Loading...

HCF4503BC1

STMicroelectronics

HCF4503BC1 by STMicroelectronics

HCF4503BC1 by STMicroelectronics is a 6-bit bus driver with 20 terminals and 110 ns propagation delay. It operates in industrial temperature range (-40 to 85 °C) and supports TRUE output polarity. Ideal for applications requiring CMOS technology, such as data communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,977

-

-

-

-

Anansix

USA . 1,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,692

-

-

-

-

Vyrian

USA . 655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

655

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 500 parts In-Stock

1+ parts

$8.513

100+ parts

-

1k+ parts

$8.173

10k+ parts

$8.173

500

$8.513

-

$8.173

$8.173

IDEA Electronic Components Group

UK . 1,592 parts In-Stock

1+ parts

$22.248

100+ parts

-

1k+ parts

$20.024

10k+ parts

-

1,592

$22.248

-

$20.024

-

MKK Technologies

India . 1,326 parts In-Stock

1+ parts

$41.837

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$41.837

-

-

-

DigiPath Technology Company

USA . 1,326 parts In-Stock

1+ parts

$41.837

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

$41.837

-

-

-

Corphita

USA . 2,013 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,013

-

-

-

-

Parana Technologies

USA . 1,292 parts In-Stock

1+ parts

-

100+ parts

$26.601

1k+ parts

-

10k+ parts

-

1,292

-

$26.601

-

-

Northwest PG Solutions

USA . 518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

518

-

-

-

-

Native Components

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

420

-

-

-

-

Overview

Upgrade your electronic projects with the HCF4503BC1 by STMicroelectronics, a reliable and high-quality bus driver & transceiver. Manufactured by industry leader STMicroelectronics, this product offers exceptional performance and durability for various applications. With its advanced technology and industrial-grade temperature grade, the HCF4503BC1 ensures optimal functionality even in challenging environments. Experience seamless operation and efficient communication between multiple devices with this versatile chip carrier package. Trust STMicroelectronics to deliver cutting-edge solutions that enhance your projects and exceed your expectations. Choose the HCF4503BC1 for unmatched value and reliability in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for use in bus driver and transceiver applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

No. of Bits: 6

The 6 bits provide sufficient data processing capabilities for bus driver and transceiver functions, ensuring reliable performance.

Propagation Delay (tpd): 110 ns

The low propagation delay of 110 ns ensures fast data transmission and response times, making the product suitable for high-speed communication applications.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and reliable operation, making it energy-efficient and cost-effective for bus driver and transceiver operations.

Technical Specifications

Bus Driver & Transceivers HCF4503BC1 attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

ONE FUNCTION WITH TWO BITS

Family:

4000/14000/40000

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

HCF4503BC1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15