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L6610DTR

STMicroelectronics

L6610DTR by STMicroelectronics

L6610DTR by STMicroelectronics is a versatile power management IC featuring a 5V nominal voltage, 6 channels, and a compact 24-terminal design. Ideal for power supply support circuits, it utilizes BCDMOS technology for efficient performance. Its small outline package ensures easy surface mounting in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,318 parts In-Stock

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5,318

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Digiode

USA . 1,547 parts In-Stock

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1,547

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Anansix

USA . 892 parts In-Stock

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892

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 671 parts In-Stock

1+ parts

$12.673

100+ parts

-

1k+ parts

$11.406

10k+ parts

-

671

$12.673

-

$11.406

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AZTECH Wire

Italy . 974 parts In-Stock

1+ parts

$19.270

100+ parts

-

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974

$19.270

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MKK Technologies

India . 280 parts In-Stock

1+ parts

$23.831

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280

$23.831

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DigiPath Technology Company

USA . 280 parts In-Stock

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$23.831

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280

$23.831

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QUARKTWIN TECHNOLOGY LTD

USA . 25,736 parts In-Stock

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25,736

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Corphita

USA . 3,704 parts In-Stock

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3,704

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Microchip USA

USA . 3,152 parts In-Stock

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3,152

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Vigor

Singapore . 1,880 parts In-Stock

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1,880

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Parana Technologies

USA . 230 parts In-Stock

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$15.152

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230

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$15.152

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Overview

Elevate your power management solutions with the L6610DTR from STMicroelectronics, a leader in innovative technology. This robust IC delivers exceptional performance and reliability, making it ideal for diverse applications like consumer electronics and industrial systems. With its advanced BCDMOS technology and compact design, it ensures efficient power supply while maximizing space. Trust STMicroelectronics for quality and gain the competitive edge you deserve!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and thermal stability, making the IC reliable in various operating environments.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, ideal for compact designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the circuit board, facilitating easier layout and manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is compatible with a wide range of applications and systems, ensuring versatility.

No. of Terminals: 24

With 24 terminals, this IC offers ample connectivity options for complex circuits, enhancing its functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps save board space while maintaining performance, suitable for tight applications.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent reliability and conductivity, reducing the risk of failure.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in PCB design and layout, simplifying assembly and reducing complexity.

Maximum Seated Height: 2.65 mm

A low maximum seated height is beneficial for low-profile applications, contributing to slimmer device designs.

Width: 7.5 mm

The compact width allows this IC to fit into space-constrained designs easily, making it suitable for modern electronics.

Length: 15.4 mm

The manageable length adds to its versatility in various applications while allowing for efficient heat dissipation.

No. of Channels: 6

Six channels enable multi-output capability, making it an ideal solution for complex power management requirements.

Technology: BCDMOS

Using BCDMOS technology combines high efficiency and excellent performance, ideal for battery-powered devices and power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering during assembly, reducing manufacturing costs and increasing reliability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compact design and ease of assembly, making it user-friendly for engineers.

Adjustable Threshold: YES

An adjustable threshold provides the flexibility to tailor the circuit's performance to specific application needs, enhancing adaptability.

Technical Specifications

Power Management ICs L6610DTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3/e4

Length:

15.4 mm

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

L6610DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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