Loading...

HCF4502M013TR

STMicroelectronics

HCF4502M013TR by STMicroelectronics

HCF4502M013TR by STMicroelectronics is a 6-bit CMOS bus driver with a propagation delay of 380 ns, operating b/w 3-20 V. It features a compact SO package and supports dual ports with inverted output. Ideal for military applications due to its wide temp range (-55 °C to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,331

-

-

-

-

Anansix

USA . 2,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,328

-

-

-

-

Vyrian

USA . 914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

914

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 145 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

145

$1.730

-

-

-

Northwest PG Solutions

USA . 641 parts In-Stock

1+ parts

$1.903

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$1.903

-

-

-

IDEA Electronic Components Group

UK . 795 parts In-Stock

1+ parts

$10.673

100+ parts

-

1k+ parts

$9.606

10k+ parts

-

795

$10.673

-

$9.606

-

MKK Technologies

India . 2,060 parts In-Stock

1+ parts

$20.070

100+ parts

-

1k+ parts

-

10k+ parts

-

2,060

$20.070

-

-

-

DigiPath Technology Company

USA . 2,060 parts In-Stock

1+ parts

$20.070

100+ parts

-

1k+ parts

-

10k+ parts

-

2,060

$20.070

-

-

-

Corphita

USA . 2,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,999

-

-

-

-

Parana Technologies

USA . 1,325 parts In-Stock

1+ parts

-

100+ parts

$12.761

1k+ parts

-

10k+ parts

-

1,325

-

$12.761

-

-

Overview

Unlock seamless data communication with the HCF4502M013TR from STMicroelectronics, a leader in high-performance semiconductor solutions. This versatile 6-bit bus driver boasts a compact design and exceptional reliability, perfect for both military and industrial applications. With superior temperature resilience and low propagation delay, it ensures optimal signal integrity, empowering your designs to achieve peak performance while reducing downtime and maintenance costs. Experience the difference with STMicroelectronics, where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of Plastic/Epoxy materials in the package enhances durability and protects the internal components, making it suitable for various environments.

Propagation Delay At Nominal Supply: 380 ns

With a propagation delay of 380 ns, this device ensures fast signal transmission, which is crucial for high-speed applications.

Surface Mount: YES

Being surface mount allows for easier integration into modern PCB designs and saves space, making it ideal for compact electronics.

Package Shape: RECTANGULAR

The rectangular shape provides efficient use of PCB real estate, accommodating more components within a smaller area.

No. of Bits: 6

A 6-bit configuration allows for versatile data handling, making this bus driver suitable for various digital applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard logic levels used in many electronic circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF contributes to stable performance in bus driving applications, ensuring reliable signal integrity.

Power Supplies (V): 5/15

Supporting dual power supplies of 5V and 15V offers flexibility for different circuit configurations and performance metrics.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for various devices, enabling multiple line connections in a single package.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements and enhances the density of PCB layouts.

Propagation Delay (tpd): 380 ns

Identical to the nominal supply specification, this consistent propagation delay supports reliable performance across different supply conditions.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C allows the device to function reliably in high-temperature environments, suitable for rugged applications.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for bus sharing among multiple devices, enabling efficient data communication without conflict.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product is suitable for extreme conditions, making it ideal for military and aerospace applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity and reliability of connections.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible PCB layout options, optimizing space and enhancing manufacturability.

No. of Ports: 2

Having 2 ports enables this bus driver to interface with multiple devices, enhancing versatility in communication systems.

Maximum Seated Height: 1.75 mm

With a maximum seated height of just 1.75 mm, this component is low-profile, aiding in designing compact electronic assemblies.

Width: 3.9 mm

The compact width of 3.9 mm allows for efficient use of PCB space, essential in modern electronics design where space is premium.

Output Polarity: INVERTED

An inverted output polarity can simplify certain circuit designs, enhancing flexibility in integration with other components.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3V provides versatility in powering, suitable for battery-operated devices.

Length: 9.9 mm

The length of 9.9 mm contributes to the overall compact design, making this device easy to fit into constrained spaces on PCBs.

Temperature Grade: MILITARY

Being rated for military temperature grade ensures reliability under extreme conditions, making it a trusted choice for defense applications.

Technology: CMOS

The CMOS technology utilized in this product allows for low power consumption while maintaining high-speed data processing capabilities.

Terminal Form: GULL WING

The gull wing terminal form increases ease of soldering and enhances mechanical stability during operation.

Packing Method: TR

The Tape and Reel (TR) packing method simplifies handling during assembly and is efficient for high-volume production runs.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard spacing in designs, ensuring compatibility with a wide range of PCB layouts.

Control Type: ENABLE LOW

The enable low control type enables straightforward control logic for activating the bus driver, simplifying design integration.

Maximum Supply Voltage (Vsup): 20 V

With a maximum supply voltage of 20V, this product provides flexibility for applications that require higher voltage operation.

Technical Specifications

Bus Driver & Transceivers HCF4502M013TR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

6

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

380 ns

Propagation Delay (tpd):

380 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4502M013TR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15