AN
National Semiconductor
1N4148WS
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
CR0805-FX-10R0ELF
Bourns
Bourns CR0805-FX-10R0ELF is a SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for applications requiring a temperature range of -55 to 155 °C, such as automotive electronics and industrial control systems.
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
08055C104KAT4A
KYOCERA AVX
08055C104KAT4A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance, rated for 50V. With X7R temperature characteristics and -55 to 125 °C operating range, it's ideal for SMT applications requiring compact size and high reliability. The wraparound terminals and multi-layer design make it suitable for various electronic circuits.
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LTC2955ITS8-1#TRMPBF
Linear Technology
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LTC4366CTS8-2#TRMPBF
Analog Devices
LTC4366CTS8-2#TRMPBF by Analog Devices is a Power Management IC with 7V nominal voltage, suitable for power supply support circuits. It features a small outline package, dual terminal position, and adjustable threshold. Operating temperature ranges from 0 to 70°C, making it ideal for commercial applications.
LTC4162EUFD-LADM#PBF
LTC4162EUFD-LADM#PBF by Analog Devices is a Power Management IC with 28 terminals, operating temperature range of -40 to 125 °C, and supply voltage range from 4.5V to 35V. It is ideal for automotive applications due to its compact chip carrier package and support for adjustable threshold voltages.
STMPS2141STR
STMPS2141STR by STMicroelectronics is a Power Management IC with 5V Nominal Voltage. It features Small Outline, Low Profile package style and operates b/w -40 to 85°C. Ideal for power supply support circuits in various applications.
LTC4412HVIS6#WTRMPBF
POWER SUPPLY SUPPORT CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
LM5060MM/NOPB
Power Management Circuits; No. of Terminals: 10; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Finish: MATTE TIN;
TPS2051BDR
TPS2051BDR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and small outline package style. It has a temperature range of -40°C to 85°C, making it suitable for industrial applications requiring power supply support circuits in compact designs.
TPS65217CRSLT
TPS65217CRSLT by Texas Instruments is a Power Management IC with 3.6V nominal voltage, 1.2A max output current, and 2550 kHz max switching frequency. It is ideal for industrial applications requiring efficient power supply support circuits in compact spaces.
INA219BIDR
INA219BIDR by Texas Instruments is a Power Management IC with 3.3V supply, operating from -40 to 125 °C. It has 8 terminals, small outline package style, and supports power supply circuits. Ideal for automotive applications due to its nickel palladium gold finish and compact size of 4.9mm x 3.9mm x 1.75mm.
TPS22950YBHR
TPS22950YBHR by Texas Instruments is a Power Management IC with 6 terminals, operating voltage range of 1.8V to 5.5V, and adjustable threshold voltage of 0.044V. It is designed for automotive applications, featuring a very thin profile package style suitable for surface mount assembly at temperatures ranging from -40°C to 125°C.
MCP130T-300I/TT
Microchip Technology
MCP130T-300I/TT by Microchip Technology is a Power Management IC with 3 terminals, operating voltage range of 1-5.5V, and industrial temperature grade. It is a surface-mount device in a small outline package suitable for power supply support circuits in various applications.
LTC4365CDDB-1#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
MAX17055ETB+T
Analog Devices' MAX17055ETB+T is a Power Management IC with 10 terminals, operating from -40 to 85°C. It supports supply voltages from 2.3V to 4.9V and has a small outline package style for industrial applications. The IC features matte tin terminal finish, dual position, and peak reflow temperature of 260°C.
LTC4364HDE-1#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;
FPF2163
Fairchild Semiconductor
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES;
TPS65023RSBT
TPS65023RSBT by Texas Instruments is a Power Management IC with 3.6V nominal voltage, 1.7A max output current, and 2550 kHz max switching frequency. It is used in industrial applications for power supply support circuits due to its compact chip carrier package style and adjustable threshold feature.
LTC4365ITS8#PBF
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MAX803SEXR+T
MAX803SEXR+T by Analog Devices is a power management IC with a nominal voltage of 3.3V. It has a small outline, thin profile package style and can operate in temperatures ranging from -40 to 125°C. This IC is commonly used as a power supply support circuit in automotive applications.
FPF2000
FPF2000 by Onsemi is a Power Management IC with 5 terminals, operating voltage range of 1.8V to 5.5V, and temperature grade of INDUSTRIAL. It comes in a small outline package with dual terminal position and gull wing form, suitable for power supply support circuits in industrial applications.
LM809M3-2.93/NOPB
LM809M3-2.93/NOPB by Texas Instruments is a Power Management IC with a nominal voltage of 3.3V and operating temperature range from -40 to 105°C. It features a small outline, thin profile package style, making it suitable for industrial applications requiring power supply support circuits. With surface mount capability and dual terminal position, this CMOS technology IC offers precise voltage regulation in compact designs.
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L6610D
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Qualification: Not Qualified;
L6610DTR
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Width (mm): 7.5 mm;
L6610N
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 24; Package Code: SDIP; Package Shape: RECTANGULAR; Surface Mount: NO; Technology: BCDMOS;
L6611D
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Package Equivalence Code: SOP20,.4;
L6611DTR
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: DUAL;
L6611DTRT
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 20; Package Shape: RECTANGULAR; Surface Mount: YES; Terminal Position: DUAL; Package Body Material: PLASTIC/EPOXY;
L6611N
POWER SUPPLY SUPPORT CIRCUIT; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO; Adjustable Threshold: YES;
L6615D
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
L6615DTR
L6615N
POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
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