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HCF4503M013TR

STMicroelectronics

HCF4503M013TR by STMicroelectronics

HCF4503M013TR by STMicroelectronics is a 6-bit bus driver with a propagation delay of 150 ns, operating b/w 3-15 V. It features a compact SO package and supports dual ports with true output polarity. Ideal for industrial applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,475 parts In-Stock

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2,475

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Vyrian

USA . 1,661 parts In-Stock

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1,661

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Anansix

USA . 1,101 parts In-Stock

1+ parts

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1,101

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LIBRA Elektronik GmbH

Germany . 250 parts In-Stock

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250

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Distributors (Availability)

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$7.719

100+ parts

-

1k+ parts

$7.410

10k+ parts

$7.410

50

$7.719

-

$7.410

$7.410

IDEA Electronic Components Group

UK . 2,240 parts In-Stock

1+ parts

$23.905

100+ parts

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$21.515

10k+ parts

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2,240

$23.905

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$21.515

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MKK Technologies

India . 794 parts In-Stock

1+ parts

$44.952

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794

$44.952

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DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

$44.952

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794

$44.952

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Corphita

USA . 2,762 parts In-Stock

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2,762

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Northwest PG Solutions

USA . 746 parts In-Stock

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$4.177

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746

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$4.177

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Parana Technologies

USA . 323 parts In-Stock

1+ parts

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100+ parts

$28.582

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323

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$28.582

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Native Components

USA . 224 parts In-Stock

1+ parts

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$4.134

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224

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$4.134

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Overview

Unlock unparalleled performance with the HCF4503M013TR from STMicroelectronics—a leader in innovative electronic solutions. This versatile bus driver offers exceptional reliability, making it ideal for a range of applications from industrial controls to consumer electronics. With its compact design and efficient power handling capabilities, you can enhance circuit efficiency while enjoying optimal durability and minimal delays. Choose STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protects the internal components from environmental factors, making this product suitable for various applications.

Propagation Delay At Nominal Supply: 150 ns

With a moderate propagation delay, this device strikes a balance between speed and stability, making it ideal for applications that require reliable data transmission.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient circuit board real estate utilization, facilitating easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, making it easier to lay out in tight configurations while maintaining performance.

No. of Bits: 6

The 6-bit configuration enables the handling of multiple data lines simultaneously, enhancing performance in applications that need to transfer data efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this device compatible with a wide range of other components in typical digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures minimal signal degradation, crucial for maintaining integrity when driving loads in complex circuits.

Power Supplies (V): 5/15

The versatility in power supply options allows for more flexible applications, accommodating various system designs and power requirements.

No. of Terminals: 14

With 14 terminals, this product offers comprehensive connectivity options, enabling complex signal routing and interfacing in electronic designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, allowing for higher density designs.

Propagation Delay (tpd): 150 ns

Consistent propagation delay enhances reliability in timing-critical applications, ensuring synchronized operations within digital systems.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures functionality in high-temperature environments, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output capabilities allow for greater flexibility in bus-oriented applications, enabling multiple devices to share common data lines.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is ideal for harsh environments, providing reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures superior conductivity and resistance to corrosion, enhancing reliability and longevity in connections.

Terminal Position: DUAL

Dual terminal positioning facilitates easier mounting and integration on PCBs, contributing to design efficiency.

No. of Ports: 2

Having 2 ports allows for efficient communication and data transfer between multiple devices, offering flexibility in system configurations.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm aids in minimizing the overall height of assembled components, beneficial for slim design requirements.

Width: 3.9 mm

A compact width of 3.9 mm allows for dense packing of components on PCBs, supporting space-saving designs.

Output Polarity: TRUE

True output polarity indicates that the binary signaling is maintained, ensuring consistent behavior across interfaced devices.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V allows compatibility with low-power applications, improving energy efficiency.

Length: 8.65 mm

A length of 8.65 mm is suited for various PCB layouts, allowing ease of integration without compromising on functionality.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product is built to endure demanding conditions, ensuring reliability in industrial applications.

Technology: CMOS

The CMOS technology used provides low power consumption along with high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form aids in easy soldering and assembly, enhancing the overall manufacturability of the device.

Packing Method: TR

The TR (tape and reel) packing method ensures ease of handling and automated assembly, increasing efficiency in manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, simplifying the design and assembly of PCBs.

Control Type: ENABLE LOW

Low enable control type ensures devices remain in a low-power state until activated, optimizing power usage in digital systems.

Maximum Supply Voltage (Vsup): 15 V

The ability to operate at a maximum supply voltage of 15V allows for robust performance in more demanding signal applications.

Technical Specifications

Bus Driver & Transceivers HCF4503M013TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4503M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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