Loading...

HCF4502BEY

STMicroelectronics

HCF4502BEY by STMicroelectronics

HCF4502BEY by STMicroelectronics is a 6-bit bus driver with 380 ns propagation delay at 5V. It features 3-STATE output characteristics and operates in a temperature range of -55 to 125 °C. Ideal for military applications requiring CMOS technology and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,253

-

-

-

-

Vyrian

USA . 1,742 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,742

-

-

-

-

Anansix

USA . 621 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

621

-

-

-

-

ECAB

Sweden . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 489 parts In-Stock

1+ parts

$2.773

100+ parts

-

1k+ parts

$2.662

10k+ parts

$2.662

489

$2.773

-

$2.662

$2.662

IDEA Electronic Components Group

UK . 1,268 parts In-Stock

1+ parts

$22.245

100+ parts

-

1k+ parts

$20.020

10k+ parts

-

1,268

$22.245

-

$20.020

-

MKK Technologies

India . 1,930 parts In-Stock

1+ parts

$41.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1,930

$41.830

-

-

-

DigiPath Technology Company

USA . 1,930 parts In-Stock

1+ parts

$41.830

100+ parts

-

1k+ parts

-

10k+ parts

-

1,930

$41.830

-

-

-

Corphita

USA . 4,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,630

-

-

-

-

Northwest PG Solutions

USA . 1,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,464

-

-

-

-

Native Components

USA . 626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

626

-

-

-

-

Assy Fe

Spain . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

312

-

-

-

-

Parana Technologies

USA . 273 parts In-Stock

1+ parts

-

100+ parts

$26.597

1k+ parts

-

10k+ parts

-

273

-

$26.597

-

-

Overview

Unlock seamless communication and data transfer with the HCF4502BEY by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers high-quality bus drivers & transceivers that guarantee reliability and performance. Whether you're looking to optimize your industrial automation systems or enhance your automotive electronics, this product offers unparalleled value with its efficient operation and versatile applications. Stay ahead of the curve with the HCF4502BEY and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it suitable for use in various environments.

Propagation Delay At Nominal Supply: 380 ns

With a low propagation delay at nominal supply voltage, this product ensures fast signal transmission, making it efficient for bus driver and transceiver applications.

No. of Bits: 6

The 6-bit configuration allows for a wider range of data transmission, providing flexibility and compatibility with different systems.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage ensures compatibility with most systems and provides a stable power source for reliable operation.

Output Characteristics: 3-STATE

The 3-state output characteristics offer flexibility in controlling the output signal, allowing for high impedance when not in use, reducing interference in the system.

Temperature Grade: MILITARY

The military-grade temperature range ensures the product's reliability and performance in various harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Bus Driver & Transceivers HCF4502BEY attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH COMMON INHIBIT FOR ALL BITS

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

380 ns

Propagation Delay (tpd):

380 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HCF4502BEY Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15