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HCF4503BE

STMicroelectronics

HCF4503BE by STMicroelectronics

HCF4503BE by STMicroelectronics is a CMOS bus driver with 6 bits, 2 functions, and 16 terminals. It operates b/w -40 to 85 °C, with power supplies of 5/15V. Ideal for industrial applications requiring true output polarity and enable low control type.

Median Price

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Lifecycle Status

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Digiode

USA . 1,654 parts In-Stock

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Anansix

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ECAB

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ComSIT Distribution GmbH

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Goldney Electronics S.L.

Spain . 300 parts In-Stock

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Vyrian

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Resion

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J2 Sourcing AB

Sweden . 120 parts In-Stock

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LittleDiode

UK . 89 parts In-Stock

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Pegasus Components GmbH

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ACDS - Activité Composants Distribution Service

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Ack Elektronik San.Tic.Ltd.Sti

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GES GmbH

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Prism Electronics

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Microfarads

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Bristol Electronics

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Mil-Aero Solutions, Inc.

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Andel Nordic

Denmark . 240 parts In-Stock

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$2.093

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$2.093

IDEA Electronic Components Group

UK . 2,209 parts In-Stock

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$16.744

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MKK Technologies

India . 1,396 parts In-Stock

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DigiPath Technology Company

USA . 1,396 parts In-Stock

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Northwest PG Solutions

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Parana Technologies

USA . 2,368 parts In-Stock

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Corphita

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Native Components

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Kepictronics

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Futuretech Components

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Assy Fe

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FE SAS

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the unmatched quality and reliability of STMicroelectronics with the HCF4503BE Bus Driver & Transceivers. This versatile product offers 2 functions in a compact rectangular package, making it ideal for a wide range of applications. With a temperature range of -40 to 85 °C and true output polarity, this industrial-grade technology provides customers with peace of mind knowing their systems are in good hands. Trust in STMicroelectronics to deliver superior performance and value with the HCF4503BE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, suitable for use in various environments.

No. of Functions: 2

Having 2 functions allows the product to perform multiple tasks efficiently, increasing its utility.

Package Shape: RECTANGULAR

RECTANGULAR shape helps in easy assembly and fitting of the product in different systems.

No. of Bits: 6

6 bits provide sufficient range for data transmission and processing, making the product versatile.

Power Supplies (V): 5/15

Supporting both 5V and 15V power supplies ensures compatibility with a wide range of systems and applications.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration of the product with other components.

Package Style (Meter): IN-LINE

IN-LINE package style facilitates easy installation and space-saving design.

Maximum Operating Temperature: 85 °C

Operating at 85 °C ensures the product can withstand high temperatures in industrial environments.

Output Characteristics: 3-STATE

3-STATE output characteristics provide flexibility in controlling the output signals, enhancing the product's functionality.

Minimum Operating Temperature: -40 °C

Operating at -40 °C allows the product to function in cold environments without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good conductivity and reliability in signal transmission.

Terminal Position: DUAL

DUAL terminal position offers flexibility in connecting the product to different systems and devices.

Output Polarity: TRUE

TRUE output polarity ensures accurate signal transmission and processing, improving the product's performance.

Temperature Grade: INDUSTRIAL

INDUSTRIAL temperature grade makes the product suitable for rugged industrial applications and environments.

Technology: CMOS

CMOS technology provides low power consumption and high reliability, making the product energy-efficient and durable.

Terminal Form: THROUGH-HOLE

THROUGH-HOLE terminal form offers easy soldering and connection, enhancing the product's usability and reliability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy placement and soldering of the product on PCBs, ensuring efficient assembly.

Control Type: ENABLE LOW

ENABLE LOW control type ensures easy and precise control over the product's functions and operations.

Technical Specifications

Bus Driver & Transceivers HCF4503BE attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Logic IC Type:

No. of Bits:

6

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

HCF4503BE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-444-4311, 5962144444311

NIIN

144444311

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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