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HCF4503BM

STMicroelectronics

HCF4503BM by STMicroelectronics

HCF4503BM by STMicroelectronics is a 6-bit bus driver with 2 functions, operating at temperatures from -40 to 85 °C. It has a small outline package style, dual terminal position, and true output polarity. This CMOS technology device is ideal for industrial applications requiring 3-state output characteristics and low enable control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,476 parts In-Stock

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2,476

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Digiode

USA . 2,138 parts In-Stock

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2,138

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Vyrian

USA . 1,330 parts In-Stock

1+ parts

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1,330

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Inland Empire Components Inc.

USA . 15 parts In-Stock

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15

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Standard Data Resources

USA . 9 parts In-Stock

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9

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 215 parts In-Stock

1+ parts

$0.678

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215

$0.678

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Northwest PG Solutions

USA . 1,958 parts In-Stock

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$0.746

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1,958

$0.746

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Andel Nordic

Denmark . 486 parts In-Stock

1+ parts

$9.236

100+ parts

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$8.866

10k+ parts

$8.866

486

$9.236

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$8.866

$8.866

IDEA Electronic Components Group

UK . 2,155 parts In-Stock

1+ parts

$30.260

100+ parts

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$27.234

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2,155

$30.260

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$27.234

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MKK Technologies

India . 150 parts In-Stock

1+ parts

$56.901

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150

$56.901

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DigiPath Technology Company

USA . 150 parts In-Stock

1+ parts

$56.901

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150

$56.901

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Corphita

USA . 4,319 parts In-Stock

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4,319

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Parana Technologies

USA . 1,333 parts In-Stock

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$36.180

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1,333

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$36.180

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Overview

Experience unparalleled quality and reliability with the HCF4503BM by STMicroelectronics, a leading manufacturer in the industry. This bus driver and transceiver offers versatile applications and exceptional performance, making it an essential component for your projects. With its cutting-edge technology and durable construction, this product ensures seamless operation and efficient communication. Trust STMicroelectronics to deliver innovative solutions that bring value and benefits to your designs. Elevate your projects with the HCF4503BM and experience the advantages of superior craftsmanship and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the bus driver & transceivers.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 2

Having multiple functions in a single component enhances functionality and reduces the need for additional components in the system.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard PCB layouts and facilitates easy integration into electronic systems.

No. of Bits: 6

A 6-bit configuration allows for precise data transmission and control, making the product suitable for a wide range of applications.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) offers flexibility in system design and compatibility with different power sources.

No. of Terminals: 16

The extensive number of terminals provides ample connection points for interfacing with other devices and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is ideal for compact electronic designs with limited real estate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in demanding industrial environments without risk of overheating.

Output Characteristics: 3-STATE

The 3-state output feature allows for flexible signal control and management, enabling efficient communication between connected devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature rating ensures functionality even in harsh cold environments, making the product versatile and robust.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides reliable electrical connections and solderability for secure attachment to the PCB.

Terminal Position: DUAL

Dual terminal positions offer versatility in circuit board layout and enable flexibility in connection configurations for different system requirements.

Output Polarity: TRUE

The true output polarity ensures accurate data transmission and signal integrity, improving overall system performance and reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications guarantee reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product efficient and reliable in data transmission.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring secure electrical connections in the system.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact terminal placement on the PCB, optimizing space utilization and promoting efficient signal routing.

Control Type: ENABLE LOW

The enable low control type allows for easy activation and deactivation of the device, enhancing operational flexibility and control in the system.

Technical Specifications

Bus Driver & Transceivers HCF4503BM attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

6

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

HCF4503BM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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