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L6615DTR

STMicroelectronics

L6615DTR by STMicroelectronics

L6615DTR by STMicroelectronics is a versatile power management IC with a nominal voltage of 12V and operates in temperatures from -40 °C to 85 °C. It features an adjustable threshold and supports up to 22V, making it ideal for industrial applications. Its compact design (3.9mm x 4.9mm) ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,356 parts In-Stock

1+ parts

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100+ parts

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3,356

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Digiode

USA . 2,868 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,868

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Anansix

USA . 907 parts In-Stock

1+ parts

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907

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,820 parts In-Stock

1+ parts

$18.347

100+ parts

-

1k+ parts

$16.512

10k+ parts

-

1,820

$18.347

-

$16.512

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MKK Technologies

India . 678 parts In-Stock

1+ parts

$34.500

100+ parts

-

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678

$34.500

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DigiPath Technology Company

USA . 678 parts In-Stock

1+ parts

$34.500

100+ parts

-

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678

$34.500

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Corphita

USA . 3,664 parts In-Stock

1+ parts

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3,664

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Parana Technologies

USA . 1,024 parts In-Stock

1+ parts

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100+ parts

$21.936

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1,024

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$21.936

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Overview

Unlock the potential of your designs with the L6615DTR from STMicroelectronics, a leader in power management solutions. This compact, versatile IC delivers unmatched reliability and efficiency, tailored for industrial applications. With a wide operating temperature range and adjustable thresholds, it ensures optimal performance under various conditions. Choose STMicroelectronics for quality you can trust, and elevate your projects with the innovative power management capabilities of the L6615DTR!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and thermal stability, making the IC suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on printed circuit boards, contributing to overall product miniaturization.

Nominal Supply Voltage (Vsup): 12 V

With a nominal supply voltage of 12 V, the IC is ideal for standard power management applications.

Power Supplies (V): 12

Supports 12V power supplies, widely used in commercial and industrial electronic systems.

Number of Terminals: 8

The 8 terminals provide sufficient connectivity for versatile configurations while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

Small outline packaging enhances the product's versatility in space-constrained electronic designs.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliability in high-temperature environments, beneficial for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suited for extreme ambient conditions, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and provides excellent corrosion resistance for durability.

Terminal Position: DUAL

Dual terminal positioning supports efficient routing on PCBs, making it easier to design and manufacture circuits.

Maximum Seated Height: 1.75 mm

A low seated height allows for the design of thin profiles in electronic devices, an important factor in modern technology.

Width: 3.9 mm

Narrow width aids in space-efficient designs, accommodating dense layouts within electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed as a power supply support circuit, this IC enhances system reliability and efficiency.

Minimum Supply Voltage (Vsup): 2.7 V

With a minimum supply voltage of 2.7 V, this IC is flexible and can operate with a wide range of power supply levels.

Length: 4.9 mm

Compact length contributes to overall miniaturization, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring robustness and reliability in harsh environments.

Maximum Supply Current (Isup): 6 mA

A maximum supply current of 6 mA indicates low power consumption, which is beneficial for energy-efficient designs.

Technology: BCDMOS

The BCDMOS technology enables higher integration and efficiency, leading to smaller and more efficient power management solutions.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and assembly, improving manufacturing efficiency.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm simplifies PCB layout and compatibility with existing manufacturing processes.

Maximum Supply Voltage (Vsup): 22 V

Supports a wide maximum supply voltage of 22 V, making this IC adaptable for various power management needs.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization in applications requiring precise voltage regulation.

Technical Specifications

Power Management ICs L6615DTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

L6615DTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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